Abstract:
A miniature socket (10) for electrically interconnecting contact pads on a bare integrated circuit chip (16) to circuit pads (64) on a substrate (18) is disclosed. The socket includes a housing (12) and contact elements (14) having a diameter of about 0.003 inches. The housing (12) includes a recess (28) on one surface (30) for receiving the circuit chip (16) and cavities (44) on an opposite surface (38) for receiving the contact elements (14) and passages (56) leading to the recess (28) from the cavities (44) for receiving the pin sections (80) on the elements (14). Methods of forming a gold tip (84) on the pin sections (80) and for providing cavities (44) and passages (56) in the housing (12) are also disclosed.
Abstract:
An electrical connector for surface mounting to a printed circuit board has circuit board mating legs of terminals which extend from a housing of the connector. An alignment member cooperates with the mating legs of the terminals to maintain the mating legs in position relative to each other and relative to the housing, thereby facilitating the close center-line spacing of the terminals.
Abstract:
An electrical socket (10) for leadless electronic devices has been disclosed. The socket (10) includes a film-circuit member (16) having circuits (66) on a dielectric base (64) with inner ends (68) for electrically engaging conductive pads on the electronic device and outer ends (74) for being electrically attached to circuits on a substrate. The film-circuit member (16) rests on a support plate (18) positioned in a cavity (42) in a lower housing (20) and is overlaid by an upper housing (12) having an opening (24) for receiving an electronic device.
Abstract:
A connector (80) for electrically interconnecting a semi-conductor device (92) to a substrate (86) is disclosed. The connector (80) includes a housing (50) having parallel channels (64) for receiving the devices (92) and contact elements (10) with cantilevered spring arms (18) for electrically engaging the devices (92) and a base (12) having an edge (26) for electrically engaging a circuit (84) on the substrate (86).
Abstract:
The present invention sets forth a low height socket for an integrated circuit chip carrier of the "Tape Pak" type. The unique contact is arranged in the shape of a tuning fork. The chip carrier, having flexible leads projecting outwardly from its sides, is placed in the lower body of the socket with the leads resting on top of their respective tuning fork contacts. The cover, having locking members projecting downwardly and in alignment with the tuning fork contacts, is forced into engagement with the lower body so that the locking members deflect the leads downwardly, bending them about the contacting portion of the tuning fork shaped contacts. The two arms of each tuning fork then has the locking member and a respective lead wedged therebetween.
Abstract:
Chip carrier sockets, for providing an electrical connection between a first electrical component and a second electrical component, have terminals provided therein, the terminals have contacting portions and retention portions provided thereon. The contacting portions are provided to electrically engage leads of a chip carrier with is positioned in a recess of the chip carrier socket. A spacer is provided between the contacting portions and the retention portions, such that the spacer has a greater width than the distance provided between the contacting portion and the retention portion, This spacing, in combination with a resilient member, insure that the spacer is resiliently forced against the contacting portion and the retention portion, thereby insuring that the first electrical component will be positioned and maintained in electrical engagement with the contact portion of the terminal.
Abstract:
The present invention is directed to a multi-pin coax connector assembly having connector housings made of metal or conductive plastic which serves as a reference ground for all signals. The connectors have passages extending therethrough. Pin and socket terminals are insert molded with insulating material and are positioned in the passages. The insulating material spaces the terminals from the conductive connector housing as well as providing air gaps along most of the length of the terminals. The air gaps cooperate with the insulating material to provide controlled impedance. As the signals travel at a high rate of speed along the terminals, the terminals are bent to minimize the reflection of the signal. The connectors are provided with power and ground busses along the outside surfaces thereof, the busses of the first connector making electrical connection with the respective busses of the second connector. A camming assembly means is also provided to cam the terminals of the connectors together, which provides for a positive wipe action as the terminals of the connectors are cammed into electrical engagement with each other. The camming assembly means also allows for reduced insertion force of the connectors, as the terminals of one connector do not engage the terminals of the other connector until the camming assembly means is operated.
Abstract:
Tooling system for a forming machine has a continuous guide passageway in which first and second tooling assemblies are contained for movement towards and away from each other. The passageway has passageway surfaces which serve as bearing and guiding surfaces for the tooling assemblies. Each of the tooling assemblies has a ram member and a tool holder mounted on the ram member. Additionally, a face plate is provided on one of the tooling assemblies at the leading end thereof and is movable relative to the leading end between a retracted position and an extended position. When in its extended position, it is spaced from the ram so that tools, such as punches have their ends in openings in the face plate. When the tooling assemblies move against strip material positioned therebetween, the punches or similar tools move from the face plate and perform operations on the strip. The face plate then serves as a stripper plate during reverse movement of the ram. The pilot pins are separately actuated by an external actuator but are carried in one of the ram assemlies.
Abstract:
44A tool and method are described for removing a chip carrier socket housing from terminals which are received in the housing and which are mounted on a substrate. The tool comprises a yoke having pulling arms pivoted thereto which have free ends that engage the housing at the corners thereof. A central axial opening extends through the yoke and a slide is slidable in the opening. The slide has a reaction plate on its end which is shaped to engage the upper free ends of the terminals. A locking cam is provided which locks the pulling arms in their engaged positions with the housing. An actuating means causes the yoke and the pulling arms to move upwardly (relative to the substrate on which the terminals are mounted) with respect to the reaction plate. The housing is thus pulled by the arms upwardly and from the terminals.
Abstract:
Chip carrier socket has contact terminals therein comprising a web portion and first and second arms extending from the web. The first arm has a contact portion adjacent its free end for contacting a pad on a chip carrier and the second arm has a bearing portion adjacent to its free end. The intermediate portion of the second arm is not supported against wall surfaces of the chip carrier socket. The web is connected to a mounting portion by a neck which is compliantly responsive to stressing of the arms. When the contact portion engages a contact pad on a chip carrier, the entire system including the first and second arms and the web is stressed. The second arm is flexed and the freely supported end of the second arm is moved along its fixed support surface. The design permits the achievement of a high contact force and is capable of accommodating manufacturing tolerances in the chip carrier while maintaining the required contact force.