Abstract:
It is an object of the present invention to provide a curable resin composition, having excellent workability (thixotropic properties and applicability) required in applications such as floor adhesives, without causing a decrease in mechanical properties, which contains an organic polymer having a reactive silicon group. The object is attained by a curable resin composition including: an organic polymer (A) having a reactive silicon group; a filler (B) obtained through a combination of three types of filler, namely a filler (B1) having an average particle diameter of less than 0.5 μm, a filler (B2) having an average particle diameter of not less than 0.5 μm to less than 10 μm, and a filler (B3) having an average particle diameter of not less than 10 μm.
Abstract:
A curable adhesive composition kit and method of adhering substrates is provided having three basic adhesives and up to three additional optional adhesives. The basic adhesives include: at least one curable silicone end group-containing adhesive; at least one curable cyanoacrylate adhesive, and at least one curable epoxy adhesive. The optional adhesives can be one or more of the following: contact adhesive, urethane adhesive, polyvinylacetate adhesive, and pressure sensitive adhesive. The kit system also can have a selection guide for the adhesives in the system based on substrate types or substrate types and use conditions. Optionally a guide for using the adhesives in repairing adherends can be included in the kit. Also optionally the selection guide and/or the repair guide can be in an interactive program on a web site on a computer network such as the internet.
Abstract:
A curable adhesive composition kit and method of adhering substrates is provided having three basic adhesives and up to three additional optional adhesives. The basic adhesives include: at least one curable silicone end group-containing adhesive; at least one curable cyanoacrylate adhesive, and at least one curable epoxy adhesive. The optional adhesives can be one or more of the following: contact adhesive, urethane adhesive, polyvinylacetate adhesive, and pressure sensitive adhesive. The kit system also can have a selection guide for the adhesives in the system based on substrate types or substrate types and use conditions. Optionally a guide for using the adhesives in repairing adherends can be included in the kit. Also optionally the selection guide and/or the repair guide can be in an interactive program on a web site on a computer network such as the internet.
Abstract:
The invention relates to a polymer dispersion containing water and at least 60 wt. % of an organic polymer which has at least one group of general formula (I) A—Si(Z)n(OH)3-n. The invention also relates to a composition containing at least one organic polymer which has at least one group of general formula (I), and at least one other organic polymer or a mixture of two or more other organic polymers.
Abstract:
This invention relates to a semiconductor package in which a silicon die is adhered to a substrate with an adhesive comprising a resin having the structure: 1 in which Q is an oligomeric or polymeric group containing at least one carbon to carbon double bond, A is a hydrocarbyl group or an aromatic group, and L is a linking group resulting from the reaction of a functional group, excluding epoxy, on the precursor for the segment containing silane and a functional group, excluding epoxy, on the precursor for the segment containing the at least one carbon to carbon double bond
Abstract:
Provided is an automobile adhesive comprising (a) an alkoxysilyl group-containing polymer, (b) a hardening catalyst for the above-mentioned alkoxysilyl group-containing polymer, (c) a vinyl-based polymer, (d) an epoxy resin, (e) an epoxy hardening agent, and (f) an inorganic filler, wherein the adhesive immediately after mixing all of the above-mentioned (a) to (f) has a viscosity at 23null C. of 100 to 700 Panulls and a structural viscosity index of 2.0 to 4.0.
Abstract:
This invention relates to silane functional adhesive composition and to a method of bonding a window to a painted substrate using the adhesive without the need for a primer for the painted substrate. In one embodiment, the invention is a method of bonding glass to a painted substrate, such as a window in a vehicle. The process comprises applying to the glass or the unprimed painted substrate an adhesive as described herein; contacting the glass with the unprimed painted substrate wherein the adhesive is located between the window and the substrate; and allowing the adhesive to cure.
Abstract:
This invention relates to silane functional adhesive composition and to a method of bonding a window to a painted substrate using the adhesive without the need for a primer for the painted substrate. In one embodiment, the invention is a method of bonding glass to a painted substrate, such as a window in a vehicle. The process comprises applying to the glass or the unprimed painted substrate an adhesive as described herein; contacting the glass with the unprimed painted substrate wherein the adhesive is located between the window and the substrate; and allowing the adhesive to cure.
Abstract:
Two component adhesive/sealing masses based on silane terminated prepolymers contain a component A which is a one-component, humidity hardening adhesive/sealing mass with high initial adhesiveness, and a component B which is a crosslinking agent and/or accelerator for component A are disclosed. These adhesive/sealing masses are suitable for gluing without primer parts made of metals or other materials such as aluminum, steel, glass, wood or plastics. In a particularly preferred embodiment, component B consists of a viscous, stable mixture of plasticisers, water, thickeners and other optional auxiliary substances.
Abstract:
A curable composition comprising (A) an organic polymer containing at least one reactive silicon functional group crosslinkable to produce an elastomer by the formation of a siloxane bond in its molecule and (B) an organic silicon compound having a molecular weight of not less than 140 and represented by the formula (1):[(CH.sub.3).sub.3 SiO].sub.n R.sup.1 (1)wherein R.sup.1 is a residue of an alcohol or a weak acid which has a valency of n, and n is a positive integer. The composition of the invention can give cured product having excellent modulus and elongation as well as has excellent storage stability.
Abstract translation:一种可固化组合物,其包含(A)含有至少一个反应性硅官能团的有机聚合物,所述反应性硅官能团可通过在其分子中形成硅氧烷键而产生弹性体,和(B)分子量不小于140的有机硅化合物 并且由式(1)表示:[(CH 3)3 SiO] n R 1(1)其中R 1是具有n价的醇或弱酸的残基,n是正整数。 本发明的组合物可以得到具有优异的模量和伸长率的固化产物,并且具有优异的储存稳定性。