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公开(公告)号：US20210131415A1
公开(公告)日：2021-05-06
申请号：US17081890
申请日：2020-10-27
Applicant: Frore Systems Inc.
Inventor： Ananth Saran Yalamarthy , Vikram Mukundan , Suryaprakash Ganti , Narayana Prasad Rayapati , Prabhu Sathyamurthy , Seshagiri Rao Madhavapeddy , Marc Mignard , Brian James Gally
Abstract: A system including an orifice plate, a fan element and at least one channel is disclosed. The orifice plate has at least one orifice therein. The fan element is configured to undergo vibrational motion to drive a fluid through the orifice(s). The fluid is drawn through the channel(s) in response to the fluid being driven through the at least one orifice.
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公开(公告)号：US10998254B2
公开(公告)日：2021-05-04
申请号：US16369777
申请日：2019-03-29
Applicant: Frore Systems Inc.
Inventor： Suryaprakash Ganti , Seshagiri Rao Madhavapeddy
IPC: H01L23/473 , F04B53/10 , F04B43/04 , F04B45/047 , B06B1/06 , H01L23/427 , H01L23/433 , H01L41/09 , H05K7/20 , F25B21/02 , F04D33/00 , H04M1/02 , H01L41/02 , H01L41/00 , F04B43/09 , H01L23/46 , H01L23/42 , F04B17/00 , F04B45/04 , H01L41/08
Abstract: A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.
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公开(公告)号：US10943850B2
公开(公告)日：2021-03-09
申请号：US16369766
申请日：2019-03-29
Applicant: Frore Systems Inc.
Inventor： Suryaprakash Ganti , Seshagiri Rao Madhavapeddy
IPC: H05K7/20 , H01L23/473 , F04B53/10 , F04B43/04 , F04B45/047 , B06B1/06 , H01L23/427 , H01L23/433 , H01L41/09 , F25B21/02 , F04D33/00 , H04M1/02 , H01L41/02 , H01L41/00 , F04B43/09 , H01L23/46 , H01L23/42 , F04B17/00 , F04B45/04 , H01L41/08
Abstract: An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.
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公开(公告)号：US20200049388A1
公开(公告)日：2020-02-13
申请号：US16369821
申请日：2019-03-29
Applicant: Frore Systems Inc.
Inventor： Suryaprakash Ganti , Seshagiri Rao Madhavapeddy
IPC: F25B21/02
Abstract: A cooling system and method for using the cooling system are described. The cooling system includes an array of cooling elements and a controller. The array of cooling elements corresponds to regions of the heat-generating structure where heat is generated in response to operation of the semiconductor. The controller is configured to activate portions of the array of cooling elements based on a determination that operation of the heat-generating structure is likely to generate heat in a given region of the heat-generating structure.
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公开(公告)号：US20200049387A1
公开(公告)日：2020-02-13
申请号：US16369801
申请日：2019-03-29
Applicant: Frore Systems Inc.
Inventor： Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Leonard Eugene Fennell , Vikram Mukundan
Abstract: A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.
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Patent Agency Ranking
公开(公告)号：US20200049386A1
公开(公告)日：2020-02-13
申请号：US16369777
申请日：2019-03-29
Applicant: Frore Systems Inc.
Inventor： Suryaprakash Ganti , Seshagiri Rao Madhavapeddy
IPC: F25B21/02
Abstract: A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.
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公开(公告)号：US20250142784A1
公开(公告)日：2025-05-01
申请号：US18939317
申请日：2024-11-06
Applicant: Frore Systems Inc.
Inventor： Prabhu Sathyamurthy , Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Vikram Mukundan , Narayana Prasad Rayapati , Brian James Gally , William Finn Ninian Paisley
IPC: H05K7/20
Abstract: A thermal management system is described. The thermal management system includes a heat sink structure and an array of microelectromechanical system (MEMS) jets. The heat sink structure is in thermal communication with a plurality of heat sources. The heat sink structure includes fins and a collection channel. The array of MEMS jets is arranged to cause a fluid to impinge on a surface of each of the fins and to be directed through the collection channel.
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公开(公告)号：US12240750B2
公开(公告)日：2025-03-04
申请号：US17474815
申请日：2021-09-14
Applicant: Frore Systems Inc.
Inventor： Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Vikram Mukundan , Ananth Saran Yalamarthy , Prabhu Sathyamurthy , Brian James Gally
Abstract: A system including a plurality of cooling cells is described. Each of the cooling cells includes a support structure and a cooling element. The cooling element has a central region having an axis and a perimeter. The cooling element IS supported by the support structure at the central region and along the axis. At least a portion of the perimeter being unpinned. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. A portion of the cooling cells aligned along the axis are physically connected such that the cooling cells form an integrated cooling cell tile.
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公开(公告)号：US20250031350A1
公开(公告)日：2025-01-23
申请号：US18907306
申请日：2024-10-04
Applicant: Frore Systems Inc.
Inventor： Ananth Saran Yalamarthy , Suryaprakash Ganti , Vikram Mukundan , Seshagiri Rao Madhavapeddy , Prabhu Sathyamurthy , Narayana Prasad Rayapati
Abstract: A cooling system is described. The cooling system includes a cooling element having a central region and a perimeter. The cooling element is anchored at the central region. At least a portion of the perimeter is unpinned. The cooling element is in communication with a fluid. The cooling element is actuated to induce vibrational motion to drive the fluid toward a heat-generating structure.
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公开(公告)号：US20240373593A1
公开(公告)日：2024-11-07
申请号：US18774103
申请日：2024-07-16
Applicant: Frore Systems Inc.
Inventor： Prabhu Sathyamurthy , Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Lumaya Ahmed , Shekhar Halakatti
IPC: H05K7/20 , B06B1/06 , H01L23/427 , H01L23/433 , H10N30/20
Abstract: A cooling system including a heat spreader and a cooling element is described. The heat spreader is thermally coupled with a heat-generating structure. The cooling element is in fluid communication heat spreader. The heat-generating structure is offset from the cooling element. The cooling element undergoes vibrational motion when actuated to drive a fluid toward the heat spreader while not directing the fluid directly at the heat-generating structure.
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