公开(公告)号：US08545792B2

公开(公告)日：2013-10-01

申请号：US12960643

申请日：2010-12-06

Applicant: Kai Liu ,  Kai-Li Jiang ,  Ying-Hui Sun ,  Shou-Shan Fan

Inventor： Kai Liu ,  Kai-Li Jiang ,  Ying-Hui Sun ,  Shou-Shan Fan

IPC: C09C1/56

CPC classification number: B82Y40/00 ,  B82Y30/00 ,  C01B32/168 ,  C01B2202/08

Abstract: A method for making a carbon nanotube structure is introduced. The method includes the following steps. A carbon nanotube precursor including a number of carbon nanotubes is provided. The carbon nanotube precursor is placed in a chamber with low oxygen environment. The carbon nanotube precursor is heated in the chamber.

Abstract translation: 引入制造碳纳米管结构的方法。 该方法包括以下步骤。 提供了包含多个碳纳米管的碳纳米管前体。 将碳纳米管前体置于具有低氧环境的室中。 碳纳米管前体在室中加热。

公开(公告)号：US08433068B2

公开(公告)日：2013-04-30

申请号：US13577915

申请日：2010-09-20

Applicant: Kai Liu ,  Zhiping Zhang ,  Yongli Zuo ,  Qingpeng Duan ,  Bin Li

Inventor： Kai Liu ,  Zhiping Zhang ,  Yongli Zuo ,  Qingpeng Duan ,  Bin Li

IPC: H04K1/00

CPC classification number: H04L63/0414 ,  H04M1/575 ,  H04W12/02 ,  H04W12/08 ,  H04W12/12 ,  H04W48/16 ,  H04W76/10

Abstract: The disclosure discloses a method for communication based on pseudo-contact information, which including: when a call is received, acquiring contact information of a calling party, and encrypting the contact information by using a preset encryption algorithm to acquire pseudo-contact information; when the pseudo-contact information does not match locally stored pseudo-contact information, displaying real contact information of the calling party, wherein the locally stored pseudo-contact information represents the pseudo-contact information generated by encrypting the contact information to be stored according to the preset encryption algorithm and locally stored; and when the pseudo-contact information matches the locally stored pseudo-contact information, displaying a substituted contact information generated by substituting a plurality of bits of the real contact information of the calling party with an identifier. The disclosure further discloses another method for communication based on pseudo-contact information and an apparatus for communication based on pseudo-contact information. The disclosure can solve the problems of higher operation complexity and lower safety performance of the method for protecting contact information stored on a terminal mentioned in the related art.

Abstract translation: 本发明公开了一种基于伪联系信息的通信方法，包括：当接收到呼叫时，获取主叫方的联系人信息，并通过使用预设的加密算法对联系人信息进行加密以获取伪联系信息; 当伪接触信息与本地存储的伪接触信息不匹配时，显示主叫方的真实联系人信息，其中本地存储的伪联系信息表示通过加密根据以下内容存储的联系人信息而生成的伪联系信息 预设的加密算法和本地存储; 并且当伪接触信息与本地存储的伪联系信息匹配时，显示通过用标识符代替主叫方的真实联系人信息的多个比特来生成的替代联系人信息。 本公开还公开了另一种基于伪接触信息的通信方法和基于伪接触信息的通信装置。 本公开可以解决用于保护存储在现有技术中提到的终端上的联系人信息的方法的更高的操作复杂性和较低的安全性能的问题。

公开(公告)号：US08349648B2

公开(公告)日：2013-01-08

申请号：US12816225

申请日：2010-06-15

Applicant: HyunTai Kim ,  YongTaek Lee ,  Gwang Kim ,  ByungHoon Ahn ,  Kai Liu

Inventor： HyunTai Kim ,  YongTaek Lee ,  Gwang Kim ,  ByungHoon Ahn ,  Kai Liu

IPC: H01L21/98

CPC classification number: H01L27/0676 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L27/016 ,  H01L27/0805 ,  H01L28/10 ,  H01L28/40 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device has a substrate and RF FEM formed over the substrate. The RF FEM includes an LC low-pass filter having an input coupled for receiving a transmit signal. A Tx/Rx switch has a first terminal coupled to an output of the LC filter. A diplexer has a first terminal coupled to a second terminal of the Tx/Rx switch and a second terminal for providing an RF signal. An IPD band-pass filter has an input coupled to a third terminal of the Tx/Rx switch and an output providing a receive signal. The LC filter includes conductive traces wound to exhibit inductive and mutual inductive properties and capacitors coupled to the conductive traces. The IPD filter includes conductive traces wound to exhibit inductive and mutual inductive properties and capacitors coupled to the conductive traces. The RF FEM substrate can be stacked over a semiconductor package containing an RF transceiver.

Abstract translation: 半导体器件具有在衬底上形成的衬底和RF FEM。 RF FEM包括具有耦合用于接收发射信号的输入的LC低通滤波器。 Tx / Rx开关具有耦合到LC滤波器的输出的第一端子。 双工器具有耦合到Tx / Rx开关的第二端子的第一端子和用于提供RF信号的第二端子。 IPD带通滤波器具有耦合到Tx / Rx开关的第三端子的输入端和提供接收信号的输出端。 LC滤波器包括缠绕的导电迹线以显示感应和互感特性以及耦合到导电迹线的电容器。 IPD滤波器包括缠绕的导电迹线以显示感应和互感特性以及耦合到导电迹线的电容器。 RF FEM衬底可以堆叠在包含RF收发器的半导体封装上。

公开(公告)号：US08339514B2

公开(公告)日：2012-12-25

申请号：US12274702

申请日：2008-11-20

Applicant: Thomas P. Dawson ,  Aixin Liu ,  Kai Liu ,  Andy Nguyen ,  Ling Jun Wong

Inventor： Thomas P. Dawson ,  Aixin Liu ,  Kai Liu ,  Andy Nguyen ,  Ling Jun Wong

IPC: H04N5/44

CPC classification number: H04N5/4401 ,  G06F8/65 ,  G06F9/44526 ,  H04N21/436 ,  H04N21/4431 ,  H04N21/4433

Abstract: Rather than have a unique code set per TV product, a common code base is provided to service multiple products and even multiple product lines. Embedded systems can be upgraded through a network connection. The software architecture provides a flexible approach to supporting multiple product offerings through a plug-in modular middle-ware and to providing standardized hardware acceleration for both 2D and 3D graphics. The plug-in capability provides for feature additions and upgrades after sale.

Abstract translation: 而不是每个电视产品都有一个唯一的代码集，而是提供一个通用的代码库来为多个产品甚至多个产品线提供服务。 嵌入式系统可以通过网络连接进行升级。 软件架构提供了一种灵活的方法，通过插件模块化中间件支持多种产品，并为2D和3D图形提供标准化的硬件加速。 插件功能提供售后功能添加和升级。

公开(公告)号：US20120319302A1

公开(公告)日：2012-12-20

申请号：US13163026

申请日：2011-06-17

Applicant: YongTaek Lee ,  HyunTai Kim ,  Gwang Kim ,  ByungHoon Ahn ,  Kai Liu

Inventor： YongTaek Lee ,  HyunTai Kim ,  Gwang Kim ,  ByungHoon Ahn ,  Kai Liu

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L23/3121 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/645 ,  H01L23/66 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/16 ,  H01L2223/6672 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/92247 ,  H01L2225/06558 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2924/00014

Abstract: A semiconductor device has a first semiconductor die containing a low pass filter and baluns. The first semiconductor die has a high resistivity substrate. A second semiconductor die including a bandpass filter is mounted to the first semiconductor die. The second semiconductor die has a gallium arsenide substrate. A third semiconductor die including an RF switch is mounted to the first semiconductor die. A fourth semiconductor die includes an RF transceiver. The first, second, and third semiconductor die are mounted to the fourth semiconductor die. The first, second, third, and fourth semiconductor die are mounted to a substrate. An encapsulant is deposited over the first, second, third, and fourth semiconductor die and substrate. A plurality of bond wires is formed between the second semiconductor die and first semiconductor die, and between the third semiconductor die and first semiconductor die, and between the first semiconductor die and substrate.

Abstract translation: 半导体器件具有包含低通滤波器和巴伦的第一半导体管芯。 第一半导体管芯具有高电阻率的衬底。 包括带通滤波器的第二半导体管芯被安装到第一半导体管芯。 第二半导体管芯具有砷化镓基板。 包括RF开关的第三半导体管芯被安装到第一半导体管芯。 第四半导体管芯包括RF收发器。 第一，第二和第三半导体管芯安装到第四半导体管芯。 第一，第二，第三和第四半导体管芯安装在基板上。 密封剂沉积在第一，第二，第三和第四半导体管芯和衬底上。 在第二半导体管芯和第一半导体管芯之间以及第三半导体管芯和第一半导体管芯之间以及第一半导体管芯和衬底之间形成多个接合线。

公开(公告)号：US20120267800A1

公开(公告)日：2012-10-25

申请号：US13543088

申请日：2012-07-06

Applicant: Yaojian Lin ,  Robert C. Frye ,  Pandi Chelvam Marimuthu ,  Kai Liu

Inventor： Yaojian Lin ,  Robert C. Frye ,  Pandi Chelvam Marimuthu ,  Kai Liu

IPC: H01L25/16 ,  H01L23/522

CPC classification number: H01L23/49816 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/14163 ,  H01L2224/14165 ,  H01L2224/2101 ,  H01L2224/214 ,  H01L2224/221 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: A semiconductor wafer contains semiconductor die. A first conductive layer is formed over the die. A resistive layer is formed over the die and first conductive layer. A first insulating layer is formed over the die and resistive layer. The wafer is singulated to separate the die. The die is mounted to a temporary carrier. An encapsulant is deposited over the die and carrier. The carrier and a portion of the encapsulant and first insulating layer is removed. A second insulating layer is formed over the encapsulant and first insulating layer. A second conductive layer is formed over the first and second insulating layers. A third insulating layer is formed over the second insulating layer and second conductive layer. A third conductive layer is formed over the third insulating layer and second conductive layer. A fourth insulating layer is formed over the third insulating layer and third conductive layer.

Abstract translation: 半导体晶片包含半导体晶片。 在模具上形成第一导电层。 在管芯和第一导电层上形成电阻层。 在管芯和电阻层上形成第一绝缘层。 将晶片单片化以分离模具。 模具安装到临时托架上。 密封剂沉积在模具和载体上。 移除载体和密封剂和第一绝缘层的一部分。 在密封剂和第一绝缘层之上形成第二绝缘层。 在第一绝缘层和第二绝缘层上形成第二导电层。 在第二绝缘层和第二导电层上形成第三绝缘层。 在第三绝缘层和第二导电层上形成第三导电层。 在第三绝缘层和第三导电层上形成第四绝缘层。

公开(公告)号：US08290374B2

公开(公告)日：2012-10-16

申请号：US12646701

申请日：2009-12-23

Applicant: Junrui Li ,  Jing Nui ,  Chunyan Yang ,  Changbin Hu ,  Kai Liu

Inventor： Junrui Li ,  Jing Nui ,  Chunyan Yang ,  Changbin Hu ,  Kai Liu

IPC: H04B10/12

CPC classification number: H04B10/697 ,  H04B10/032 ,  H04J14/0295

Abstract: A dispersion compensation method and a dispersion compensation device in an optical communication system are provided. The method mainly includes the following steps. A dispersion compensation value transmitted through a working path at a second wavelength is received through a non-working path at a first wavelength in an optical communication system. The non-working path at the first wavelength and the working path at the second wavelength use the same service channel. Dispersion in the non-working path at the first wavelength is compensated according to the dispersion compensation value. Therefore, no matter the working path is a main path or a backup path, the dispersion compensation value on the non-working path can be accurately regulated in time, such that the dispersion of the working path reaches an optimal status each time after the protection switching occurs to the service, thereby ensuring the fast switching of the service.

Abstract translation: 提供了一种光通信系统中的色散补偿方法和色散补偿装置。 该方法主要包括以下步骤。 通过光通信系统中的第一波长的非工作路径接收通过第二波长的工作路径发送的色散补偿值。 第一波长的非工作路径和第二波长的工作路径使用相同的服务信道。 根据色散补偿值补偿在第一波长的非工作路径中的色散。 因此，无论工作路径为主路径还是备用路径，都能够及时准确地调整非工作路径上的色散补偿值，使得工作路径的分散在保护后每次达到最佳状态 对服务进行切换，从而确保服务的快速切换。

公开(公告)号：US08269575B2

公开(公告)日：2012-09-18

申请号：US12750555

申请日：2010-03-30

Applicant: Robert C. Frye ,  Kai Liu

Inventor： Robert C. Frye ,  Kai Liu

IPC: H03H7/42 ,  H01P3/08

CPC classification number: H01L23/5227 ,  H01L23/5223 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/41 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device has an RF balun formed over a substrate. The RF balun includes a first conductive trace wound to exhibit inductive properties with a first end coupled to a first terminal of the semiconductor device and second end coupled to a second terminal of the semiconductor device. A first capacitor is coupled between the first and second ends of the first conductive trace. A second conductive trace is wound to exhibit inductive properties with a first end coupled to a third terminal of the semiconductor device and second end coupled to a fourth terminal of the semiconductor device. The first conductive trace is formed completely within the second conductive trace. The first conductive trace and second conductive trace can have an oval, circular, or polygonal shape separated by 50 micrometers. A second capacitor is coupled between the first and second ends of the second conductive trace.

Abstract translation: 半导体器件具有在衬底上形成的RF平衡 - 不平衡变压器。 RF平衡 - 不平衡变压器包括缠绕以显示感应特性的第一导电迹线，其中第一端耦合到半导体器件的第一端子，第二端耦合到半导体器件的第二端子。 第一电容器耦合在第一导电迹线的第一和第二端之间。 第二导电迹线被卷绕以呈现感应特性，其中第一端耦合到半导体器件的第三端子，第二端耦合到半导体器件的第四端子。 第一导电迹线完全在第二导电迹线内形成。 第一导电迹线和第二导电迹线可以具有由50微米分开的椭圆形，圆形或多边形形状。 第二电容器耦合在第二导电迹线的第一端和第二端之间。

公开(公告)号：US20120224231A1

公开(公告)日：2012-09-06

申请号：US13497782

申请日：2010-09-14

Applicant: Qiangzi Cong ,  Tianxin Jiang ,  Lei Zheng ,  Lei Che ,  Kai Liu ,  Jigang Zhang

Inventor： Qiangzi Cong ,  Tianxin Jiang ,  Lei Zheng ,  Lei Che ,  Kai Liu ,  Jigang Zhang

IPC: G06K15/02

CPC classification number: B41J3/60 ,  B41J3/44 ,  B65H29/52 ,  B65H29/58 ,  B65H85/00 ,  B65H2301/314 ,  B65H2301/333 ,  B65H2301/5111 ,  B65H2404/632 ,  B65H2404/64 ,  B65H2553/22 ,  B65H2701/1912 ,  G06K9/186

Abstract: An apparatus for processing a recording medium with embedded information comprises: a passage mechanism including a first passage, a loop passage and recording medium conveying rollers, wherein a first opening and a second opening of the loop passage are connected to the tail end of the first passage; a first guide mechanism configured to selectively communicate the first passage with the first opening or the second opening of the loop passage; and a processing device including a magnetic head and a print head which are arranged in the first passage, wherein the magnetic head is arranged at a side of a recording medium inlet/outlet port which is adjacent to a leading end of the first passage. A method for processing the recording medium with embedded information is also disclosed. According to the apparatus and method for processing the recording medium mentioned above, the recording medium can be turned over automatically during moving through the loop passage, so that the printing on both sides of the recording medium can be realized by one single print head, and thus a comprehensive process on the recording medium with embedded information is realized, and the cost of the apparatus is reduced.

Abstract translation: 一种用于处理具有嵌入信息的记录介质的设备，包括：通道机构，包括第一通道，环路通道和记录介质输送辊，其中环路通道的第一开口和第二开口连接到第一通道 通道; 第一引导机构，其构造成选择性地将第一通道与环通道的第一开口或第二开口连通; 以及包括设置在第一通道中的磁头和打印头的处理装置，其中磁头布置在与第一通道的前端相邻的记录介质入口/出口侧。 还公开了一种用于处理具有嵌入信息的记录介质的方法。 根据上述记录介质的处理装置和方法，可以在通过环路通过的过程中自动翻转记录介质，从而可以通过一个打印头实现记录介质的两侧的打印，并且 从而实现了具有嵌入信息的记录介质上的综合处理，并且降低了设备的成本。

公开(公告)号：US08225501B2

公开(公告)日：2012-07-24

申请号：US12756032

申请日：2010-04-07

Applicant: Liang Liu ,  Zhuo Chen ,  Kai Liu ,  Chen Feng ,  Kai-Li Jiang ,  Shou-Shan Fan

Inventor： Liang Liu ,  Zhuo Chen ,  Kai Liu ,  Chen Feng ,  Kai-Li Jiang ,  Shou-Shan Fan

IPC: H05K3/02 ,  H05K3/10

CPC classification number: C23C14/0005 ,  H04R23/002

Abstract: The present invention relates to a method for making a thermoacoustic device. The method includes the following steps. A substrate with a surface is provided. A plurality of microspaces is formed on the surface of the substrate. A sacrifice layer is fabricated to fill the microspaces. A metal film is deposited on the sacrifice layer, and the sacrifice layer is removed. A signal input device is provided to electrically connect with the metal film.

Abstract translation: 本发明涉及制作热声装置的方法。 该方法包括以下步骤。 提供具有表面的基板。 在基板的表面上形成多个微孔。 制作牺牲层以填充微球。 在牺牲层上沉积金属膜，除去牺牲层。 提供信号输入装置以与金属膜电连接。