公开(公告)号：US10592053B2

公开(公告)日：2020-03-17

申请号：US15669729

申请日：2017-08-04

Applicant: Apple Inc.

Inventor： Naoto Matsuyuki ,  Douglas J. Weber

IPC: G06F3/044 ,  C03C17/34 ,  C03C17/36 ,  G02B5/22 ,  G02B5/02 ,  H04M1/02

Abstract: An opaque cover is provided for a capacitive sensor. The cover includes a transparent substrate, and at least one white coating layer including white pigments disposed over at least one portion of the transparent substrate. The cover also includes a non-conductive mirror structure disposed over the at least one white coating layer. The non-conductive mirror structure includes a number of first dielectric layers having a first refractive index interleaved with second dielectric layers having a second refractive index. The first and second dielectric layers have dielectric constants below a threshold.

公开(公告)号：US10420226B2

公开(公告)日：2019-09-17

申请号：US15614747

申请日：2017-06-06

Applicant: Apple Inc.

Inventor： Naoto Matsuyuki ,  Dale N. Memering ,  Theodore A. Waniuk ,  Kazuya Takagi ,  Colin M. Ely

IPC: H05K5/00 ,  B32B1/02 ,  H04M1/18 ,  H01L23/06 ,  H05K5/02 ,  H04M1/02 ,  B24C1/04 ,  C04B41/91 ,  C04B35/486 ,  B24C1/06 ,  B24C1/08 ,  B24C11/00 ,  C04B41/00 ,  C04B41/53

Abstract: A housing for a portable electronic device is disclosed. The housing is composed of yttria-sensitized zirconia. Yttria-sensitized zirconia has from about 1.5 to about 2.5 mole percent yttria, and more typically about 2 mole percent yttria, and most typically 2 mole percent yttria, in zirconia. Yttria-sensitized zirconia is both tough and able to limit the formation and propagation of micro-cracks. Methods for manufacturing yttria-sensitized zirconia composed housings are also disclosed.

公开(公告)号：US20190208653A1

公开(公告)日：2019-07-04

申请号：US16298809

申请日：2019-03-11

Applicant: Apple Inc.

Inventor： Colin M. Ely ,  Dale N. Memering ,  Kazuya Takagi ,  Naoto Matsuyuki ,  Theodore A. Waniuk

IPC: H05K5/02 ,  C09C1/00 ,  C04B35/64 ,  C04B35/48 ,  C04B35/486

CPC classification number: H05K5/0217 ,  C04B35/48 ,  C04B35/486 ,  C04B35/64 ,  C04B2235/3244 ,  C04B2235/3262 ,  C04B2235/3275 ,  C04B2235/6567 ,  C04B2235/661 ,  C04B2235/9661 ,  C09C1/0009

Abstract: A method of manufacturing a housing of an electronic device includes determining a sintering profile configured to produce a selected color at a selected depth within a wall of the housing, sintering a ceramic housing precursor in accordance with the determined sintering profile, thereby forming the housing, and removing material from the housing up to the selected depth.

公开(公告)号：US20190045642A1

公开(公告)日：2019-02-07

申请号：US15821789

申请日：2017-11-23

Applicant: Apple Inc.

Inventor： Christopher D. Prest ,  Colin M. Ely ,  Naoto Matsuyuki ,  Joseph C. Poole

IPC: H05K5/00 ,  H05K5/03 ,  H05K5/02 ,  H05K7/14

CPC classification number: H05K5/0095 ,  G04G17/08 ,  G06F1/1626 ,  G06F1/163 ,  G06F1/1633 ,  G06F1/1637 ,  G06F1/1656 ,  H05K5/0013 ,  H05K5/0017 ,  H05K5/006 ,  H05K5/0217 ,  H05K5/0247 ,  H05K5/03 ,  H05K7/1417

Abstract: A housing or enclosure for an electronic device is formed from a shell and chassis may positioned along an interior of the shell. The shell may be formed from a hard or cosmetic material and the chassis may be formed from a machinable material. The chassis may define one or more machined surfaces that are configured to receive or mount a component of the electronic device.

公开(公告)号：US10094963B2

公开(公告)日：2018-10-09

申请号：US15483974

申请日：2017-04-10

Applicant: Apple Inc.

Inventor： Marta M. Giachino ,  Naoto Matsuyuki ,  Matthew S. Rogers ,  Xianwei Zhao ,  Ligang Wang

IPC: G02B5/28 ,  G02B1/11 ,  H01L27/146 ,  G02B1/115 ,  H01S5/40

Abstract: An electronic device may be provided with a display. The display may have a display cover layer. The display may have an active area with pixels and an inactive area without pixels. An opaque masking layer such as a layer of black ink may be formed on the underside of the display cover layer in the inactive area. Windows may be formed from openings in the opaque masking layer. Optical components such as infrared-light-based optical components may be aligned with the windows. The windows may include coatings in the openings that block visible light while transmitting infrared light. The window coatings may be formed from polymer layers containing pigments, polymer layers containing dyes that are coated with antireflection layers, thin-film interference filters formed from stacks of thin-film layers, or other coating structures.

公开(公告)号：US20180073104A1

公开(公告)日：2018-03-15

申请号：US15455432

申请日：2017-03-10

Applicant: Apple Inc.

Inventor： Yoshihiko Yokoyama ,  Naoto Matsuyuki

IPC: C22C1/02 ,  C22C45/00 ,  C22C45/10

CPC classification number: C22C1/02 ,  C22C45/003 ,  C22C45/008 ,  C22C45/10

Abstract: The disclosure provides a method of modifying a surface of a metallic glass. The method includes applying an electron beam within an energy band to a crystalline metal portion at a surface zone of the metallic glass. The method also includes changing the crystalline metal portion to an amorphous portion at the surface zone of the metallic glass, while a bulk region embedded in the metallic glass under the surface zone remains crystalline.

公开(公告)号：US09864116B2

公开(公告)日：2018-01-09

申请号：US15231170

申请日：2016-08-08

Applicant: Apple Inc.

Inventor： Naoto Matsuyuki ,  Mark T. Winkler ,  Matthew S. Rogers

IPC: G02B5/20 ,  H05K5/00 ,  H05K5/03 ,  G02B1/115 ,  G02B5/28 ,  G01V8/10 ,  G02B5/22

CPC classification number: G02B5/208 ,  G01V8/10 ,  G02B1/115 ,  G02B5/20 ,  G02B5/207 ,  G02B5/22 ,  G02B5/281 ,  H05K5/0017 ,  H05K5/03

Abstract: An electronic device may have a display with a cover layer. A light-based component such as an infrared-light proximity sensor or other infrared-light-based component may be aligned with a window in the display cover layer. The window may block visible light and transmit infrared light. A coating in the window may include a thin-film filter formed from a stack of inorganic dielectric layers. The thin-film filter may block visible light and transmit infrared light. The coating may also include at least one layer of material such as a semiconductor material that absorbs visible light and that passes infrared light. This material may be interposed between the thin-film filter and the display cover layer. Antireflection properties and color adjustment properties may be provided using thin-film layers between the thin-film filter and the display cover layer.

公开(公告)号：US20170087610A1

公开(公告)日：2017-03-30

申请号：US15258724

申请日：2016-09-07

Applicant: Apple Inc.

Inventor： Yoshihiko Yokoyama ,  Theodore A. Waniuk ,  Hsiang Hung Chen ,  Kazuya Takagi ,  Naoto Matsuyuki

IPC: B21B3/00 ,  C22C5/04 ,  C22C45/00

CPC classification number: B21B3/003 ,  C22C5/04 ,  C22C45/003

Abstract: The disclosure is directed to methods of forming glassy alloys. A glassy alloy is cold rolled at a temperature less than Tg of the glassy alloy to form a flattened glassy alloy. Then, the cold rolled glassy alloy is thermoplastically formed at a temperature above Tg of the glassy alloy. In certain embodiments, the flattened glassy alloy may have one or more shear bands and/or micro-cracks, and the thermoplastic forming may heal the shear bands and/or micro-cracks. The resulting glassy alloy may thereby have reduced or eliminated shear bands and/or micro-cracks.

公开(公告)号：US20170054318A1

公开(公告)日：2017-02-23

申请号：US15082935

申请日：2016-03-28

Applicant: APPLE INC.

Inventor： Naoto Matsuyuki ,  Christopher S. Graham ,  Makiko K. Brzezinski

IPC: H02J7/02 ,  H01L23/522

CPC classification number: H02J7/025 ,  H01F27/2871 ,  H01F27/327 ,  H01F38/14 ,  H01F41/127 ,  H01F2027/2809 ,  H01L23/5226 ,  H01L23/5227 ,  H02J5/005 ,  H02J50/10

Abstract: A three-dimensional inductive charging coil assembly and a method of making the same. The method can include patterning a first conductive layer affixed to a first surface of an insulating layer to form a coil configured to transmit or receive power, patterning a second conductive layer affixed to a second surface of the insulating layer opposite the first surface to form a conductive trace element, and electrically coupling the coil and the conductive trace element. The coil, insulating layer, and conductive trace element can be molded (e.g., simultaneously) into a three dimensional shape. In some embodiment, the molding can include a thermoforming process such as compression molding, vacuum forming, or the like.

Abstract translation: 一种三维感应充电线圈组件及其制造方法。 该方法可以包括图案化固定到绝缘层的第一表面的第一导电层，以形成被配置为传递或接收电力的线圈，图案化固定到与第一表面相对的绝缘层的第二表面的第二导电层，以形成 导电微量元件，并且电耦合线圈和导电微量元件。 线圈，绝缘层和导电微量元件可以模制（例如，同时）成三维形状。 在一些实施例中，模制件可以包括热成型工艺，例如压塑，真空成型等。

公开(公告)号：US20160256979A1

公开(公告)日：2016-09-08

申请号：US14714876

申请日：2015-05-18

Applicant: Apple Inc.

Inventor： Naoto Matsuyuki ,  Bin Yi ,  Dezheng Qu ,  Jairam Manjunathaiah ,  Scott M. Nathanson ,  Trevor J. Ness ,  David I. Nazzaro ,  Raul A. Molina

IPC: B24B37/04 ,  B29C70/88 ,  B29C65/50 ,  C03C25/00 ,  B29C70/74

CPC classification number: B24B37/042 ,  B24B37/02 ,  B24B37/025 ,  B29C70/745 ,  B29C70/88 ,  C03C25/005 ,  F16B11/006

Abstract: A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.

Abstract translation: 一种用于共整理表面的方法将由第一材料形成的第一结构粘结在具有由第二材料形成的第二结构中限定的孔中的第一表面，并且具有第二表面，使得在第一表面和第二表面之间存在偏移 第二个表面。 共同研磨第一表面和第二表面以减少偏移。 第一表面和第二表面被共抛光以进一步减少偏移。 然后第一表面和第二表面可以是齐平的。 可以将第一表面的边缘倒角以减轻在共研磨和/或共抛光期间的损伤。 填充材料可以位于第一和第二结构之间的间隙中，以减轻在共研磨和/或共抛光期间的损伤。