公开(公告)号：US09011776B2

公开(公告)日：2015-04-21

申请号：US14013730

申请日：2013-08-29

Applicant: STMicroelectronics S.r.I.

Inventor： Federico Giovanni Ziglioli ,  Fulvio Vittorio Fontana ,  Luca Maggi

IPC: B81C1/00 ,  B81B7/00 ,  H04R19/04

CPC classification number: B81B7/0077 ,  B81B7/0058 ,  B81B2201/0264 ,  B81C1/00333 ,  B81C2203/0118 ,  H01L2224/48091 ,  H01L2224/48145 ,  H04R1/086 ,  H04R19/04 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A packaged device, wherein at least one sensitive portion of a chip is enclosed in a chamber formed by a package. The package has an air-permeable area having a plurality of holes and a liquid-repellent structure so as to enable passage of air between an external environment and the chamber and block the passage of liquids.

Abstract translation: 一种封装器件，其中芯片的至少一个敏感部分被封装在由封装形成的腔室中。 该包装具有透气区域，具有多个孔和拒水结构，以使得能够在外部环境和室之间通过空气并阻止液体的通过。