公开(公告)号：USD896455S1

公开(公告)日：2020-09-15

申请号：US35507441

申请日：2018-11-22

Applicant: LG ELECTRONICS INC.

Designer： Yanghwan No ,  Minkyu Oh ,  Seongwoo An ,  Yongnam Kim

公开(公告)号：USD896454S1

公开(公告)日：2020-09-15

申请号：US35507439

申请日：2018-11-22

Applicant: LG ELECTRONICS INC.

Designer： Yanghwan No ,  Minkyu Oh ,  Seongwoo An ,  Yongnam Kim

公开(公告)号：US10704812B2

公开(公告)日：2020-07-07

申请号：US15918292

申请日：2018-03-12

Applicant: LG ELECTRONICS INC.

Inventor： Seokhyun Kim ,  Minkyu Oh ,  Heayoun Sul ,  Jeehoon Choi ,  Hyoungkeun Lim

IPC: F25B21/02 ,  F25B21/04 ,  F25D21/08 ,  F25B47/02 ,  F25D17/06 ,  F25D21/06

Abstract: A refrigerator may include a sensor configured to measure temperature, a thermoelectric device module having at least one fan and configured to cool the storage compartment; and a controller that controls a rotation speed of the fan. The rotation speed of the fan may be determined based on at least one of whether a storage compartment temperature condition measured by the sensor exists or whether an initial power input condition exists. The thermoelectric device module may be controlled differently in a first temperature region, in a second temperature region, and in a third temperature region of the storage compartment. When an initial power condition exist such that power is initially supplied to the refrigerator, the fan is controlled to spin at a rotation speed that exceeds a rotation speed corresponding to the third temperature region until a preset temperature within the second temperature region is reached.

公开(公告)号：US20180274825A1

公开(公告)日：2018-09-27

申请号：US15924741

申请日：2018-03-19

Applicant: LG ELECTRONICS INC.

Inventor： Jeehoon CHOI ,  Seokhyun Kim ,  Heayoun Sul ,  Minkyu Oh ,  Hyoungkeun Lim

IPC: F25B21/02 ,  F25D17/06 ,  F25D11/00 ,  F25D23/06

CPC classification number: F25B21/02 ,  F25B2321/0251 ,  F25B2321/0252 ,  F25D11/00 ,  F25D17/062 ,  F25D19/00 ,  F25D23/003 ,  F25D23/066 ,  F25D2500/02

Abstract: A refrigerator including an inner case having a storage chamber defined therein; a thermoelectric module configured to cool the storage chamber, wherein the thermoelectric module includes a thermoelectric element and a heat sink; a heat-dissipation fan assembly provided adjacent to the heat sink; a heat-dissipation cover spaced apart from the inner case, wherein the heat-dissipation cover has at least one outer intake hole defined therein and wherein the intake hole faces the heat-dissipation fan assembly; and a gasket configured to block a gap between the heat-dissipation cover and the heat-dissipation fan assembly.

公开(公告)号：US09733009B2

公开(公告)日：2017-08-15

申请号：US14531286

申请日：2014-11-03

Applicant: LG Electronics Inc.

Inventor： Sangbong Lee ,  Jangseok Lee ,  Hyoungkeun Lim ,  Myungjin Chung ,  Minkyu Oh

IPC: F25D11/02 ,  F25B5/02 ,  F25B43/00 ,  F25D29/00 ,  F25B1/00 ,  F25B49/02 ,  F25B1/10

CPC classification number: F25D11/022 ,  F25B1/005 ,  F25B1/10 ,  F25B5/02 ,  F25B43/00 ,  F25B49/02 ,  F25B2341/0662 ,  F25B2400/13 ,  F25B2400/23 ,  F25B2600/2507 ,  F25D29/00

Abstract: A refrigerant is provided that may include at least one compressor that compresses a refrigerant, a condenser that condenses the refrigerant compressed in the at least one compressor, a first expansion device that decompresses the refrigerant condensed in the condenser, a gas/liquid separator that separates the refrigerant decompressed in the first expansion device into a liquid refrigerant and a gaseous refrigerant, first and second evaporators, to which the liquid refrigerant separated in the gas/liquid separator may be introduced, and a second expansion device disposed at an inlet-side of the second evaporator to decompress the refrigerant.