公开(公告)号：US20070007526A1

公开(公告)日：2007-01-11

申请号：US11481974

申请日：2006-07-07

Applicant: Saori Sugiyama ,  Yasuko Gotoh

Inventor： Saori Sugiyama ,  Yasuko Gotoh

IPC: H01L29/04 ,  G02F1/1345

CPC classification number: G02F1/1345 ,  H05K1/0306 ,  H05K1/117 ,  H05K3/244 ,  H05K3/361 ,  H05K2201/0326 ,  H05K2201/0969 ,  Y10T29/49121

Abstract: The proceeding of peeling of a conductive layer in the vicinity of terminals is prevented. A display panel includes a conductive layer extending to the outside of terminals, and the conductive layer has slits extending in directions from one end face to the other end face alternately at two end faces along the extending direction of the conductive layer.

Abstract translation: 阻止在端子附近剥离导电层的过程。 显示面板包括延伸到端子外部的导电层，并且导电层具有在沿着导电层的延伸方向的两个端面处交替地从一个端面到另一个端面的方向上延伸的狭缝。

公开(公告)号：US20060165877A1

公开(公告)日：2006-07-27

申请号：US11315200

申请日：2005-12-23

Applicant: Hiroshi Yanagimoto ,  Hidemi Nawafune ,  Kensuke Akamatsu

Inventor： Hiroshi Yanagimoto ,  Hidemi Nawafune ,  Kensuke Akamatsu

IPC: B05D3/00 ,  B05D5/12

CPC classification number: C23C18/06 ,  C23C18/04 ,  C23C18/08 ,  C23C18/1216 ,  C23C18/1245 ,  C23C18/1275 ,  C23C18/1295 ,  H05K1/0346 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/184 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2201/0326 ,  H05K2203/0793 ,  H05K2203/1157 ,  H05K2203/1163

Abstract: The present invention provides 1. A method for forming an inorganic thin film pattern on a polyimide resin, which has: (1) a step of forming an alkali-resistant protective film having a thickness of 0.01 to 10 μm on a surface of a polyimide resin; (2) a step of removing the alkali-resistant protective film and a superficial portion of the polyimide resin at the site where an inorganic thin film pattern is formed to form a concave part; (3) a step of contacting an alkaline aqueous solution to the polyimide resin in the concave part to cleave an imide ring of the polyimide resin so as to produce a carboxyl group whereby a polyimide resin having the carboxyl group is formed; (4) a step of contacting a solution containing a metal ion to the polyimide resin having the carboxyl group so as to produce a metal salt of the carboxyl group; and (5) a step of separating the metal salt as a metal, a metal oxide or a semiconductor on the surface of the polyimide resin so as to form the inorganic thin film pattern.

Abstract translation: 本发明提供一种在聚酰亚胺树脂上形成无机薄膜图案的方法，其特征在于：（1）在聚酰亚胺的表面上形成厚度为0.01〜10μm的耐碱性保护膜的工序 树脂; （2）在形成无机薄膜图案的部位除去耐碱性保护膜和聚酰亚胺树脂的表面部分以形成凹部的步骤; （3）将碱性水溶液与凹部中的聚酰亚胺树脂接触以将聚酰亚胺树脂的酰亚胺环切断以产生羧基，从而形成具有羧基的聚酰亚胺树脂的工序; （4）使含有金属离子的溶液与具有羧基的聚酰亚胺树脂接触以产生羧基金属盐的步骤; 和（5）在聚酰亚胺树脂的表面上分离作为金属的金属盐，金属氧化物或半导体以形成无机薄膜图案的步骤。

公开(公告)号：US20050170198A1

公开(公告)日：2005-08-04

申请号：US11042621

申请日：2005-01-24

Applicant: Masayuki Aida

Inventor： Masayuki Aida

IPC: B32B9/00 ,  B32B15/08 ,  B32B15/088 ,  C23C14/06 ,  C23C14/08 ,  C23C14/10 ,  C23C14/20 ,  C25D5/56 ,  H01L21/60 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38

CPC classification number: H05K3/388 ,  C23C14/08 ,  C23C14/205 ,  C25D5/56 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0326 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/26 ,  Y10T428/31681

Abstract: A metallized polyimide film includes: a polyimide film including a first side and a second side; an intermediate layer that contains at least one element selected from the group consisting of Mo, Cr, Ni, Si, Fe, and Al, a deposition amount of the at least one element being between 0.3 and 15 mg/m2; and a conductive layer that is made of one of copper and a copper alloy formed on the intermediate layer; an oxygen and water barrier film that is made of at least one member selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, tin oxide, indium oxide, magnesium fluoride, magnesium oxide, aluminum, and indium tin oxide (ITO), and that has a thickness of between 5 and 300 nm formed on the second side of the polyimide film.

Abstract translation: 金属化聚酰亚胺膜包括：包含第一侧和第二侧的聚酰亚胺膜; 包含选自Mo，Cr，Ni，Si，Fe和Al中的至少一种元素的中间层，所述至少一种元素的沉积量在0.3至15mg / m 2之间， / SUP>; 以及由中间层上形成的铜和铜合金之一构成的导电层; 由选自氧化硅，氧化铝，氧化钛，氧化锡，氧化铟，氟化镁，氧化镁，铝和氧化铟锡（ITO）中的至少一种构成的氧和水阻隔膜， ，并且在聚酰亚胺膜的第二面上形成有5nm至300nm的厚度。

公开(公告)号：US20030202151A1

公开(公告)日：2003-10-30

申请号：US10441407

申请日：2003-05-20

Inventor： Shoji Hinata

IPC: G02F001/1345

CPC classification number: H05K3/24 ,  G02F1/133555 ,  G02F1/136286 ,  G02F2001/13629 ,  H05K3/064 ,  H05K3/244 ,  H05K2201/0326 ,  H05K2203/0361

Abstract: A panel substrate includes a substrate, a plurality of display electrodes running in parallel on the substrate, and a plurality of wirings respectively continuous from the display electrodes formed on the substrate. The display electrodes and the wirings respectively have a bilayer structure of a transparent conductive layer and a metal layer. The metal layer of the display electrode is substantially narrower in width than the width of the transparent conductive layer.

Abstract translation: 面板基板包括基板，在基板上平行延伸的多个显示电极以及从形成在基板上的显示电极分别连续的多个布线。 显示电极和布线分别具有透明导电层和金属层的双层结构。 显示电极的金属层的宽度比透明导电层的宽度窄得多。

公开(公告)号：US20030151032A1

公开(公告)日：2003-08-14

申请号：US10240266

申请日：2002-09-30

Inventor： Nobuyuki Ito ,  Hideaki Masuko ,  Satomi Hasegawa ,  Nakaatsu Yoshimura

IPC: H01B003/24

CPC classification number: H01L24/49 ,  C08K9/02 ,  H01L23/145 ,  H01L23/49527 ,  H01L23/49589 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/135 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and (B) a resin component constituted of at least one of a polymerizable compound and a polymer. In addition, another dielectric-forming composition according to the invention is characterized by containing: ultrafine particle-resin composite particles composed of (J) inorganic ultra fine particles with the average particle size of 0.1 nullm or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and inorganic particles with the average particle size of 0.1 to 2 nullm and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.

Abstract translation: 根据本发明的电介质形成组合物的特征在于：电介质复合颗粒，其中介电常数为30或更大的无机颗粒的部分或全部表面涂覆有导电金属或其化合物，或导电 有机化合物或导电无机材料; 和（B）由聚合性化合物和聚合物中的至少一种构成的树脂成分。 此外，根据本发明的另一种电介质形成组合物的特征在于包含：由（J）平均粒径为0.1μm以下的（J）无机超细粒子构成的超微粒子 - 树脂复合粒子，（B）树脂成分 由可聚合化合物和聚合物中的至少一种构成，其中无机超细颗粒（J）的一部分或全部表面涂覆有树脂组分（B），超细颗粒 - 树脂复合颗粒含有20％ 重量以上的无机超微粒子（J）; 和平均粒径为0.1〜2μm，介电常数为30以上的无机粒子，或其中导电性金属或其化合物或导电性有机化合物或导电性无机材料沉积在该部分上的无机复合粒子，或 无机颗粒的所有表面。

公开(公告)号：US20030089520A1

公开(公告)日：2003-05-15

申请号：US10289178

申请日：2002-11-07

Inventor： Yasunari Ooyabu ,  Takashi Oda ,  Shinichi Oda

IPC: H05K001/03

CPC classification number: H05K1/0259 ,  H05K3/28 ,  H05K2201/0317 ,  H05K2201/0326

Abstract: A wired circuit board having a semi-conducting layer which has excellent chemical resistance, such as acid resistance and alkali resistance; provides no possibility of minute particles being mixed into parts mounted on the wired circuit board; and yet has excellent surface resistivity against electrostatic damage. In the wired circuit board having a conductive layer formed on one side of a base insulating layer in the form of a predetermined wired circuit pattern and a cover insulating layer formed on the conductive layer, a base-side semi-conducting layer and a cover-side semi-conducting layer, which comprise metal oxide, metal nitride or metal carbide, are formed on the other side of the base insulating layer and the cover insulating layer, respectively, by physical vapor deposition (PVD) or preferably by sputtering.

Abstract translation: 具有耐酸性和耐碱性优异的耐化学性的半导体层的布线电路基板; 不会将微小颗粒混入安装在布线电路板上的部件中; 并且具有优异的抗静电损伤的表面电阻率。 在具有形成在预定布线电路图案形式的基底绝缘层的一侧上的导电层和形成在导电层上的覆盖绝缘层的布线电路板中，基底侧半导电层和覆盖层 通过物理气相沉积（PVD）或优选通过溅射分别在基底绝缘层和覆盖绝缘层的另一侧上形成包括金属氧化物，金属氮化物或金属碳化物的侧面半导电层。

公开(公告)号：US06476899B2

公开(公告)日：2002-11-05

申请号：US09955352

申请日：2001-09-18

Applicant: Nobuhisa Ishida ,  Norihiro Agawa ,  Takamitsu Kakinaga

Inventor： Nobuhisa Ishida ,  Norihiro Agawa ,  Takamitsu Kakinaga

IPC: G02F11345

CPC classification number: G02F1/133305 ,  G02F1/1345 ,  H05K3/24 ,  H05K2201/0326

Abstract: Disclosed is a display panel including: a display layer for performing display; a flexible substrate for holding or carrying the display layer; a transparent electrode formed on the flexible substrate; and a metal film formed on the flexible substrate, electrically connected to the transparent electrode and made of a material different from that of the transparent electrode. Also disclosed is a method of producing a display panel including the steps of: forming a transparent electrode of a predetermined form on a flexible substrate; forming a metal film of a predetermined form on the flexible substrate so that the metal film is electrically connected to the transparent electrode, the metal film being made of a material different from that of the transparent electrode; and holding or carrying a display layer with the flexible substrate carrying the transparent electrode and the metal film, the display layer being provided for performing display.

Abstract translation: 公开了一种显示面板，包括：显示层，用于执行显示; 用于保持或承载显示层的柔性基板; 形成在柔性基板上的透明电极; 以及形成在柔性基板上的金属膜，电连接到透明电极并且由不同于透明电极的材料制成。还公开了一种制造显示面板的方法，包括以下步骤：形成透明电极的透明电极 柔性基板上的预定形式; 在所述柔性基板上形成预定形式的金属膜，使得所述金属膜与所述透明电极电连接，所述金属膜由与所述透明电极不同的材料制成; 并且用携带透明电极和金属膜的柔性基板保持或携带显示层，显示层被设置用于执行显示。

公开(公告)号：US20020036746A1

公开(公告)日：2002-03-28

申请号：US09955352

申请日：2001-09-18

Inventor： Nobuhisa Ishida ,  Norihiro Agawa ,  Takamitsu Kakinaga

IPC: G02F001/1339

CPC classification number: G02F1/133305 ,  G02F1/1345 ,  H05K3/24 ,  H05K2201/0326

Abstract: Disclosed is a display panel including: a display layer for performing display; a flexible substrate for holding or carrying the display layer; a transparent electrode formed on the flexible substrate; and a metal film formed on the flexible substrate, electrically connected to the transparent electrode and made of a material different from that of the transparent electrode. Also disclosed is a method of producing a display panel including the steps of: forming a transparent electrode of a predetermined form on a flexible substrate; forming a metal film of a predetermined form on the flexible substrate so that the metal film is electrically connected to the transparent electrode, the metal film being made of a material different from that of the transparent electrode; and holding or carrying a display layer with the flexible substrate carrying the transparent electrode and the metal film, the display layer being provided for performing display.

Abstract translation: 公开了一种显示面板，包括：显示层，用于执行显示; 用于保持或承载显示层的柔性基板; 形成在柔性基板上的透明电极; 以及金属膜，其形成在柔性基板上，与透明电极电连接并且由与透明电极不同的材料制成。 还公开了一种制造显示面板的方法，包括以下步骤：在柔性基板上形成预定形式的透明电极; 在所述柔性基板上形成预定形式的金属膜，使得所述金属膜与所述透明电极电连接，所述金属膜由与所述透明电极不同的材料制成; 并且用携带透明电极和金属膜的柔性基板保持或携带显示层，显示层被设置用于执行显示。

公开(公告)号：US20010022644A1

公开(公告)日：2001-09-20

申请号：US09785511

申请日：2001-02-16

Inventor： Shoji Hinata

IPC: G02F001/1333

CPC classification number: H05K3/24 ,  G02F1/133555 ,  G02F1/136286 ,  G02F2001/13629 ,  H05K3/064 ,  H05K3/244 ,  H05K2201/0326 ,  H05K2203/0361

Abstract: A panel substrate includes a substrate, a plurality of display electrodes running in parallel on the substrate, and a plurality of wirings respectively continuous from the display electrodes formed on the substrate. The display electrodes and the wirings respectively have a bilayer structure of a transparent conductive layer and a metal layer. The metal layer of the display electrode is substantially narrower in width than the width of the transparent conductive layer.

Abstract translation: 面板基板包括基板，在基板上平行延伸的多个显示电极以及从形成在基板上的显示电极分别连续的多个布线。 显示电极和布线分别具有透明导电层和金属层的双层结构。 显示电极的金属层的宽度比透明导电层的宽度窄得多。

公开(公告)号：US5860212A

公开(公告)日：1999-01-19

申请号：US408319

申请日：1995-03-22

Applicant: Tsutomu Matsuhira

Inventor： Tsutomu Matsuhira

IPC: G02F1/1345 ,  H05K3/04 ,  H05K3/24 ,  H05K3/32 ,  H05K3/36 ,  H05K3/34

CPC classification number: H05K3/245 ,  H05K3/321 ,  H05K2201/0326 ,  H05K2203/0338 ,  H05K3/04 ,  H05K3/244 ,  H05K3/361 ,  Y10T29/49144

Abstract: A method of coating a conductive substance on a transparent electrode disposed on a substrate comprises disposing a resin containing the conductive substance over the surface of the substrate, and rubbing and pressing the resin over the surface of the substrate with a pressing shaft to coat a layer of the resin on the transparent electrode. A method of mounting a semiconductor device or the film substrate on the substrate having the transparent electrode coated with the resin layer containing the conductive substance comprises connecting a terminal portion of the semiconductor device or film substrate to the transparent electrode through the resin layer.

Abstract translation: 在设置在基板上的透明电极上涂布导电性物质的方法包括将含有导电性物质的树脂设置在基板的表面上，并用压轴将树脂摩擦并压在基板的表面上以覆盖层 的透明电极上的树脂。 将半导体器件或薄膜基板安装在具有涂覆有包含导电物质的树脂层的透明电极的基板上的方法包括通过树脂层将半导体器件或薄膜基板的端子部分连接到透明电极。