公开(公告)号：US08228278B2

公开(公告)日：2012-07-24

申请号：US12369745

申请日：2009-02-12

Applicant: Chao-Hui Hsu ,  Sheh-Cha Cho ,  Yuan-Yi Laio ,  Cheng-Ping Chen

Inventor： Chao-Hui Hsu ,  Sheh-Cha Cho ,  Yuan-Yi Laio ,  Cheng-Ping Chen

IPC: G09G3/36

CPC classification number: G09G3/20 ,  G09G2300/043 ,  G09G2320/0219 ,  G09G2330/06

Abstract: A display panel has a display area and a peripheral circuit area next to the display area. The display panel includes a number of pixels, a first signal line, a second signal line, and a third signal line. The pixels are arranged in array in the display area. The first signal line disposed in an intersection of the display area and the peripheral circuit area is electrically connected to the pixels. A data signal is suitable for being applied to the first signal line. The second signal line is disposed in the peripheral circuit area. A common signal is suitable for being applied to the second signal line. The third signal line is disposed between the first signal line and the second signal line. A reference signal is suitable for being applied to the third signal line. The data signal, the common signal, and the reference signal are different signals.

Abstract translation: 显示面板具有显示区域和与显示区域相邻的外围电路区域。 显示面板包括多个像素，第一信号线，第二信号线和第三信号线。 像素在显示区域中排列成阵列。 布置在显示区域和外围电路区域的交点中的第一信号线电连接到像素。 数据信号适合于施加到第一信号线。 第二信号线设置在外围电路区域中。 公共信号适用于第二信号线。 第三信号线设置在第一信号线和第二信号线之间。 参考信号适用于施加到第三信号线。 数据信号，公共信号和参考信号是不同的信号。

公开(公告)号：US07675186B2

公开(公告)日：2010-03-09

申请号：US11514349

申请日：2006-09-01

Applicant: Cheng-Ping Chen ,  Wen-Jeng Fan

Inventor： Cheng-Ping Chen ,  Wen-Jeng Fan

IPC: H01L23/29

CPC classification number: H01L23/3128 ,  H01L23/13 ,  H01L23/16 ,  H01L23/3135 ,  H01L24/06 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An IC package mainly includes a substrate having slot(s), a chip, a protective encapsulant, a stiffening encapsulant, and a plurality of external terminals. The Young's modulus of the stiffening encapsulant is greater than the one of the protective encapsulant and the curing shrinkage of the stiffening encapsulant is smaller than the one of the protective encapsulant. The protective encapsulant is formed on one of the surfaces of the substrate for encapsulating the chip. The stiffening encapsulant protrudes from the other surface of the substrate where the external terminals are disposed. Moreover, the stiffening encapsulant is formed inside the slot and is contacted with the chip. Since the stiffening encapsulant is embedded and formed inside the slot, therefore, the contact area of the stiffening encapsulant with the substrate is increased to enhance the warpage resistance of the IC package.

Abstract translation: IC封装主要包括具有槽的衬底，芯片，保护性密封剂，加强密封剂和多个外部端子。 加强密封剂的杨氏模量大于保护性密封剂中的一种，并且硬化密封剂的固化收缩率小于保护性密封剂中的一种。 保护性密封剂形成在用于封装芯片的衬底的一个表面上。 加强密封剂从设置有外部端子的基板的另一个表面突出。 此外，加强密封剂形成在槽内并与芯片接触。 由于加强型密封剂嵌入并形成在槽内，因此，加强密封剂与基板的接触面积增加，以提高IC封装的抗翘曲性。

公开(公告)号：US20080054494A1

公开(公告)日：2008-03-06

申请号：US11514349

申请日：2006-09-01

Applicant: Cheng-Ping Chen ,  Wen-Jeng Fan

Inventor： Cheng-Ping Chen ,  Wen-Jeng Fan

IPC: H01L23/28

CPC classification number: H01L23/3128 ,  H01L23/13 ,  H01L23/16 ,  H01L23/3135 ,  H01L24/06 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An IC package mainly includes a substrate having slot(s), a chip, a protective encapsulant, a stiffening encapsulant, and a plurality of external terminals. The Young's modulus of the stiffening encapsulant is greater than the one of the protective encapsulant and the curing shrinkage of the stiffening encapsulant is smaller than the one of the protective encapsulant. The protective encapsulant is formed on one of the surfaces of the substrate for encapsulating the chip. The stiffening encapsulant protrudes from the other surface of the substrate where the external terminals are disposed. Moreover, the stiffening encapsulant is formed inside the slot and is contacted with the chip. Since the stiffening encapsulant is embedded and formed inside the slot, therefore, the contact area of the stiffening encapsulant with the substrate is increased to enhance the warpage resistance of the IC package.

Abstract translation: IC封装主要包括具有槽的衬底，芯片，保护性密封剂，加强密封剂和多个外部端子。 加强密封剂的杨氏模量大于保护性密封剂中的一种，并且硬化密封剂的固化收缩率小于保护性密封剂中的一种。 保护性密封剂形成在用于封装芯片的衬底的一个表面上。 加强密封剂从设置有外部端子的基板的另一个表面突出。 此外，加强密封剂形成在槽内并与芯片接触。 由于加强密封剂嵌入并形成在槽内，因此，加强密封剂与基板的接触面积增大，以提高IC封装的翘曲阻力。

公开(公告)号：US20100053053A1

公开(公告)日：2010-03-04

申请号：US12369745

申请日：2009-02-12

Applicant: Chao-Hui Hsu ,  Sheh-Cha Cho ,  Yuan-Yi Laio ,  Cheng-Ping Chen

Inventor： Chao-Hui Hsu ,  Sheh-Cha Cho ,  Yuan-Yi Laio ,  Cheng-Ping Chen

IPC: G09G3/36

CPC classification number: G09G3/20 ,  G09G2300/043 ,  G09G2320/0219 ,  G09G2330/06

Abstract: A display panel has a display area and a peripheral circuit area next to the display area. The display panel includes a number of pixels, a first signal line, a second signal line, and a third signal line. The pixels are arranged in array in the display area. The first signal line disposed in an intersection of the display area and the peripheral circuit area is electrically connected to the pixels. A data signal is suitable for being applied to the first signal line. The second signal line is disposed in the peripheral circuit area. A common signal is suitable for being applied to the second signal line. The third signal line is disposed between the first signal line and the second signal line. A reference signal is suitable for being applied to the third signal line. The data signal, the common signal, and the reference signal are different signals.

Abstract translation: 显示面板具有显示区域和与显示区域相邻的外围电路区域。 显示面板包括多个像素，第一信号线，第二信号线和第三信号线。 像素在显示区域中排列成阵列。 布置在显示区域和外围电路区域的交点中的第一信号线电连接到像素。 数据信号适合于施加到第一信号线。 第二信号线设置在外围电路区域中。 公共信号适用于第二信号线。 第三信号线设置在第一信号线和第二信号线之间。 参考信号适用于施加到第三信号线。 数据信号，公共信号和参考信号是不同的信号。