公开(公告)号：US20200342801A1

公开(公告)日：2020-10-29

申请号：US16395247

申请日：2019-04-26

Applicant: NOVATEK Microelectronics Corp.

Inventor： Yen-Tao Liao ,  Hung-Hsiang Chen ,  Jen-Ta Yang ,  Yi-Wei Lin ,  Huang-Chin Tang

IPC: G09G3/20

Abstract: The present invention discloses a driving method for a source driver, for driving a source line of a display panel. The driving method includes the steps of: driving the source line with a first voltage or a second voltage smaller than the first voltage in a first driving cycle; driving the source line with the first voltage in a second driving cycle next to the first driving cycle when the source line is driven with the first voltage in the first driving cycle; and driving the source line with an overdrive voltage in the second driving cycle when the source line is driven with the second voltage in the first driving cycle. The first voltage is a normal high voltage of the display panel, and the overdrive voltage is greater than the normal high voltage.

公开(公告)号：US20200210015A1

公开(公告)日：2020-07-02

申请号：US16237754

申请日：2019-01-02

Applicant: NOVATEK Microelectronics Corp.

Inventor： Huan-Teng Cheng ,  Huang-Chin Tang

IPC: G06F3/041 ,  G09G5/12

Abstract: A method of controlling timing for a touch and display driver system includes the steps of: receiving an external signal; generating a plurality of time units each having a display period and a touch period; generating an internal signal for controlling a display operation in the display period; and synchronizing the internal signal with the external signal for a time unit among the plurality of time units at a time point different from at least one of the start of the time unit and the end of the time unit.

公开(公告)号：US10699635B2

公开(公告)日：2020-06-30

申请号：US16045757

申请日：2018-07-26

Applicant: Novatek Microelectronics Corp.

Inventor： Ko-Fang Chen ,  Huang-Chin Tang

IPC: G09G3/3233

Abstract: A power management device including a power management circuit is provided. The power management circuit is configured to output a first power signal and a second power signal to a pixel circuit of a display panel. The pixel circuit includes an organic light-emitting diode. The organic light-emitting diode includes an anode terminal and a cathode terminal. The anode terminal is coupled to the first power signal. The cathode terminal is coupled to the second power signal. The second power signal is an alternating-current voltage. In addition, a pixel circuit of a display panel, and a power management method for the pixel circuit of the display panel are also provided.

公开(公告)号：US09960151B2

公开(公告)日：2018-05-01

申请号：US15226905

申请日：2016-08-02

Applicant: Novatek Microelectronics Corp.

Inventor： Chieh-Hsiang Chang ,  Wen-Ching Huang ,  Kuo-Yuan Lu ,  Huang-Chin Tang

IPC: G02F1/1345 ,  H01L25/16 ,  H01L23/498 ,  H01L23/00 ,  H01L23/552 ,  H01L23/373

CPC classification number: H01L25/167 ,  G02F1/13452 ,  G02F1/13458 ,  H01L23/373 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/552 ,  H01L23/562 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/1403 ,  H01L2224/16165

Abstract: A semiconductor device includes a chip, a plurality of first bumps, and a plurality of second bumps. The chip includes an active surface. The first bumps are disposed on the active surface along a first direction. The second bumps are disposed on the active surface along a second direction parallel to the first direction, wherein one of the second bumps is located between adjacent two of the first bumps, a closest distance from the second bumps to the fan-out region is smaller than a closest distance from the first bumps to the fan-out region, and a first width of one of the first bumps is larger than a second width of one of the second bumps.

公开(公告)号：US20180040596A1

公开(公告)日：2018-02-08

申请号：US15226905

申请日：2016-08-02

Applicant: Novatek Microelectronics Corp.

Inventor： Chieh-Hsiang Chang ,  Wen-Ching Huang ,  Kuo-Yuan Lu ,  Huang-Chin Tang

IPC: H01L25/16 ,  H01L23/373 ,  H01L23/552 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L25/167 ,  G02F1/13452 ,  G02F1/13458 ,  H01L23/373 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/552 ,  H01L23/562 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/1403 ,  H01L2224/16165

Abstract: A semiconductor device includes a chip, a plurality of first bumps, and a plurality of second bumps. The chip includes an active surface. The first bumps are disposed on the active surface along a first direction. The second bumps are disposed on the active surface along a second direction parallel to the first direction, wherein one of the second bumps is located between adjacent two of the first bumps, a closest distance from the second bumps to the fan-out region is smaller than a closest distance from the first bumps to the fan-out region, and a first width of one of the first bumps is larger than a second width of one of the second bumps.