公开(公告)号：US09777197B2

公开(公告)日：2017-10-03

申请号：US14512535

申请日：2014-10-13

Applicant: SunRay Scientific LLC

Inventor： S. Kumar Khanna

IPC: C09J9/02 ,  C09J9/00 ,  H05K13/04 ,  H05K3/30 ,  H05K3/32 ,  H01L23/00 ,  C08K9/02

CPC classification number: C09J9/02 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/01 ,  C09J9/00 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29562 ,  H01L2224/2957 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/75253 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2224/8393 ,  H01L2924/00014 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0323 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/2064 ,  H01L2924/0665 ,  H01L2224/0401

Abstract: Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

公开(公告)号：US20170253757A1

公开(公告)日：2017-09-07

申请号：US15061618

申请日：2016-03-04

Applicant: Xerox Corporation

Inventor： Pedram Salami ,  Ping Liu ,  C. Geoffrey Allen ,  Naveen Chopra ,  Kurt I. Halfyard

IPC: C09D11/52 ,  C09D11/033 ,  H05K3/40 ,  C09D11/037

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  H05K1/097 ,  H05K3/1275 ,  H05K3/40 ,  H05K2201/0218

Abstract: An ink composition including a metal nanoparticle; at least one aromatic hydrocarbon solvent, wherein the at least one aromatic hydrocarbon solvent is compatible with the metal nanoparticles; at least one aliphatic hydrocarbon solvent, wherein the at least one aliphatic hydrocarbon solvent is compatible with the metal nanoparticles; wherein the ink composition has a metal content of greater than about 45 percent by weight, based upon the total weight of the ink composition; wherein the ink composition has a viscosity of from about 5 to about 30 centipoise at a temperature of about 20 to about 30° C. A process for preparing the ink composition. A process for printing the ink composition comprising pneumatic aerosol printing.

公开(公告)号：US09359517B2

公开(公告)日：2016-06-07

申请号：US14514463

申请日：2014-10-15

Applicant: Karen M. Kosydar ,  Gary L. Slater ,  Mary Christine Brick ,  Christine Joanne Landry-Coltrain ,  James Albert Reczek

Inventor： Karen M. Kosydar ,  Gary L. Slater ,  Mary Christine Brick ,  Christine Joanne Landry-Coltrain ,  James Albert Reczek

IPC: C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  C09D11/38 ,  C09D179/08 ,  C09D179/02 ,  C09D179/04 ,  C09D133/14

CPC classification number: C09D11/38 ,  C08K9/02 ,  C09D4/00 ,  C09D11/037 ,  C09D11/10 ,  C09D11/101 ,  C09D11/52 ,  C09D133/14 ,  C09D179/02 ,  C09D179/04 ,  C09D179/08 ,  H05K1/095 ,  H05K3/185 ,  H05K2201/0218 ,  H05K2201/0323 ,  H05K2203/0709 ,  C08F222/10

Abstract: A non-aqueous composition contains dispersed carbon-coated metal particles in an organic diluent in an amount of at least 10 weight %. The dispersed carbon-coated metal particles have a median diameter equal to or less than 0.6 μm, and are dispersed using a particle dispersing agent that has a weight average molecular weight (Mw) of at least 2,000 and up to and including 100,000 and comprises nitrogen-containing units. The median diameter of the dispersed particles is determined using a dynamic light scattering method. Moreover, when the non-aqueous composition contains up to and including 25 weight % of the dispersed carbon-coated metal particles, it exhibits no visual settling when subjected to a settling test of at least 24 hours at 20° C. Such non-aqueous compositions can include photocurable components and are useful to prepare photocurable and photocured electrically-conductive patterns and layers in various articles, including touch screen devices having touch screen displays.

Abstract translation: 非水性组合物在有机稀释剂中含有至少10重量％的分散的碳涂覆的金属颗粒。 分散的碳涂覆的金属颗粒的中值直径等于或小于0.6μm，并且使用重均分子量（Mw）至少为2,000且至多并包括100,000的颗粒分散剂分散，并且包含氮 包含单位。 使用动态光散射法测定分散颗粒的中值粒径。 此外，当非水性组合物含有至多且包含25重量％的分散的碳涂覆的金属颗粒时，当在20℃进行至少24小时的沉降试验时，其表现出没有视觉沉降。这种非水性 组合物可以包括光固化组分，并且可用于制备各种制品中的光固化和光固化导电图案和层，包括具有触摸屏显示器的触摸屏装置。

公开(公告)号：US09224684B2

公开(公告)日：2015-12-29

申请号：US14167280

申请日：2014-01-29

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kazuyuki Kubota ,  Tomoharu Fujii

IPC: H05K1/16 ,  H01L23/50 ,  H05K1/02 ,  H05K3/46 ,  H01L23/58 ,  H01L25/10 ,  H05K1/18 ,  H05K3/10 ,  H05K3/42

CPC classification number: H01L23/50 ,  H01L23/58 ,  H01L25/105 ,  H01L2224/16237 ,  H01L2924/15321 ,  H05K1/0271 ,  H05K1/16 ,  H05K1/185 ,  H05K3/108 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/0162 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/0218 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2203/1461 ,  H05K2203/1469

Abstract: There is provided a wiring board. The wiring board includes: a first insulating layer; a secondary battery on one surface of the first insulating layer; a second insulating layer formed on the secondary battery; a third insulating layer covering the second insulating layer; a first wiring layer on one surface of the third insulating layer; and a via electrically connecting the first wiring layer to an electrode of the secondary battery. A rigidity of the second insulating layer is lower than those of the first and third insulating layers.

Abstract translation: 提供了一个接线板。 布线板包括：第一绝缘层; 在所述第一绝缘层的一个表面上的二次电池; 形成在二次电池上的第二绝缘层; 覆盖所述第二绝缘层的第三绝缘层; 在所述第三绝缘层的一个表面上的第一布线层; 以及将第一布线层电连接到二次电池的电极的通孔。 第二绝缘层的刚性低于第一绝缘层和第三绝缘层的刚性。

公开(公告)号：US20150248946A1

公开(公告)日：2015-09-03

申请号：US14711003

申请日：2015-05-13

Applicant: HENKEL AG & CO. KGAA

Inventor： PETER ADRIANUS VAN VEEN ,  CORINA PRENT

IPC: H01B1/22 ,  H05K3/12

CPC classification number: H01B1/22 ,  C08K3/08 ,  C08K9/02 ,  C08L75/04 ,  C09D5/24 ,  C09D7/62 ,  H05K1/095 ,  H05K3/12 ,  H05K2201/0218 ,  C08L2666/14 ,  C08L2666/16 ,  C08L2666/04

Abstract: An electrically conductive composition comprising a binder and filler particles in which at least a portion of the particles are silver-plated. In one embodiment the composition comprises a binder such as a polyurethane, electrically conductive filler particles, silver-plated filler particles and solvent.

Abstract translation: 一种导电组合物，其包含粘合剂和填料颗粒，其中至少一部分颗粒是镀银的。 在一个实施方案中，组合物包含粘合剂，例如聚氨酯，导电填料颗粒，镀银填料颗粒和溶剂。

公开(公告)号：US20150159057A1

公开(公告)日：2015-06-11

申请号：US14620576

申请日：2015-02-12

Applicant: HENKEL AG & CO. KGAA

Inventor： Anja HENCKENS ,  Nabila IDRISSI

IPC: C09J9/02 ,  B32B37/12 ,  B32B37/18 ,  C09J133/00

CPC classification number: C09J9/02 ,  B32B37/1284 ,  B32B37/18 ,  C08K3/08 ,  C08K3/10 ,  C09J5/06 ,  C09J11/04 ,  C09J133/00 ,  C09J163/00 ,  C09J2203/322 ,  C09J2400/163 ,  C09J2433/00 ,  H01R4/04 ,  H05K1/053 ,  H05K3/321 ,  H05K3/368 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: The present invention relates to curable compositions that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The curable compositions comprise a) one or more curable resins; b) composite particles, which comprise i) an electrically conductive core, and ii) an electrically conductive shell, comprising one or more shell materials each selected from the group consisting of metal carbides, metal sulfides, metal borides, metal silicides, and metal nitrides; and c) electrically conductive particles different from component b). The present invention further relates to a method of bonding a first substrate to a second substrate, wherein the substrates are bonded under heat and pressure using said curable composition.

Abstract translation: 本发明涉及适用于制造电子器件，集成电路，半导体器件，无源部件，太阳能电池，太阳能模块和/或发光二极管中的导电材料的可固化组合物。 可固化组合物包含a）一种或多种可固化树脂; b）复合颗粒，其包括i）导电芯，以及ii）导电外壳，其包含一种或多种壳材料，每种壳材料选自金属碳化物，金属硫化物，金属硼化物，金属硅化物和金属氮化物 ; 和c）不同于组分b）的导电颗粒。 本发明还涉及将第一基板粘合到第二基板上的方法，其中基板使用所述可固化组合物在加热和加压下接合。

公开(公告)号：US09035192B2

公开(公告)日：2015-05-19

申请号：US12974476

申请日：2010-12-21

Applicant: Gyu Ho Lee ,  Young Woo Park ,  Il Rae Cho ,  Young Hun Kim ,  Kyoung Soo Park ,  Jin Seong Park ,  Dong Seon Uh ,  Kyung Jin Lee ,  Kwang Jin Jung

Inventor： Gyu Ho Lee ,  Young Woo Park ,  Il Rae Cho ,  Young Hun Kim ,  Kyoung Soo Park ,  Jin Seong Park ,  Dong Seon Uh ,  Kyung Jin Lee ,  Kwang Jin Jung

IPC: H05K1/09 ,  C09J11/04 ,  C09J9/02 ,  H05K3/32 ,  C08K3/00 ,  C08K9/02

CPC classification number: C09J11/04 ,  C08K3/017 ,  C08K9/02 ,  C09J9/02 ,  H05K3/323 ,  H05K2201/0218

Abstract: An anisotropic conductive adhesive composite and film include a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.

Abstract translation: 各向异性导电粘合剂复合物和膜包括粘合剂和分散在粘合剂中的导电颗粒。 导电颗粒包括铜芯颗粒和涂覆在相应的铜芯颗粒的表面上的金属涂层。

公开(公告)号：US08932716B2

公开(公告)日：2015-01-13

申请号：US13332555

申请日：2011-12-21

Applicant: Tomoyuki Ishimatsu ,  Yuta Araki

Inventor： Tomoyuki Ishimatsu ,  Yuta Araki

IPC: B32B5/16 ,  H05K3/32 ,  B22F1/02 ,  C22C5/02 ,  C22C19/03 ,  H01B1/02

CPC classification number: H05K3/323 ,  B22F1/02 ,  C22C5/02 ,  C22C19/03 ,  H01B1/02 ,  H05K2201/0218 ,  Y10T428/12181 ,  Y10T428/12944 ,  Y10T428/256 ,  Y10T428/287 ,  Y10T428/2991

Abstract: To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm.

Abstract translation: 提供导电颗粒，其包含：核心颗粒; 以及形成在所述芯粒子的表面上的导电层，其中所述芯粒子为镍粒子，所述导电层为表面的磷浓度为10质量％以下的镀镍层， 导电层的平均厚度为1nm〜10nm。

公开(公告)号：US08920580B2

公开(公告)日：2014-12-30

申请号：US11812005

申请日：2007-06-14

Applicant: Hidekiyo Takaoka ,  Kosuke Nakano

Inventor： Hidekiyo Takaoka ,  Kosuke Nakano

IPC: B23K35/34

CPC classification number: B23K35/0244 ,  B23K35/025 ,  B23K35/226 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: In solder paste of the present invention, a first metal powder, a second metal powder, and a third metal powder are dispersed in a flux or a thermosetting resin. The first metal powder includes a first metal material such as Cu, Ag, Au, or Pd that serves as a base metal. A second metal material such as Sn or In that has a melting point lower than that of the first metal material is coated on the surface of the first metal material. The second metal powder is made of a metal material such as Sn or In that has a melting point lower than that of the first metal material. The third metal powder such as a Cu, Ag, Au or Pd powder has an average particle diameter smaller than that of the first metal material and can form compounds with the second metal material and the second metal powder. Accordingly, the likelihood of unreacted components remaining after a heat treatment can be suppressed, and even when a reflow treatment is repeated a plurality of times, a decrease in the bonding strength of solder bonding can be prevented.

Abstract translation: 在本发明的焊膏中，将第一金属粉末，第二金属粉末和第三金属粉末分散在助熔剂或热固性树脂中。 第一金属粉末包括用作贱金属的第一金属材料如Cu，Ag，Au或Pd。 具有比第一金属材料低的熔点的第二金属材料如Sn或In涂覆在第一金属材料的表面上。 第二金属粉末由熔点低于第一金属材料的Sn或In等金属材料制成。 第三金属粉末如Cu，Ag，Au或Pd粉末的平均粒径小于第一金属材料的平均粒径，并可与第二金属材料和第二金属粉末形成化合物。 因此，可以抑制在热处理后残留的未反应成分的可能性，并且即使重复多次回流处理，也可以防止焊接接合的接合强度的降低。

公开(公告)号：US20140360763A1

公开(公告)日：2014-12-11

申请号：US14372566

申请日：2013-01-10

Applicant: Toray Industries, Inc.

Inventor： Tsukuru Mizuguchi ,  Kazutaka Kusano

IPC: H01B1/22 ,  H05K1/09 ,  G03F7/20 ,  H05K1/02

CPC classification number: H01B1/22 ,  C09D7/40 ,  C09D11/037 ,  C09D11/52 ,  C09D201/02 ,  C09D201/08 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/038 ,  G03F7/40 ,  G06F3/041 ,  G06F2203/04103 ,  H01B1/20 ,  H05K1/0274 ,  H05K1/092 ,  H05K3/02 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0326 ,  H05K2203/0514

Abstract: A conductive paste includes: composite particles (A) formed by coating a surface of a core material composed of an inorganic material with an antimony-containing compound; a compound (B) having an acid value of 30 to 250 mg KOH/g; and a conductive filler (C).

Abstract translation: 导电糊包括：通过用含锑化合物涂覆由无机材料构成的芯材的表面形成的复合颗粒（A）; 酸值为30〜250mg KOH / g的化合物（B） 和导电填料（C）。