公开(公告)号：US20090066592A1

公开(公告)日：2009-03-12

申请号：US12274400

申请日：2008-11-20

Applicant: Yuya DOKAI ,  Noboru KATO

Inventor： Yuya DOKAI ,  Noboru KATO

IPC: G01R29/08

CPC classification number: G01R31/315 ,  G01R1/07 ,  G06K7/0008 ,  G06K7/10316 ,  G06K2017/0077 ,  Y10T29/49002

Abstract: A system for inspecting an electromagnetic coupling module includes a radio IC chip and a feeder circuit board on which the radio IC chip is mounted, the feeder circuit board includes a feeder circuit including an inductance element. This inspecting system measures the electromagnetic coupling module by electromagnetically coupling a probe of a measuring device to the electromagnetic coupling module by at least one of electrostatic coupling and electromagnetic coupling. In addition, the electromagnetic coupling modules are manufactured using this inspecting system.

Abstract translation: 用于检查电磁耦合模块的系统包括无线电IC芯片和安装有无线IC芯片的馈电电路板，馈电电路板包括具有电感元件的馈电电路。 该检查系统通过静电耦合和电磁耦合中的至少一种将测量装置的探针电磁耦合到电磁耦合模块来测量电磁耦合模块。 此外，使用该检查系统制造电磁耦合模块。

公开(公告)号：US20090021352A1

公开(公告)日：2009-01-22

申请号：US12235753

申请日：2008-09-23

Applicant: Takeshi KATAYA ,  Noboru KATO ,  Satoshi ISHINO ,  Nobuo IKEMOTO ,  Ikuhei KIMURA ,  Yuya DOKAI

Inventor： Takeshi KATAYA ,  Noboru KATO ,  Satoshi ISHINO ,  Nobuo IKEMOTO ,  Ikuhei KIMURA ,  Yuya DOKAI

IPC: H04Q5/22

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q7/00 ,  H04Q2213/13095 ,  H05K1/0239 ,  H05K1/0243 ,  H05K1/141 ,  H05K1/16 ,  H05K2201/10098

Abstract: A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.

Abstract translation: 射频IC器件包括布置成处理发送/接收信号的射频IC芯片，安装射频IC芯片的印刷电路板，布置在电路板上的电极和布置在电路板上的环形电极 电路板，使得环形电极电连接到射频IC芯片，并通过电磁耦合耦合到电极。 电极通过环形电极耦合到射频IC芯片，以便发送或接收高频信号。 包括谐振电路和/或匹配电路的电源电路板可以设置在射频IC芯片和环形电极之间。