公开(公告)号：US20190157247A1

公开(公告)日：2019-05-23

申请号：US16098212

申请日：2017-05-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jürgen Moosburger ,  Frank Singer ,  Thomas Schwarz ,  Alexander Martin

IPC: H01L25/075 ,  H01L33/58 ,  H01L33/62 ,  G09F9/302

Abstract: A module for a video wall is disclosed. In an embodiment a module includes a carrier, a plurality of components comprising at least one light-emitting structural element arranged on the carrier and an optical element, wherein the components are arranged at a prespecified lateral distance in relation to one another, wherein a retaining recess is formed between at least two components, wherein the retaining recess comprises at least two component recesses of two components which are arranged next to one another, wherein a retaining pin is fastened in the retaining recess, wherein the retaining pin is connected to the optical element, and wherein the optical element is configured to influence light irradiation onto the components and/or light emission from the components.

公开(公告)号：US20190155564A1

公开(公告)日：2019-05-23

申请号：US16314467

申请日：2017-06-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer ,  Jürgen Moosburger ,  Karl Engl ,  Alexander Martin

IPC: G06F3/14 ,  G09G3/32

Abstract: An arrangement includes at least two modules for a video wall including light-emitting components arranged on a carrier, wherein a drive circuit that selectively drives the component at the carrier is provided for each component, row lines and column lines are provided, each drive circuit connects to a row line and a column line, each drive circuit connects to power supply lines, the carrier includes plated-through holes that guide the row lines and the column lines onto an underside of the carrier, the two modules are arranged on a further carrier, the further carrier includes at least one recess, an electrical connector is arranged in the recess, and the electrical connector connects column lines and/or row lines of the two modules to one another.

公开(公告)号：US20180358522A1

公开(公告)日：2018-12-13

申请号：US15771827

申请日：2016-10-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Stefan Listl ,  Björn Hoxhold ,  Frank Singer

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/44 ,  H01L33/48 ,  H01L33/56 ,  H01L33/50 ,  H01L23/00

CPC classification number: H01L33/62 ,  G09F9/3026 ,  G09F9/33 ,  H01L24/48 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/483 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2933/0025 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: An optoelectronic component includes a carrier, and a housing material arranged above a top side of a carrier, wherein a cavity is configured in the housing material, a top side of a first optoelectronic semiconductor chip is arranged in the cavity, the first optoelectronic semiconductor chip has a first electrical connection pad arranged at the top side of the first optoelectronic semiconductor chip, and electrically conductively connects by a bond wire to a first contact pad arranged at the top side of the carrier, a first section of the bond wire is arranged in the cavity and a second section of the bond wire is embedded the housing material, a covering material is arranged in the cavity and covers at least one part of the top side of the first optoelectronic semiconductor chip, and the first section of the bond wire is embedded in the covering material.

公开(公告)号：US20180287022A1

公开(公告)日：2018-10-04

申请号：US15524413

申请日：2015-11-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Wolfgang Moench ,  Frank Singer ,  Thomas Schwarz ,  Jürgen Moosburger ,  Stefan Illek

IPC: H01L33/58 ,  H01L33/50 ,  H01L33/62 ,  H02N1/00

CPC classification number: H01L33/58 ,  H01L33/0095 ,  H01L33/505 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0058 ,  H02N1/006

Abstract: A method of producing an optoelectronic component includes embedding an optoelectronic component part into a molded body such that an upper side of the optoelectronic component part is at least partially exposed on an upper side of the molded body; arranging and structuring a sacrificial layer above the upper side of the optoelectronic component part and the upper side of the molded body; arranging and structuring a layer of an optical material above the sacrificial layer; and removing the sacrificial layer.

公开(公告)号：US20180182926A1

公开(公告)日：2018-06-28

申请号：US15738427

申请日：2016-07-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Maute ,  Lutz Höppel ,  Jürgen Moosburger ,  Thomas Schwarz ,  Matthias Sabathil ,  Ralph Wirth ,  Alexander Linkov ,  Johannes Baur

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/38 ,  H01L33/24 ,  H01L33/60

CPC classification number: H01L33/46 ,  H01L33/20 ,  H01L33/24 ,  H01L33/30 ,  H01L33/382 ,  H01L33/385 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0083 ,  H01L2933/0091

Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.

公开(公告)号：US20180145234A1

公开(公告)日：2018-05-24

申请号：US15577045

申请日：2016-05-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Andreas Biebersdorf ,  Dirk Becker ,  Bernd Barchmann ,  Björn Hoxhold ,  Philipp Schlosser ,  Andreas Waldschik

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/00 ,  H01L25/075

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0075 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top, wherein the carrier has a metallic core material and at least on the carrier top a metal layer and following this a dielectric mirror are applied to the core material, forming at least two holes through the carrier, producing a ceramic layer with a thickness of at most 150 μm at least on the carrier underside and in the holes, wherein the ceramic layer includes the core material as a component, applying metallic contact layers to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes, and applying at least one radiation-emitting semiconductor chip to the carrier top and electrical bonding of the semiconductor chip to the contact layers.

公开(公告)号：US20180076370A1

公开(公告)日：2018-03-15

申请号：US15565239

申请日：2016-04-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Haushalter ,  Frank Singer ,  Thomas Schwarz ,  Andreas Ploessl

IPC: H01L33/64 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L33/642 ,  H01L33/005 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting component includes a light-emitting chip and a housing including a plastic body and a reflector, the reflector includes an electrically conductive layer, the light-emitting chip includes a top side and an underside, the underside of the light-emitting chip is arranged on the plastic body, an electrical terminal on the top side of the light-emitting chip electrically conductively connects to the reflector by a bond wire, the underside of the light-emitting chip and the reflector are electrically insulated from one another, a conduction region is provided within the plastic body, thermal conductivity of the conduction region is greater than thermal conductivity of the plastic body, the conduction region adjoins the underside of the light-emitting chip, and the conduction region extends from the side of the plastic body facing the light-emitting chip as far as the side of the plastic body facing away from the light-emitting chip.

公开(公告)号：US20170338384A1

公开(公告)日：2017-11-23

申请号：US15534155

申请日：2015-12-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer

IPC: H01L33/48 ,  H01L23/00 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L21/568 ,  H01L24/95 ,  H01L33/0079 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/01 ,  H01L2224/24 ,  H01L2224/82 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005

Abstract: A semiconductor device and a method for producing a plurality of semiconductor devices are disclosed. In an embodiment an optoelectronic semiconductor device includes a semiconductor chip having a semiconductor layer sequence with an active region, a radiation exit surface arranged parallel to the active region and a plurality of side faces arranged obliquely or perpendicular to the radiation exit surface. The device further includes a contact track electrically connecting the semiconductor chip to a contact surface configured to externally contact the semiconductor device, a molding and a rear side of the semiconductor chip remote from the radiation exit surface, the rear side being free of a material of the molding, wherein one of the side faces is configured as a mounting side face for fastening of the semiconductor device, and wherein the contact track runs on one of the side faces in places.

公开(公告)号：US09780269B2

公开(公告)日：2017-10-03

申请号：US15022535

申请日：2014-08-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer ,  Jürgen Moosburger

IPC: H01L33/00 ,  H01L33/54 ,  H01L33/62 ,  H01L33/48 ,  H01L33/52

CPC classification number: H01L33/54 ,  H01L21/568 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/2518 ,  H01L2224/82 ,  H01L2224/96 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor that is partly embedded into a shaped body, which is formed from a molding compound that at least partly covers at least two lateral faces and the rear surface of the optoelectronic semiconductor chip. A first contact layer and a second contact layer are arranged on the shaped body and are electrically connected to the optoelectronic semiconductor chip. A mounting face is arranged transversely in relation to the radiation passage face and is provided for mounting the optoelectronic semiconductor component.

公开(公告)号：US09691682B2

公开(公告)日：2017-06-27

申请号：US14413748

申请日：2013-07-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sabathil ,  Stefan Illek ,  Thomas Schwarz

IPC: H01L31/0232 ,  H01L23/373 ,  H01L33/64 ,  H01L31/024

CPC classification number: H01L23/3731 ,  H01L31/024 ,  H01L33/56 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/181 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optoelectronic semiconductor component includes an optoelectronic thin-film chip; and a thermally conductive and electrically insulating element, wherein both the thin-film chip and the element are embedded in a molded body, a top surface of the thin-film chip and a bottom surface of the element are not covered by the molded body, the top surface of the thin-film chip is approximately flush with a top surface of the molded body, the bottom surface of the element is approximately flush with a bottom surface of the molded body, the molded body includes a first embedded conductor structure and a second embedded conductor structure, and the first conductor structure and the second conductor structure extends to the bottom surface of the molded body.