PHYSICAL LAYER ADAPTED FOR EHF CONTACTLESS COMMUNICATION

    公开(公告)号:US20180227015A1

    公开(公告)日:2018-08-09

    申请号:US15935774

    申请日:2018-03-26

    Applicant: Keyssa, Inc.

    Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (Host-cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link). The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

    CONTACTLESS REPLACEMENT FOR CABLED STANDARDS-BASED INTERFACES

    公开(公告)号:US20180069598A1

    公开(公告)日:2018-03-08

    申请号:US15811051

    申请日:2017-11-13

    Applicant: KEYSSA, INC.

    Abstract: A contactless, electromagnetic (EM) replacement (substitute, alternative) for cabled (electric) Standards-based interfaces (such as, but not limited to USB) which effectively handles the data transfer requirements (such as bandwidth, speed, latency) associated with the Standard, and which is also capable of measuring and replicating relevant physical conditions (such as voltage levels) on data lines so as to function compatibly and transparently with the Standard. A contactless link may be provided between devices having transceivers. A non-conducting housing may enclose the devices. Some applications for the contactless (EM) interface are disclosed. A dielectric coupler facilitating communication between communications chips which are several meters apart. Conductive paths may provide power and ground for bus-powered devices.

    VIRTUALIZED PHYSICAL LAYER ADAPTED FOR EHF CONTACTLESS COMMUNICATION

    公开(公告)号:US20170318618A1

    公开(公告)日:2017-11-02

    申请号:US15653943

    申请日:2017-07-19

    Applicant: Keyssa, Inc.

    CPC classification number: H04B5/0031 H04B5/0037 H04W76/10 H04W76/14

    Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

    VIRTUALIZED PHYSICAL LAYER ADAPTED FOR EHF CONTACTLESS COMMUNICATION

    公开(公告)号:US20170127465A1

    公开(公告)日:2017-05-04

    申请号:US15408937

    申请日:2017-01-18

    Applicant: Keyssa, Inc.

    CPC classification number: H04B5/0031 H04B5/0037 H04W76/10 H04W76/14

    Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

    CONTACTLESS REPLACEMENT FOR CABLED STANDARDS-BASED INTERFACES

    公开(公告)号:US20170099082A1

    公开(公告)日:2017-04-06

    申请号:US15380457

    申请日:2016-12-15

    Applicant: KEYSSA, INC.

    Abstract: A contactless, electromagnetic (EM) replacement (substitute, alternative) for cabled (electric) Standards-based interfaces (such as, but not limited to USB) which effectively handles the data transfer requirements (such as bandwidth, speed, latency) associated with the Standard, and which is also capable of measuring and replicating relevant physical conditions (such as voltage levels) on data lines so as to function compatibly and transparently with the Standard. A contactless link may be provided between devices having transceivers. A non-conducting housing may enclose the devices. Some applications for the contactless (EM) interface are disclosed. A dielectric coupler facilitating communication between communications chips which are several meters apart. Conductive paths may provide power and ground for bus-powered devices.

    Contactless audio adapter, and methods
    80.
    发明授权
    Contactless audio adapter, and methods 有权
    非接触式音频适配器和方法

    公开(公告)号:US09565495B2

    公开(公告)日:2017-02-07

    申请号:US14958122

    申请日:2015-12-03

    Applicant: Keyssa, Inc.

    Abstract: A contactless, electromagnetic (EM) replacement for cabled Standards-based interfaces (such as USB, I2S) which handles data transfer requirements associated with the Standard, and capable of measuring and replicating relevant physical conditions on data lines so as to function compatibly and transparently with the Standard. A contactless link between devices having transceivers. A non-conducting housing enclosing the devices. A dielectric coupler facilitating communication between communications chips. Conductive paths or an inductive link providing power between devices. An audio adapter communicates over a contactless link with a source device, and via a physical link with a destination device such as a conventional headset. Power may be provided to the adapter from the source device, and by the adapter to the destination device.

    Abstract translation: 用于处理与标准相关的数据传输需求的电缆标准接口(如USB,I2S)的非接触式电磁(EM)替换,能够测量和复制数据线上的相关物理条件,以便兼容和透明地运行 与标准。 具有收发器的设备之间的非接触式链路。 封闭设备的非导电外壳。 一种促进通信芯片之间通信的介质耦合器。 导电路径或在设备之间提供电力的感应链路。 音频适配器通过非接触式链路与源设备进行通信,并且经由与目标设备(例如常规耳机)的物理链路进行通信。 电源可以从源设备提供给适配器,并且可以由适配器提供给目标设备。

Patent Agency Ranking