公开(公告)号：US10525073B2

公开(公告)日：2020-01-07

申请号：US15569148

申请日：2016-04-26

Applicant: Cheng-Jui Lin ,  Chih-Jen Wu ,  Chia-Yuan Liu ,  Horng-Yuan Wang

Inventor： Cheng-Jui Lin ,  Chih-Jen Wu ,  Chia-Yuan Liu ,  Horng-Yuan Wang

IPC: A61K31/7072 ,  A61P9/00 ,  A61P13/12

Abstract: Disclosed herein is novel use of telbivudine for improving kidney and/or heart function of a subject suffering from a kidney disease, such as acute kidney injury (AKI) or chronic kidney disease (CKD).

公开(公告)号：US10384002B2

公开(公告)日：2019-08-20

申请号：US15541711

申请日：2015-01-30

Applicant: National Taipei University of Technology ,  Chih-Jen Wu

Inventor： Chih-Jen Wu ,  Jung-Tang Huang

IPC: A61M1/00 ,  A61M5/00 ,  A61M37/00 ,  A61M99/00 ,  G01M3/04 ,  G01M3/40 ,  G08B21/20 ,  A61M5/168 ,  A61M5/142 ,  A61M1/36

Abstract: A sensor patch, system, and method for detecting a fluid leaked from a target site of a subject are provided. The sensor patch (100) includes a first detecting unit (127), a second detecting unit (128), and a patch body (110). The first detecting unit (127) includes a first pair of sensors (120A) respectively having a first end (121A) configured to be placed approximating the target site, while the second detecting unit (128) includes a second pair of sensors (120B) respectively having a first end (121B) configured to be placed away from the target site. Each sensor includes a conductive wire (125) and an insulating sheath (126) encapsulating the conductive wire (125) in a manner that a portion of the first end (121A, 121B) of the conductive wire (125) is exposed yet without directly contacting the subject's skin. The patch body (110) has an adhesive surface (104) for securing the first and second detecting units (127, 128) to the subject. The sensor patch enhances the detection specificity.

公开(公告)号：US09377503B2

公开(公告)日：2016-06-28

申请号：US14246405

申请日：2014-04-07

Applicant: An-Chun Tu ,  Chen-Ming Huang ,  Chih-Jen Wu ,  Chin-Hsiang Lin

Inventor： An-Chun Tu ,  Chen-Ming Huang ,  Chih-Jen Wu ,  Chin-Hsiang Lin

IPC: H01L27/00 ,  G01R31/26 ,  H01L21/66 ,  G01R31/28

CPC classification number: G01R31/2644 ,  G01R31/2884 ,  H01L22/14 ,  H01L22/32 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method performed using a resistive device, where the resistive device includes a substrate with an active region separated from a gate electrode by a dielectric and electrical contacts along a longest dimension of the gate electrode, the method comprising, performing one or more processes to form the resistive device, measuring a resistance between the electrical contacts, and correlating the measured resistance with a variation in one or more of the processes.

公开(公告)号：US08791541B2

公开(公告)日：2014-07-29

申请号：US13542591

申请日：2012-07-05

Applicant: Kuan-Chieh Huang ,  Dun-Nian Yaung ,  Chih-Jen Wu ,  Chen-Ming Huang

Inventor： Kuan-Chieh Huang ,  Dun-Nian Yaung ,  Chih-Jen Wu ,  Chen-Ming Huang

IPC: H01L21/00

CPC classification number: H01L31/0232 ,  H01L21/6835 ,  H01L23/49805 ,  H01L24/02 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/18 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/02313 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K3/3436 ,  H05K2201/10151 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01022 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Provided is a method of fabricating a backside illuminated image sensor that includes providing a device substrate having a frontside and a backside, where pixels are formed at the frontside and an interconnect structure is formed over pixels, forming a re-distribution layer (RDL) over the interconnect structure, bonding a first glass substrate to the RDL, thinning and processing the device substrate from the backside, bonding a second glass substrate to the backside, removing the first glass substrate, and reusing the first glass substrate for fabricating another backside-illuminated image sensor.

Abstract translation: 提供一种制造背面照射图像传感器的方法，其包括提供具有前侧和后侧的器件基板，其中在前侧形成像素，并且在像素上形成互连结构，形成再分布层（RDL），覆盖 所述互连结构将第一玻璃基板接合到所述RDL，从背面稀释并处理所述器件基板，将第二玻璃基板粘合到所述背面，移除所述第一玻璃基板，以及重新使用所述第一玻璃基板以制造另一个背面照明 图像传感器。

公开(公告)号：US20140203282A1

公开(公告)日：2014-07-24

申请号：US14246529

申请日：2014-04-07

Applicant: An-Chun Tu ,  Chen-Ming Huang ,  Chih-Jen Wu ,  Chin-Hsiang Lin

Inventor： An-Chun Tu ,  Chen-Ming Huang ,  Chih-Jen Wu ,  Chin-Hsiang Lin

IPC: G01R31/26

CPC classification number: G01R31/2644 ,  G01R31/2884 ,  H01L22/14 ,  H01L22/32 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method performed using a resistive device, where the resistive device includes a substrate with an active region separated from a gate electrode by a dielectric and electrical contacts along a longest dimension of the gate electrode, the method comprising, performing one or more processes to form the resistive device, measuring a resistance between the electrical contacts, and correlating the measured resistance with a variation in one or more of the processes.

Abstract translation: 一种使用电阻器件执行的方法，其中所述电阻器件包括具有通过栅电极的最长尺寸的电介质和电触点与栅电极分离的有源区的衬底，所述方法包括执行一个或多个工艺以形成 电阻器件，测量电触点之间的电阻，并将所测量的电阻与一个或多个过程中的变化相关联。

公开(公告)号：US08586404B2

公开(公告)日：2013-11-19

申请号：US13556869

申请日：2012-07-24

Applicant: Kuan-Chieh Huang ,  Chih-Jen Wu ,  Chen-Ming Huang ,  Dun-Nian Yaung ,  An-Chun Tu

Inventor： Kuan-Chieh Huang ,  Chih-Jen Wu ,  Chen-Ming Huang ,  Dun-Nian Yaung ,  An-Chun Tu

IPC: H01L21/00

CPC classification number: H01L27/14689 ,  H01L21/28518

Abstract: This description relates to a method for reducing CMOS Image Sensor (CIS) contact resistance, the CIS having a pixel array and a periphery. The method includes performing Physical Vapor Deposition (PVD) at a pixel contact hole area, annealing for silicide formation at the pixel contact hole area and performing contact filling. This description also relates to a method for reducing CMOS Image Sensor (CIS) contact resistance, the CIS having a pixel array and a periphery. The method includes implanting N+ or P+ for pixel contact plugs at a pixel contact hole area, performing Physical Vapor Deposition (PVD) at pixel contact hole area, annealing for silicide formation at the pixel contact hole area, performing contact filling and depositing a first metal film layer, wherein the first metal film layer links contact holes for a source, a drain, or a poly gate of a CMOS device.

Abstract translation: 本说明书涉及用于降低CMOS图像传感器（CIS）接触电阻的方法，CIS具有像素阵列和周边。 该方法包括在像素接触孔区域进行物理气相沉积（PVD），在像素接触孔区域进行硅化物形成退火并进行接触填充。 该描述还涉及用于减小CMOS图像传感器（CIS）接触电阻的方法，CIS具有像素阵列和周边。 该方法包括在像素接触孔区域处对像素接触插塞注入N +或P +，在像素接触孔区域进行物理气相沉积（PVD），在像素接触孔区域进行硅化物形成退火，执行接触填充和沉积第一金属 膜层，其中所述第一金属膜层连接CMOS器件的源极，漏极或多晶硅栅极的接触孔。

公开(公告)号：US20130076385A1

公开(公告)日：2013-03-28

申请号：US13241634

申请日：2011-09-23

Applicant: An-Chun Tu ,  Chen-Ming Huang ,  Chih-Jen Wu ,  Chin-Hsiang Lin

Inventor： An-Chun Tu ,  Chen-Ming Huang ,  Chih-Jen Wu ,  Chin-Hsiang Lin

IPC: G01R1/067

CPC classification number: G01R31/2644 ,  G01R31/2884 ,  H01L22/14 ,  H01L22/32 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A resistive test structure that includes a semiconductor substrate with an active region, a gate stack formed over the active region, a first electrical contact in communication with the active region on opposing sides of the gate stack, the first electrical contact providing an electrical short across a first dimension of the gate stack, and a second electrical contact in communication with the active region on the opposing sides of the gate stack, the second electrical contact providing an electrical short across the first dimension of the gate stack, the first and second electrical contacts spaced along a second dimension of the gate stack perpendicular to the first dimension.

Abstract translation: 一种电阻测试结构，其包括具有有源区的半导体衬底，形成在有源区上的栅极叠层，与栅极堆叠的相对侧上的有源区连通的第一电触点，第一电触点提供跨越 栅极堆叠的第一尺寸和与栅极堆叠的相对侧上的有源区域连通的第二电触点，第二电触点跨过栅极堆叠的第一维度提供电短路，第一和第二电极 接触件沿垂直于第一尺寸的栅极堆叠的第二尺寸间隔开。

公开(公告)号：US20130001725A1

公开(公告)日：2013-01-03

申请号：US13542591

申请日：2012-07-05

Applicant: Kuan-Chieh Huang ,  Dun-Nian Yaung ,  Chih-Jen Wu ,  Chen-Ming Huang

Inventor： Kuan-Chieh Huang ,  Dun-Nian Yaung ,  Chih-Jen Wu ,  Chen-Ming Huang

IPC: H01L27/14

CPC classification number: H01L31/0232 ,  H01L21/6835 ,  H01L23/49805 ,  H01L24/02 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/18 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/02313 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K3/3436 ,  H05K2201/10151 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01022 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Provided is a method of fabricating a backside illuminated image sensor that includes providing a device substrate having a frontside and a backside, where pixels are formed at the frontside and an interconnect structure is formed over pixels, forming a re-distribution layer (RDL) over the interconnect structure, bonding a first glass substrate to the RDL, thinning and processing the device substrate from the backside, bonding a second glass substrate to the backside, removing the first glass substrate, and reusing the first glass substrate for fabricating another backside-illuminated image sensor.

公开(公告)号：US20110108940A1

公开(公告)日：2011-05-12

申请号：US12613585

申请日：2009-11-06

Applicant: Kuan-Chieh Huang ,  Dun-Nian Yuang ,  Chih-Jen Wu ,  Chen-Ming Huang

Inventor： Kuan-Chieh Huang ,  Dun-Nian Yuang ,  Chih-Jen Wu ,  Chen-Ming Huang

IPC: H01L27/146 ,  H01L31/18

CPC classification number: H01L31/0232 ,  H01L21/6835 ,  H01L23/49805 ,  H01L24/02 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/18 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/02313 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K3/3436 ,  H05K2201/10151 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01022 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Provided is a method of fabricating a backside illuminated image sensor that includes providing a device substrate having a frontside and a backside, where pixels are formed at the frontside and an interconnect structure is formed over pixels, forming a re-distribution layer (RDL) over the interconnect structure, bonding a first glass substrate to the RDL, thinning and processing the device substrate from the backside, bonding a second glass substrate to the backside, removing the first glass substrate, and reusing the first glass substrate for fabricating another backside-illuminated image sensor.

Abstract translation: 提供一种制造背面照射图像传感器的方法，其包括提供具有前侧和后侧的器件基板，其中在前侧形成像素，并且在像素上形成互连结构，形成再分布层（RDL），覆盖 所述互连结构将第一玻璃基板接合到所述RDL，从背面稀释并处理所述器件基板，将第二玻璃基板粘合到所述背面，移除所述第一玻璃基板，以及重新使用所述第一玻璃基板以制造另一个背面照明 图像传感器。

公开(公告)号：US08704224B2

公开(公告)日：2014-04-22

申请号：US13241634

申请日：2011-09-23

Applicant: An-Chun Tu ,  Chen-Ming Huang ,  Chih-Jen Wu ,  Chin-Hsiang Lin

Inventor： An-Chun Tu ,  Chen-Ming Huang ,  Chih-Jen Wu ,  Chin-Hsiang Lin

IPC: H01L23/10

CPC classification number: G01R31/2644 ,  G01R31/2884 ,  H01L22/14 ,  H01L22/32 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A resistive test structure that includes a semiconductor substrate with an active region, a gate stack formed over the active region, a first electrical contact in communication with the active region on opposing sides of the gate stack, the first electrical contact providing an electrical short across a first dimension of the gate stack, and a second electrical contact in communication with the active region on the opposing sides of the gate stack, the second electrical contact providing an electrical short across the first dimension of the gate stack, the first and second electrical contacts spaced along a second dimension of the gate stack perpendicular to the first dimension.

Abstract translation: 一种电阻测试结构，其包括具有有源区的半导体衬底，形成在有源区上的栅极叠层，与栅极堆叠的相对侧上的有源区连通的第一电触点，第一电触点提供跨越 栅极堆叠的第一尺寸和与栅极堆叠的相对侧上的有源区域连通的第二电触点，第二电触点跨过栅极堆叠的第一维度提供电短路，第一和第二电极 接触件沿垂直于第一尺寸的栅极堆叠的第二尺寸间隔开。