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公开(公告)号:US20170288642A1
公开(公告)日:2017-10-05
申请号:US15088987
申请日:2016-04-01
Applicant: Intel Corporation
Inventor: Feras EID , Georgios C. DOGIAMIS , Valluri R. RAO , Adel A. ELSHERBINI , Johanna M. SWAN , Telesphor KAMGAING , Vijay K. NAIR
CPC classification number: H03H9/54 , H03H9/05 , H03H9/0542 , H03H9/17 , H03H9/173 , H03H9/2463 , H03H2009/02503 , H03H2009/155
Abstract: Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes.
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公开(公告)号:US20170285695A1
公开(公告)日:2017-10-05
申请号:US15089001
申请日:2016-04-01
Applicant: Intel Corporation
Inventor: Vijay K. NAIR , Feras EID , Adel A. ELSHERBINI , Telesphor KAMGAING , Georgios C. DOGIAMIS , Valluri R. RAO , Johanna M. SWAN
CPC classification number: G06F1/18 , H03H9/0542 , H03H9/0557 , H03H9/542 , H03H9/545 , H03H9/56 , H03H9/587
Abstract: Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.
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