Abstract:
The plasma display apparatus includes a first electrode and a second electrode formed on an upper substrate, and a barrier rib. The second electrode is arranged in parallel with the first electrode. The barrier rib is formed on a lower substrate opposite to the upper substrate to divide a discharge space. The first electrode and the second electrode are respectively protruded toward the discharge space to have a predetermined thickness. A discharge occurs between the first electrode and the second electrodes opposite to the first electrode. Since the margin of static characteristics increases, the voltage range in which stable driving is possible increase and the amount of the consumption of the discharge current decreases, to thereby reducing power consumption, and enhancing the luminous efficiency and the efficiency of the plasma discharge.
Abstract:
A method of forming a semiconductor device is provided, comprising forming a plurality of hard masks on a substrate by patterning an insulating layer; forming a plurality of trenches in the substrate, each trench having trench walls disposed between two adjacent masks and extending vertically from a bottom portion to an upper portion; forming an insulating layer on the hard masks and the trench walls; forming a conductive layer on the insulating layer; etching the conductive layer to form conductive layer patterns to fill the bottom portions of the trenches; depositing a buffer layer on the conductive layer patterns and the trench walls; and filling the upper portions of the trenches with a capping layer.
Abstract:
Provided is a method for preparing a compound semiconductor substrate. The method includes coating a plurality of spherical balls on a substrate, growing a compound semiconductor epitaxial layer on the substrate coated with the spherical balls while allowing voids to be formed under the spherical balls, and cooling the substrate on which the compound semiconductor epitaxial layer is grown so that the substrate and the compound semiconductor epitaxial layer are self-separated along the voids. The spherical ball treatment can reduce dislocation generations. In addition, because the substrate and the compound semiconductor epitaxial layer are separated through the self-separation, there is no need for laser lift-off process.
Abstract:
Disclosed is a negative C-type retardation compensator for a liquid crystal display. The negative C-type retardation compensator for the liquid crystal display includes polyarylate having a thio group or a sulfur oxide group in a polymer main chain thereof. Accordingly, the retardation compensator has an absolute value of negative retardation that is larger in a thickness direction than a retardation compensator which includes polyarylate having no thio group or sulfur oxide group in a polymer main chain thereof even though the retardation compensator having the thio group or sulfur oxide group and the retardation compensator having no thio group or sulfur oxide group are the same as each other in thickness. Thereby, the negative C-type retardation compensator for liquid crystal displays is capable of being desirably applied to the liquid crystal displays.
Abstract:
A gas sensor includes a silicon substrate provided with a recess, an insulating layer, a first and a second conductive patterned layers and a detecting portion for sensing a gas which passes there through. In the gas sensor, the insulating layer is formed on a top portion of the silicon substrate which does not form the recess. The first and the second conductive patterned layers extend over the recess, thereby being apart from the silicon substrate physically. The detecting portion is formed on both portions of the first and the second conductive patterned layers.
Abstract:
To compliment the drawback of the conventional large-size reserve battery cell inapplicable to a small electronic system, disclosed is a super-slim reserve battery cell sized merely several millimeters in its entirety including micro-size battery elements sized about several μm by using a micro-machining technology of processing mechanical structures in a super-slim size. The present invention realized electrolyte container and other battery elements by using materials such as silicon, nickel, copper, aluminum, etc. to form a membrane structure of relatively thinner thickness than the periphery in an electrolyte container contiguous with the battery cell that is broken only when activating the cell. Therefore, it is possible to activate the battery cell with less power while securing sufficient impact-resistant characteristics under normal circumstances.
Abstract:
There are disclosed methods for the prevention of misfit dislocation in a silicon wafer and the silicon wafer structure manufactured thereby. A method according to an embodiment comprises the steps of: depositing a blanket silicon oxide or silicon nitride on silicon wafer in a chemical vapor deposition process; selectively etching the silicon oxide or silicon nitride, to form a silicon oxide or silicon nitride pattern which is of close shape; and injecting the silicon wafer with impurities at a high density with the CVD silicon oxide or silicon nitride pattern serving as a mask, so as to form an impurity-blocked region is formed under the CVD silicon oxide or silicon nitride through the action of the mask. The misfit dislocation is propagated mainly from the edge of wafer and an impurity-blocked region can prevent the propagation. The propagation energy is virtually based on the tensile stress attributable to the implantation of impurity. Formation of an impurity-blocked region in the wafer barricades the propagation of misfit dislocation because the propagation energy is not supplied in this region. Thus, the area of the silicon wafer enclosed by the impurity-blocked region has no misfit dislocation. By such conception, a silicon wafer free of misfit dislocation can be manufactured. Therefore, there are improved in electrical and mechanical properties in electrical devices, X-ray masks and micromachines as well as in surface roughness.
Abstract:
A heat generating type ink-jet print head including an ink supply passage for receiving an ink from an ink container, a micro chamber for storing the ink and nozzles, all being directly formed on a substrate, and a method for fabricating the ink-jet print head using an electrolytic polishing process, and a method for fabricating the ink-jet print head. The ink-jet print head is fabricated using an electrolytic polishing process, thereby achieving an accurate and inexpensive fabrication.
Abstract:
In a display panel and a method of manufacturing the same, the display panel includes a first display substrate, a second display substrate and a sealing member. The first display substrate includes a first alignment layer in a first display region and a first peripheral region of a first base substrate, and a first backflow-blocking pattern in the first peripheral region and having a curvature to surround a vertex portion of the first display region. The second display substrate includes a second alignment layer in a second display region which faces the first display region and a second peripheral region of a second base substrate. The sealing member includes a corner portion having substantially the same curvature as the first backflow-blocking pattern to surround an outline of the first and second peripheral regions.
Abstract:
A method of providing content is provided. The method includes providing an interface for providing a service based on information regarding a wireless transceiver positioned close to an apparatus for providing content, the information being received from the wireless transceiver; requesting a waiting number for providing the service via the interface; and receiving the waiting number for providing the service, a waiting time, and content based on the waiting time.