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公开(公告)号：US20190394366A1
公开(公告)日：2019-12-26
申请号：US16165824
申请日：2018-10-19
Inventor： KUN LI , SHIN-WEN CHEN , LONG-FEI ZHANG , XIAO-MEI MA
IPC: H04N5/225 , H01L27/146 , H01R12/77
Abstract: An imaging chip packaging structure includes a circuit substrate, an imaging chip, and a pedestal. The circuit substrate has a first through hole extending through the circuit substrate. The imaging chip comprises a photosensitive area, and the first through hole through the substrate exposes the photosensitive area. The pedestal is integrated with the circuit substrate. The pedestal is formed on a first surface of the circuit substrate and comprises a second through hole on an optical path of the light reaching the imaging chip.
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公开(公告)号：US20190393362A1
公开(公告)日：2019-12-26
申请号：US16201959
申请日：2018-11-27
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： CHIA-WEI CHEN , SHIN-WEN CHEN
IPC: H01L31/0203 , H01L31/0216 , H01L31/02 , H01L31/18 , H01L31/0232
Abstract: An encapsulating structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a protecting sheet, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting sheet is mounted on the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the image sensor chip, the protecting sheet, and portion of surface of the protecting sheet away from the image sensor chip. A method for manufacturing same is also disclosed.
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公开(公告)号：US20190387157A1
公开(公告)日：2019-12-19
申请号：US16170037
申请日：2018-10-25
Inventor： CHIA-WEI CHEN , SHIN-WEN CHEN , DING-NAN HUANG
Abstract: A camera module comprises a circuit board and a base. A circuit board comprises a first surface and a second surface opposite to the first surface. At least one receiving groove is defined in the first surface. The receiving groove has not extended through the second surface. Each the at least one receiving groove receives an electronic component, and a height of the electronic component is less than a depth of the receiving groove. A base is fixed on the top surface. The at least one receiving groove is covered by the base to seal electronic components. A side surface of the base is aligned with a wall of the receiving groove.
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公开(公告)号：US20190384145A1
公开(公告)日：2019-12-19
申请号：US16158115
申请日：2018-10-11
Inventor： SHIN-WEN CHEN , JING-WEI LI , SHENG-JIE DING , JIAN-CHAO SONG
Abstract: An optical projector module proofed against distortion caused by heat building up in and around the light-emitting element includes a printed circuit board (PCB), a light emitting element, and an optical structure. The optical structure on the PCB includes a supporting member almost completely enclosing the light emitting element. The supporting member includes an embedded metal heat dissipating layer extending to cover outside surfaces of the supporting member. The metal heat dissipating layer occupies more than 70% of the outside surfaces of the supporting member, and being metallic the dissipating layer is able to conduct electricity.
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公开(公告)号：US20190331988A1
公开(公告)日：2019-10-31
申请号：US16022957
申请日：2018-06-29
Inventor： SHIN-WEN CHEN , JING-WEI LI , SHENG-JIE DING , JIAN-CHAO SONG
Abstract: An optical projector module protected against image distortion caused by heat building up in the light-emitting element includes a printed circuit board, and a light emitting element and an optical member mounted on the printed circuit board. The optical member includes a supporting structure which forms a housing. The housing contains the light emitting element, and a dissipating member made of electrically and thermally conductive metal is embedded on an inner surface of the housing. The housing extends outside of the housing and forms a path to carry away heat generated.
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Patent Agency Ranking
86.发明申请公开(公告)号：US20190170915A1
公开(公告)日：2019-06-06
申请号：US15869190
申请日：2018-01-12
Inventor： SHENG-JIE DING , JING-WEI LI , SHIN-WEN CHEN , KUN LI
Abstract: A light shielding member includes a transparent plate. The transparent plate includes a first surface and a second surface opposite to the first surface; the first surface of the transparent plate comprises a first light permeable area and a light shielding area surrounding the first light permeable area. The light shielding member further comprises a opaque adhesive layer formed on the light shielding area.
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87.发明公开公开(公告)号：US20230418050A1
公开(公告)日：2023-12-28
申请号：US17899001
申请日：2022-08-30
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： KUN LI , YU-XIANG YAN , SHIN-WEN CHEN , JIAN-CHAO SONG , WU-TONG WANG
IPC: G02B27/00
CPC classification number: G02B27/0006
Abstract: A dust collecting and blocking member with an aperture for a camera module, includes a frame body and an adhesive connected to the frame body. The frame body includes a first surface and a second surface opposites to the first surface, the aperture penetrates the first surface and the second surface, the first surface is recessed inwardly to form an annular groove, the annular groove circles the aperture. The adhesive is disposed inside the annular groove, and the frame body and adhesive function together to block trap and hold any dust present during manufacture of the camera module, to avoid an image quality which is less than optimal.
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88.发明公开公开(公告)号：US20230228971A1
公开(公告)日：2023-07-20
申请号：US17890465
申请日：2022-08-18
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： ZHUANG-ZHUANG JING , JING-WEI LI , SHIN-WEN CHEN
Abstract: A fast-focusing zoom camera module with precise and high-speed autofocus function includes a reflecting assembly, a lens assembly, and a light sensing assembly, the lens assembly is arranged between the reflecting assembly and the light sensing assembly. The reflecting assembly comprises a reflecting member and a first actuator, the first actuator driving the reflecting member to rotate around a second direction. The lens assembly comprises a lens member and a second actuator, the second actuator drives the lens member to move along a first direction. The light sensing assembly comprises a first circuit board, a sensor, and a third actuator, the sensor is electrically connected to the first circuit board, the third actuator drives the sensor to move along a third direction. The first direction, the second direction, and the third direction are perpendicular to each other.
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公开(公告)号：US20230213725A1
公开(公告)日：2023-07-06
申请号：US18070324
申请日：2022-11-28
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： JIAN-CHAO SONG , JING-WEI LI , SHENG-JIE DING , SHIN-WEN CHEN
Abstract: A lens module, constructed to include all necessary filters but retaining its wide-angle characteristic and short focal length, is comprised of a housing, a cover plate, and a filter switcher. The housing and the cover plate form a receiving cavity, the cavity containing the filter switcher. The filter switcher includes holder, two mounting frames, two first adhesive layers, and two filters, and is of minimal thickness. The two first adhesive layers fix the filters on the two mounting frames. An enlarged installation space within the lens module is not required. The disclosure also relates to an electronic device using the lens module.
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公开(公告)号：US20230194829A1
公开(公告)日：2023-06-22
申请号：US17885760
申请日：2022-08-11
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： SHIN-WEN CHEN , LONG-FEI ZHANG , KUN LI , HAO-ZHONG LIU
IPC: G02B7/04
CPC classification number: G02B7/04
Abstract: A lens module includes a lens assembly, a voice coil motor, a bracket, a circuit board, and a solder block. The voice coil motor includes a pin. The lens assembly is received in the voice coil motor. The bracket is disposed on the voice coil motor. The pin is extending into the recessed area. The bracket is sandwiched between the voice coil motor and the circuit board. The circuit board includes conductive supporting blocks facing the voice coil motor. The conductive supporting blocks are disposed in the recessed area. And one pin and one conductive supporting block are electrically connected by the solder block. The present disclosure also provides an electronic device including the lens module.
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