THERMALLY CONDUCTIVE RESIN COMPOSITION
    87.
    发明公开

    公开(公告)号:US20230250328A1

    公开(公告)日:2023-08-10

    申请号:US18106157

    申请日:2023-02-06

    Abstract: Provided is a resin composition that has a low viscosity when in the state of a composition, and provides a cured product having a high thermal conductivity, a high resin strength and a high adhesive force. The composition is a thermally conductive resin composition containing:



    (A) 100 parts by mass of a heat-curable resin containing at least one kind selected from an epoxy resin, a cyclic imide compound and a cyanate ester resin; and
    (B) a thermally conductive filler that has a thermal conductivity of not smaller than 10 W/m·K, and is in an amount of 100 to 3,000 parts by mass per 100 parts by mass of the component (A),
    wherein the component (B) contains therein 40 to 85% by mass of a thermally conductive filler (B1) that has an average particle size of 35 to 200 μm and a specific surface area of not larger than 0.3 mm2/g.

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