DIS-AGGREGATED SWITCHING AND PROTOCOL CONFIGURABLE INPUT/OUTPUT MODULE

    公开(公告)号:US20230137940A1

    公开(公告)日:2023-05-04

    申请号:US17515004

    申请日:2021-10-29

    Abstract: An input/output module (IOM) for use within a network storage system mounted within a rack enclosure. The IOM includes a switching component configured to provide top-of-rack (TOR) switching for data to be routed from input connectors to data storage devices within the rack enclosure. The IOM also includes a protocol interface configured to convert a protocol of the data from an input data protocol (e.g., Ethernet, Fibre Channel or InfiniBand™) to a protocol for use with the storage devices (e.g., nonvolatile memory express (NVMe) and Peripheral Component Interconnect Express (PCIe)). Among other features, the IOM allows switching to be dis-aggregated from a TOR switch and distributed throughout the data network of the rack.

    EXPENDABLE AIRBORNE FIBER OPTIC LINK

    公开(公告)号:US20220234758A1

    公开(公告)日:2022-07-28

    申请号:US17511509

    申请日:2021-10-26

    Abstract: Aspects of the present disclosure are related unmanned aerial vehicles tethered to ground stations with an expendable airborne fiber-optic link. The tethers may be fiber-optic cables that can be used as a communications conduit between a ground station and a UAV for providing vehicle positioning/control information to the UAV as well as transmitting a large amount of information/data to the UAV. As the information being transmitted between to the UAV the ground station is critical, fiber-optic cables provide the bandwidth and transmission capabilities required with the added benefit of electromagnetic interference (EMI) and radio-frequency interference (RFI) immunity, making this an ideal solution for these applications.

    ULTRA THIN DIELECTRIC PRINTED CIRCUIT BOARDS WITH THIN LAMINATES AND METHOD OF MANUFACTURING THEREOF

    公开(公告)号:US20210243903A1

    公开(公告)日:2021-08-05

    申请号:US17234471

    申请日:2021-04-19

    Abstract: Ultra-thin dielectric printed circuit boards (PCBs) are provided. An ultra-thin dielectric layer may be coupled to a first conductive layer on a first side of the ultra-thin dielectric layer. A second conductive layer may be coupled to a second side of the ultra-thin dielectric layer, and the ultra-thin dielectric layer is thinner than at least one of the first conductive layer and the second conductive layer. The second conductive layer may be patterned to form electrical paths. The patterned second conductive layer may be filled with a dielectric filler. One or more conductive layers and one or more ultra-thin dielectric layers may also be coupled to the second conductive layer.

    Methods of manufacturing ultra thin dielectric printed circuit boards with thin laminates

    公开(公告)号:US10993333B2

    公开(公告)日:2021-04-27

    申请号:US16036913

    申请日:2018-07-16

    Abstract: A method for making an ultra-thin dielectric printed circuit board (PCB) is provided. A first side of a first conductive layer is removably coupled to a disposable base. A first ultra-thin dielectric layer and a second conductive layer are laminated to a second side of the first conductive layer, where the first ultra-thin dielectric layer is positioned between the first and second conductive layers, and the first ultra-thin dielectric layer is thinner than at least one of the first conductive layer and the second conductive layer. The second conductive layer may then be patterned to form electrical paths. The patterned second conductive layer is then filled with a dielectric filler. One or more conductive layers and one or more ultra-thin dielectric layers may then be coupled to the second conductive layer. The disposable base may then be detached from the first conductive layer.

    GANTRY SYSTEM AND METHOD
    79.
    发明申请

    公开(公告)号:US20200309315A1

    公开(公告)日:2020-10-01

    申请号:US16835020

    申请日:2020-03-30

    Abstract: A gantry system comprises a bearing assembly including at least two rows of ball bearings, an inner race portion including an inner race and a first outer peripheral face and an outer race portion including an outer race and a second outer peripheral face. A first mounting plate is mounted to the first outer peripheral face of the inner race portion. The first mounting plate has a substantial portion that is relatively flat where it contacts the first outer peripheral face. In addition, the first mounting plate is relatively thin in comparison to the inner race portion such that the first mounting plate conforms to the surface of the inner race portion.

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