Abstract:
Provided are a high quality poly-Si structure and a method of fabricating the same. The poly-Si structure includes a substrate, a polycrystallized silicon thin film, and an adhesive layer disposed between them. In the method of fabricating the poly-Si structure, an adhesive layer is first formed on a substrate, a-Si is deposited at a low temperature, and a polycrystallization process of silicon is, then performed by high density energy. Polycrystallization by high energy is possible, and therefore, high quality poly-Si can be achieved. The method can be employed in a low-temperature process, and a heat-sensitive material such as plastic or the like can be used as a substrate.
Abstract:
A thin film transistor and a method of manufacturing the same are provided. The thin film transistor includes a substrate; a buffer layer formed on the substrate; a source and a drain spaced apart from each other on the buffer layer; a channel layer formed on the buffer layer to connect the source and the drain with each other; and a gate formed on the buffer layer to be spaced apart from the source, the drain and the channel layer.
Abstract:
The invention provides a common document editing apparatus that is capable of reflecting the edition content based on a exclusive edition right on a common document even in the case where the exclusive edition right is cancelled forcibly. When an exclusive edition right of a common document stored in a document storing unit is requested, a lock information managing unit issues an exclusive edition right to permit exclusive edition and the lock information in stored in a lock information storing unit. Upon receiving the edition content together with the lock information, the lock information managing unit stores the edition content in the document storing unit only when the received lock information is identical with the lock information stored in the lock information storing unit. When the exclusive edition right is cancelled forcibly, the lock information managing unit 23 stores the lock information in an unlocked lock information storing unit. When the edition content that is identical with the same lock information is requested to be stored before a new exclusive edition right of the same document is requested, the lock information is overwritten in the document storing unit.
Abstract:
A semiconductor device includes a first wall and a second wall. The first wall is arranged in a pad region which surrounds a chip region, and the second wall is arranged on a semiconductor chip mounted in the chip region. Conductive are arranged between the first wall and the second wall and are encapsulated by a encapsulating material formed between the first and second walls.
Abstract:
A semiconductor device including: a gate electrode made from silicon-germanium or germanium; a first semiconductor region formed under the gate electrode with a first gate insulating film between the first semiconductor region and the gate electrode; and a second semiconductor region formed over the gate electrode with a second gate insulating film between the second semiconductor region and the gate electrode, wherein a first conductivity type MOS transistor includes the first semiconductor region, the first gate insulating film, and the gate electrode, and a second conductivity type MOS transistor includes the second semiconductor region, the second gate insulating film, and the gate electrode.
Abstract:
Methods for fabricating memory devices having a multi-dot floating gate ensuring a desirable crystallization of a semiconductor film without ruining the flatness of the surface of the polycrystallized silicon layer and a tunnel oxide film, allowing desirable semiconductor dots to be produced, and allowing production of the memory devices having a multi-dot floating gate with ease and at low costs even when a substrate is made of glass or plastic. Such a method for fabricating memory devices includes steps for forming on a substrate a semiconductor film and treating said semiconductor film by a first laser annealing so as to have a polycrystalline structure; forming on the semiconductor film a semiconductor dot forming film having a non-stoichiometric composition with an excessive content of a semiconductor element; and dispersing semiconductor dots within the semiconductor dot forming film by a second laser annealing thereby to produce semiconductor dots; in which a pulse energy density of the laser used for the first laser annealing is larger than a pulse energy density of the laser used for the second laser annealing.
Abstract:
In a field effect transistor, an Si1-xGex layer is provided between a source or drain electrode deriving region and a corresponding metal (interconnection) electrode or between a contact deriving region and a metal layer formed on the upper portions of the contact deriving region to form an ohmic contact to thereby prevent the aluminum metal layer from penetrating into a p-n junction and to reduce a contact resistance.
Abstract:
An anti-rotation mechanism in a linear actuator has outer and inner cylinders, affords high accuracy and rigidity, is simple in structure, not requiring the use of a tie rod, and is inexpensive to manufacture. The outer cylinder 3 has both end portions 3 of circular cross section and an intermediate portion whose inner surface has an axially uniform non-circular cross-sectional shape including a rotation inhibiting surface 3F. The inner cylinder 4 has a collar 7 on the outer peripheral surface which is guided and supported slidably by the intermediate portion of the outer cylinder and has a conforming non-circular cross-sectional shape including a flat surface 7B for sliding engagement with the rotation inhibiting surface 3F to inhibit rotation of the inner cylinder.
Abstract:
A semiconductor device and a manufacturing method therefor which can simultaneously realize both a reduction in base transit time by a reduction in base width and a reduction in base resistance by a reduction in link base resistance. The semiconductor device is manufactured by the method including the steps of forming a first impurity diffused layer of a first conduction type in a semiconductor substrate; forming a conducting film connected to the first impurity diffused layer; forming a first insulating film on the conducting film; forming a first hole through a laminated film composed of the first insulating film and the conducting film; forming a second impurity diffused layer of the first conduction type in the semiconductor substrate exposed to the first hole; forming a side wall from a second insulating film in the first hole to form a second hole; and forming a third impurity diffused layer of the first conduction type in the semiconductor substrate exposed to the second hole.
Abstract:
The present invention pertains to a high-performance thin film transistor having a gate and an active region, whose active region comprises a poly-Si.sub.1 -.sub.x Ge.sub.x alloy material and a channel layer of silicon, in which the channel layer of silicon is interposed between the poly-Si.sub.1-x Ge.sub.x alloy material and the gate, and a method for fabricating such a high-performance thin film transistor.