Passive nutrient delivery system
    84.
    发明授权

    公开(公告)号:US10945389B1

    公开(公告)日:2021-03-16

    申请号:US15896820

    申请日:2018-02-14

    Inventor: Howard G. Levine

    Abstract: A passive nutrient delivery system for plant growth includes a rooting module having a body portion having a top, a bottom, and a sidewall extending between the top and the bottom. The rooting module further includes a hydrophilic plug, having an opening, in a first portion of the interior of the body portion adjacent the top of the body portion, and a substrate in a second portion of the interior of the body portion between the bottom and the plug. The rooting module further includes an oxygen permeable area in the sidewall of the body portion, a first wicking material extending through the sidewall of the body portion into the interior of the body portion, and a second wicking material extending through the body of the body portion into the interior of the body portion, through the interior of the body portion, and through the opening of the plug. The passive nutrient delivery system also comprises a reservoir wherein a port can receive the removable rooting module.

    Indium bump liftoff process on micro-machined silicon substrates

    公开(公告)号:US10923446B1

    公开(公告)日:2021-02-16

    申请号:US16567126

    申请日:2019-09-11

    Abstract: A metallic etching process includes applying an anti-reflection coating over a metallic superstrate, applying a dry film photoresist over the anti-reflection coating, removing exposed portions of the dry film photoresist exposing a portion of the anti-reflection coating, etching the exposed portions of the anti-reflection coating exposing portions of the metal superstrate, etching portions of the metallic superstrate not covered by the dry film photoresist, and removing the dry film photoresist and the anti-reflection coating leaving portions of the metallic superstrate. An indium bump liftoff process includes applying a positive photoresist, forming a liftoff mask by applying a dry film photoresist over the positive photoresist, removing exposed portions of the liftoff mask to expose a portion of a substrate, depositing an indium film over the exposed portion of the substrate and remaining portions of the liftoff mask, and removing remaining portions of the liftoff mask.

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