Abstract:
To provide an adhesive sheet for wafer processing that satisfies characteristics such as: (1) protecting an uneven circuit surface during grinding with an adhesive force that is not excessively weak; (2) being easy to remove after processing; and (3) leaving very little adhesive residue on the wafer, and that can preferably be used as a removable BG sheet or the like. This adhesive sheet for wafer processing is characterized in having a substrate and an adhesive layer formed on the substrate, the adhesive layer having an adhesive polymer (A) and a polyrotaxane (B) having a linear-chain molecule passing through the opening of the at least two cyclic molecules, and having a block group at both ends of the linear-chain molecule, the adhesive polymer (A) and the cyclic molecule of the polyrotaxane (B) being linked together to form a crosslinked structure.
Abstract:
An adhesive resin composition of the present invention includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin.
Abstract:
A laminate body includes a base material, a film-like or a membrane-like undercoat layer that is formed in at least a portion of the outer surface of the base material, and an atomic layer deposition film that is formed on a surface opposite to a surface coming into contact with the base material among both surfaces of the undercoat layer in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film bind to the undercoat layer, and the atomic layer deposition film is formed into a membrane shape covering the undercoat layer.
Abstract:
The present invention relates to an adhesive resin composition for a decorative film, and to a decorative film including same. In the present invention, an amine-based (including N) accelerator having a functional group which can react with active hydrogen is used for increasing the reaction rate of an adhesive resin which is required for the preparation of a decorative film having a metallic effect, thereby ensuring coating stability and increasing the reaction rate. Thus, according to the present invention, an adhesive resin which has little deviation in quality (boil resistance) between and within rolls can be provided in a short time.
Abstract:
The invention relates to a process for preparing a pressure-sensitive adhesive based on at least one polymer, in the course of which said at least one polymer is crosslinked, the polymer having functional groups Y and having been admixed, further, with at least one kind of functionalized particles which have at least one nonpolymeric base unit, wherein the particles having a surface modification of the base unit, the surface modification of the particles having at least one kind of functional groups Z, which can not undergo any reaction with the functional group Y and is converted into group X by thermal energy, electromagnetic radiation, particulate radiation and/or sound energy and the crosslinking of the polymer being brought about at least in part by a reaction of the functional groups X of the particles and the functional groups Y of the polymer, and further to pressure-sensitive adhesives based on at least one crosslinked polymer component, the crosslinking of the polymer component being brought about at least in part by incorporation of the functionalized particles, the particles having at least one nonpolymeric base unit and also a surface modification of this base unit, and the surface modification of the particles having at least one kind of functional groups Z which, after conversion to group X by way of thermal energy, electromagnetic radiation, particulate radiation and/or sound energy, are capable of reacting with functional groups Y present in the polymer component, and also to the use of surface-modified functionalized particles having a nonpolymeric base unit as crosslinking reagents for crosslinking polymers for preparing pressure-sensitive adhesives.
Abstract:
Described are adhesive compositions containing a mixture of a pressure sensitive adhesive, a high Tg polymer, and a crosslinker to form a compatibilized blend that is optically clear. Methods of using the adhesive compositions, and multilayer assemblies such as optical elements prepared using the adhesives, are also provided.
Abstract:
Adhesives comprising up to about 40 wt % of an ionomer can be applied at low temperatures and exhibit good bond strength. The adhesives are particularly useful as elastic attachment adhesives.
Abstract:
A two-component bonding agent system, comprising (a) a polymer with at least two Michael acceptor groups with an average molecular weight of from 1,000 g/mol to 1,000,000 g/mol, (b) a polymer or oligomer with at least two primary or secondary amino groups or blocked amino groups, and (c) optionally, additive, auxiliary and/or catalyst, is described.The adhesive made from the two-component bonding agent systems is useful for composite films, particularly suited for packaging foodstuffs and luxury foods and medicinal products.
Abstract:
The present invention relates to the thermoplastic hydrophilic adhesive compositions having an increased adhesion capability and stability on moist or wet surfaces. The adhesive compositions comprise a thermoplastic hydrophilic homogeneous polymeric matrix having selected liquid absorption capacity, liquid absorption rate, and rheology. The adhesive compositions of the present invention are particularly suitable as topical adhesives for skin adhesion of articles such as disposable waste management articles, disposable absorbent articles, and personal care articles.
Abstract:
An optical article includes a rigid substrate, a reflective polarizer, and an adhesive composition disposed between the substrate and the polarizer. The adhesive composition includes a majority of a pressure sensitive adhesive component, a high Tg polymer, and a crosslinker. The pressure sensitive adhesive component includes at least one polymer having an acid or base functionality. The high Tg polymer has a weight average molecular weight greater than 100,000, a Tg greater than about 20° C., and an acid or base functionality. The functionality of the pressure sensitive adhesive component and the functionality of the high Tg polymer form an acid-base interaction when mixed. The adhesive composition is optically clear.