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公开(公告)号：US11630087B2
公开(公告)日：2023-04-18
申请号：US17591714
申请日：2022-02-03
Applicant: Infineon Technologies AG
Inventor： Stefan Kolb , Alfons Dehe , Jochen Huber , Franz Jost , Horst Theuss , Juergen Woellenstein
Abstract: An apparatus for in-situ calibration of a photoacoustic sensor includes a measurement device configured to measure an electric signal at an IR emitter of the photoacoustic sensor, wherein the IR emitter generates an electromagnetic spectrum based on the electric signal; and a calibration unit including processing circuitry, configured to compare the electric signal with a comparison value to generate a comparison result used as calibration information. When performing the in-situ calibration, the calibration unit is configured to adjust the electric signal based on the calibration information, or the calibration unit is configured to process an output signal of the photoacoustic sensor based on the calibration information to obtain an adjusted output signal of the photoacoustic sensor.
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公开(公告)号：US20230038134A1
公开(公告)日：2023-02-09
申请号：US17874834
申请日：2022-07-27
Applicant: Infineon Technologies AG
Inventor： Rainer Markus Schaller , Horst Theuss
Abstract: In the following, a sensor assembly is described. According to an exemplary embodiment, the sensor assembly has a housing enclosing a pressure chamber filled with a medium, the housing having a first housing part and a second housing part, the first housing part being connected to the second housing part to seal the pressure chamber in a pressure-tight manner A sensor chip is arranged in the pressure chamber, substantially surrounded by the medium, and configured to measure a pressure of the medium. The sensor assembly also includes a plurality of connection pins which are fed through the first housing part (carrier) by pressure-tight bushings and which are electrically connected to the sensor chip. The sensor assembly also has stress relieving structures which are configured to mechanically decouple the first housing part and a pressure-sensitive element of the sensor chip.
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公开(公告)号：US11536781B2
公开(公告)日：2022-12-27
申请号：US17301795
申请日：2021-04-14
Applicant: Infineon Technologies AG
Inventor： Horst Theuss , Klaus Elian , Helmut Wietschorke
IPC: G01R33/038 , G01R33/07
Abstract: The present disclosure relates to a magnetic-sensor device comprising a circuit board made of an electrically insulating material and having conductor tracks, and comprising a permanent magnet surface-mounted on the circuit board, and a magnetic-field sensor connected to the conductor tracks of the circuit board. An SMD component for populating a circuit board is also proposed, which SMD component comprises a permanent magnet and a magnetic-field sensor.
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公开(公告)号：US11255824B2
公开(公告)日：2022-02-22
申请号：US16184412
申请日：2018-11-08
Applicant: Infineon Technologies AG
Inventor： Rainer Markus Schaller , Horst Theuss
Abstract: The present disclosure is related to a photoacoustic sensor modular assembly. An example interconnect module includes a support structure configured to be situated between an emitter module of the photoacoustic sensor and a detector module of the photoacoustic sensor. The emitter module may include an emitter component and the detector module may include a detector component. The interconnect module may include a conductive element configured to connect to at least one of the emitter component or the detector component.
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公开(公告)号：US11192777B2
公开(公告)日：2021-12-07
申请号：US15864787
申请日：2018-01-08
Applicant: Infineon Technologies AG
Inventor： Bernhard Winkler , Rainer Leuschner , Horst Theuss
Abstract: Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.
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Patent Agency Ranking
公开(公告)号：US10753858B2
公开(公告)日：2020-08-25
申请号：US16456361
申请日：2019-06-28
Applicant: Infineon Technologies AG , Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.
Inventor： Stefan Kolb , Alfons Dehe , Jochen Huber , Franz Jost , Horst Theuss , Wilhelm Wiedmeier , Juergen Woellenstein
Abstract: Shown is a wafer arrangement for a gas sensor including a first substrate and a sescond substrate. The first substrate includes a MEMS membrane associated with a sensor element and an emitter element configured to emit electromagnetic radiation. The second substrate is arranged on top of the first substrate and defines at least a portion of a chamber disposed adjacent to the MEMS membrane.
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公开(公告)号：US20200249149A1
公开(公告)日：2020-08-06
申请号：US16778692
申请日：2020-01-31
Applicant: Infineon Technologies AG
Inventor： Horst Theuss
IPC: G01N21/17 , G01N29/24 , G01R33/028 , B81C1/00
Abstract: A method is disclosed. In one example, the method includes bonding a first panel of a first material to a base panel in a first gas atmosphere, wherein multiple hermetically sealed first cavities encapsulating gas of the first gas atmosphere are formed between the first panel and the base panel. The method further includes bonding a second panel of a second material to at least one of the base panel and the first panel, wherein multiple second cavities are formed between the second panel and the at least one of the base panel and the first panel.
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公开(公告)号：US20200057031A1
公开(公告)日：2020-02-20
申请号：US16534143
申请日：2019-08-07
Applicant: Infineon Technologies AG
Inventor： Horst Theuss , Rainer Markus Schaller
Abstract: A detector module is disclosed. In one example, the detector module is for a photo-acoustic gas sensor and comprises a first substrate made of a semiconductor material and comprising a first surface and a second surface opposite to the first surface, a second substrate comprising a third surface, a fourth surface opposite to the third surface, and a first recess formed in the fourth surface. The second substrate is connected with its fourth surface to the first substrate so that the first recess forms an airtight-closed first cell which is filled with a reference gas and a pressure sensitive element comprising a membrane disposed in contact with the reference gas. The detector module is further configured such that a beam of light pulses passes through the first substrate and thereby enters the first cell.
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公开(公告)号：US20200053483A1
公开(公告)日：2020-02-13
申请号：US16036172
申请日：2018-07-16
Applicant: Infineon Technologies AG
Inventor： Horst Theuss
Abstract: A sensor device including a leadframe is disclosed. A sensor chip is arranged on the leadframe, an encapsulation material is arranged on a main surface and a side surface of the sensor chip, and a signal port arranged at a side surface of the sensor device. The side surface of the sensor device extends between opposing main surfaces of the sensor device, wherein one of the main surfaces is a mounting surface of the sensor device. A channel extends from the signal port to a sensing structure of the sensor chip.
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公开(公告)号：US10519030B2
公开(公告)日：2019-12-31
申请号：US15478946
申请日：2017-04-04
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Franz Gabler , Thomas Mueller , Horst Theuss , Mathias Vaupel
Abstract: A package which comprises a carrier, a transducer mounted on the carrier and configured for converting between a package-external property and an electric signal, a package housing at least partially housing at least one of the carrier and the transducer, and a sealing which forms at least part of the package housing for sealing between the package and a package-external body.
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