公开(公告)号：US20060183042A1

公开(公告)日：2006-08-17

申请号：US11060636

申请日：2005-02-16

Applicant: Wen-Yao Huang ,  Yen-Cheng Tsai ,  Jun-Lung Lee ,  Shih-Chien Chiu ,  Chih-Hwa Cherng ,  Chung-Chih Wu ,  Wen-Yi Hung ,  Yu-Ting Lin ,  Tsung-Li Liu ,  Ping-Yuan Hsieh ,  Ken-Tsung Wong ,  Fu-Chuan Fang ,  Yuh-Yih Chien ,  Chung-Feng Wang ,  Ruei-Tang Chen ,  Teng-Chih Chao ,  You-Ming Chen

Inventor： Wen-Yao Huang ,  Yen-Cheng Tsai ,  Jun-Lung Lee ,  Shih-Chien Chiu ,  Chih-Hwa Cherng ,  Chung-Chih Wu ,  Wen-Yi Hung ,  Yu-Ting Lin ,  Tsung-Li Liu ,  Ping-Yuan Hsieh ,  Ken-Tsung Wong ,  Fu-Chuan Fang ,  Yuh-Yih Chien ,  Chung-Feng Wang ,  Ruei-Tang Chen ,  Teng-Chih Chao ,  You-Ming Chen

IPC: G03G5/06 ,  G03G5/047 ,  C07F7/02 ,  C07C13/48

CPC classification number: C07C13/567 ,  C07C13/72 ,  G03G5/047 ,  G03G5/0607

Abstract: A substituted oligofluorene for organic light-emitting diode (OLED) and organic photoconductor (OPC) has a chemical structure of: wherein X and Y are an integer of 0 or 1, G1 and G2 are independently of either CnH2n+1 or CnH2n+1O; and n is an integer of 0 to 16.

Abstract translation: 用于有机发光二极管（OLED）和有机光电导体（OPC）的取代的低聚芴具有以下化学结构：其中X和Y为0或1的整数，G 1和G 2， 2个独立于C n H 2n + 1或C n H 2n + 1 / O; n为0〜16的整数。

公开(公告)号：US07017201B2

公开(公告)日：2006-03-28

申请号：US10759368

申请日：2004-01-15

Applicant: Yu-Ting Lin

Inventor： Yu-Ting Lin

IPC: A47C13/38

CPC classification number: A47C17/62

Abstract: The present invention relates to a table structure that can be converted into bed or table according to user's needs. Wherein a base frame of the present invention is respectively provided with a bed having two L-shape side frames and a table having two side shelves. The two side shelves of the table are connected to the base frame through spiral arms, by virtue of the pivotal connection between the L-shape side frames and the side shelves, the bed can be positioned respectively in a horizontal manner or in a vertical manner. Through the spiral arms, the table can be lowered down or raised up relative to the bed, such that the device of the present invention can be converted into a bed or a table as desired.

Abstract translation: 本发明涉及一种可根据用户需要转换成床或桌的桌面结构。 其中，本发明的基架分别设有具有两个L形侧框架的台架和具有两个侧架的工作台。 桌子的两侧架子通过螺旋臂连接到基架上，由于L形侧框架和侧架之间的枢转连接，床可以分别以水平方式或垂直方式定位 。 通过螺旋臂，桌子可以相对于床下降或升高，使得本发明的装置可以根据需要被转换成床或桌子。

公开(公告)号：US20050170630A1

公开(公告)日：2005-08-04

申请号：US10768848

申请日：2004-01-29

Applicant: Yia-Liang Kuo ,  Yu-Chang Lin ,  Yu-Ting Lin

Inventor： Yia-Liang Kuo ,  Yu-Chang Lin ,  Yu-Ting Lin

IPC: H01L21/44 ,  H01L21/60 ,  H01L23/485

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05085 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05099

Abstract: Novel methods for reducing shear stress applied to solder bumps on a flip chip. The methods are particularly applicable to reducing temperature-induced shear stress on solder bumps located adjacent to an empty space on a flip chip during high-temperature testing of the chip. According to a first embodiment, the method includes providing an anchoring solder bump in each empty space on the flip chip. The anchoring solder bumps impart additional structural integrity to the flip chip and prevent shear-induced detachment of solder bumps from the flip chip, particularly those solder bumps located adjacent to each anchoring solder bump. According to a second embodiment, the method includes providing an anchoring solder bump in the empty space and then connecting the anchoring solder bump to an adjacent solder bump on the chip using a solder bridge.

Abstract translation: 用于减少施加到倒装芯片上的焊料凸块的剪切应力的新方法。 该方法特别适用于在芯片的高温测试期间减少与倒装芯片上的空白空间相邻的焊料凸块上的温度诱导剪切应力。 根据第一实施例，该方法包括在倒装芯片上的每个空白空间中提供锚定焊​​料凸块。 锚定焊料凸块对倒装芯片赋予额外的结构完整性，并防止焊料凸块从倒装芯片，特别是位于每个锚定焊料凸块附近的焊料凸块的剪切引起的分离。 根据第二实施例，该方法包括在空间中提供锚定焊​​料凸块，然后使用焊接桥将锚定焊料凸块连接到芯片上的相邻焊料凸块。

公开(公告)号：US20050110140A1

公开(公告)日：2005-05-26

申请号：US10718192

申请日：2003-11-20

Applicant: Yian-Liang Kuo ,  Yung-Sheng Huang ,  Yu-Ting Lin

Inventor： Yian-Liang Kuo ,  Yung-Sheng Huang ,  Yu-Ting Lin

IPC: H01L23/31 ,  H01L23/36 ,  H01L23/42 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/36 ,  H01L23/3128 ,  H01L23/42 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of forming a heat spreader ball grid array package, and the resultant heat spreader ball grid array package, comprising the following steps. A semiconductor chip affixed to a ball grid substrate is provided. The semiconductor chip over the ball grid substrate is encased with a molding compound. A heat spreader is mounted over the ball grid substrate and spaced apart from the molding compound to form a gap. Thermal grease is placed into the gap, at least between the heat spreader and the molding compound, to form the heat spreader ball grid array package. It is also possible to place thermal grease over the molding compound and then mounting the heat spreader over the ball grid substrate.

Abstract translation: 一种形成散热器球栅阵列封装的方法，以及所得的散热器球栅阵列封装，包括以下步骤。 提供固定在球栅基板上的半导体芯片。 球形栅极衬底上的半导体芯片被模制化合物封装。 散热器安装在球栅基板上并与模塑料间隔开以形成间隙。 至少在散热器和模塑料之间，将热油脂放置在间隙中，形成散热器球栅阵列封装。 还可以将热油脂放置在模制化合物上，然后将散热器安装在球栅基板上。