公开(公告)号：US07655997B2

公开(公告)日：2010-02-02

申请号：US11041952

申请日：2005-01-26

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

IPC: H01L27/14

CPC classification number: H01L23/60 ,  H01L23/544 ,  H01L24/48 ,  H01L25/167 ,  H01L27/0248 ,  H01L2223/54493 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer, this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

Abstract translation: 一种用于改进传统电光半导体晶粒封装方法的晶片级电光半导体制造机构及其方法。 本发明将半导体晶粒与晶片的顶表面上的晶粒电连接，这可以通过丝网印刷或钢板印刷焊料或银浆在晶片上进行。 之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。 使用这种方法提高了生产率，同时降低了生产时间和成本。 晶圆级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

公开(公告)号：US20050139855A1

公开(公告)日：2005-06-30

申请号：US11011133

申请日：2004-12-15

Applicant: Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung ,  Chuan-Fa Lin

Inventor： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung ,  Chuan-Fa Lin

IPC: H01L21/60 ,  H01L23/495 ,  H01L29/22 ,  H01L33/00

CPC classification number: H01L23/49562 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deformed so that the yield and quality of package can be increased, and when packaging an LED chip, it easily meets the package requirements of an electronic chip. In addition, the substrate structure is cheaper than the prior art, because a double-layered substrate is employed to improve the strength, and the package structure is also preferred because an external frame device is additionally used for preventing interference by external light. The package structure for the semiconductor has a substrate, an external frame device and a polymer filler.

Abstract translation: 描述了半导体的封装结构。 其优点在于它具有很强的结构强度，并且当被光穿透时，它不会被外界光影响并且可以使光凝结。 因此，不容易变形，可以提高封装的成品率和质量，并且在封装LED芯片时，容易满足电子芯片的封装要求。 此外，由于使用双层基板来提高强度，因此基板结构比现有技术便宜，并且封装结构也是优选的，因为外部框架装置另外用于防止外部光的干扰。 半导体的封装结构具有衬底，外部框架器件和聚合物填料。

公开(公告)号：US07804162B2

公开(公告)日：2010-09-28

申请号：US12379258

申请日：2009-02-18

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin

IPC: H01L23/02 ,  H01J1/62 ,  H01J63/04 ,  F21V9/00

CPC classification number: C09K11/7787 ,  C09K11/7789 ,  C09K11/7794 ,  F21K9/00 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  Y02B20/181 ,  H01L2924/00014

Abstract: A multi-wavelength white light-emitting structure uses a UV light emitting diode chip and a blue light emitting diode chip to excite a red phosphor and a green phosphor and generates a white light-emitting structure having good color rendering. The multi-wavelength white light-emitting structure uses a UV light emitting diode chip that emits light having a wavelength of between 350˜430 nm to excite a red phosphor to emit red light having a wavelength of between 600˜700 nm. The present invention then uses a blue light emitting diode chip that emits light having a wavelength between of 400˜500 nm to emit blue light and uses the blue light emitting diode chip to excite a green phosphor to emit green light having a wavelength of between 490˜560 nm. Mixing the red light, the blue light and the green light forms a white light.

Abstract translation: 多波长白色发光结构使用UV发光二极管芯片和蓝色发光二极管芯片来激发红色荧光体和绿色荧光体，并产生具有良好显色性能的白色发光结构。 多波长白色发光结构使用发射波长在350〜430nm之间的光的UV发光二极管芯片，以激发红色荧光体发射波长在600〜700nm之间的红色光。 然后，本发明使用发射波长在400〜500nm之间的光的蓝色发光二极管芯片发射蓝色光，并使用蓝色发光二极管芯片来激发绿色荧光体以发射波长为490nm的绿色光 〜560nm。 混合红光，蓝光和绿光形成白光。

公开(公告)号：US07276782B2

公开(公告)日：2007-10-02

申请号：US11011133

申请日：2004-12-15

Applicant: Billy Wang ,  Jonnie Chuang ,  Chi-Wen Hung ,  Chuan-Fa Lin

Inventor： Billy Wang ,  Jonnie Chuang ,  Chi-Wen Hung ,  Chuan-Fa Lin

IPC: H01L23/495

CPC classification number: H01L23/49562 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deformed so that the yield and quality of package can be increased, and when packaging an LED chip, it easily meets the package requirements of an electronic chip. In addition, the substrate structure is cheaper than the prior art, because a double-layered substrate is employed to improve the strength, and the package structure is also preferred because an external frame device is additionally used for preventing interference by external light. The package structure for the semiconductor has a substrate, an external frame device and a polymer filler.

Abstract translation: 描述了半导体的封装结构。 其优点在于它具有很强的结构强度，并且当被光穿透时，它不会被外界光影响并且可以使光凝结。 因此，不容易变形，可以提高封装的成品率和质量，并且在封装LED芯片时，容易满足电子芯片的封装要求。 此外，由于使用双层基板来提高强度，因此基板结构比现有技术便宜，并且封装结构也是优选的，因为外部框架装置另外用于防止外部光的干扰。 半导体的封装结构具有衬底，外部框架器件和聚合物填料。

公开(公告)号：US20060261488A1

公开(公告)日：2006-11-23

申请号：US11492816

申请日：2006-07-26

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

IPC: H01L23/48

CPC classification number: H01L23/60 ,  H01L23/544 ,  H01L24/48 ,  H01L25/167 ,  H01L27/0248 ,  H01L2223/54493 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer. this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

Abstract translation: 一种用于改进传统电光半导体晶粒封装方法的晶片级电光半导体制造机构及其方法。 本发明将半导体晶粒与晶片的顶表面上的晶粒电连接。 这可以通过丝网印刷或钢板印刷焊料或银浆在晶片上完成。 之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。 使用这种方法提高了生产率，同时降低了生产时间和成本。 晶片级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

公开(公告)号：US08632237B2

公开(公告)日：2014-01-21

申请号：US13563101

申请日：2012-07-31

Applicant: Chung-I Chiang ,  Chuan-Fa Lin ,  Ching-Huan Liao

Inventor： Chung-I Chiang ,  Chuan-Fa Lin ,  Ching-Huan Liao

IPC: F21V7/04

CPC classification number: G02B6/0055 ,  G02B6/0043

Abstract: A light guide plate with an adjustable illumination angle and an illumination device using the same are provided. The light guide plate has a first surface and a second surface opposite to the first surface. The second surface further has a plurality of deformable microstructures thereon. The deformable microstructures will be deformed when an external force is applied to the deformable microstructures. The illumination device has a light source and a light guide plate that is disposed next to the light source. A light beam emitted from the light source enters into the light guide plate and leaves the light guide plate via reflecting or refracting by the deformable microstructures. By applying a different external force to the light guide plate, the deformation of the deformable microstructures will be varied. Therefore, the illumination angle of the light beam could be changed according to the deformation of the deformable microstructures.

Abstract translation: 提供具有可调节照明角度的导光板和使用其的照明装置。 导光板具有与第一表面相对的第一表面和第二表面。 第二表面还具有多个可变形微结构。 当外力施加到可变形微结构时，可变形的微结构将变形。 照明装置具有设置在光源旁边的光源和导光板。 从光源发射的光束进入导光板，并通过可变形微结构的反射或折射离开导光板。 通过对导光板施加不同的外力，可变形微结构的变形将变化。 因此，可以根据可变形微结构的变形来改变光束的照明角度。

公开(公告)号：US20130027975A1

公开(公告)日：2013-01-31

申请号：US13563101

申请日：2012-07-31

Applicant: Chung-I CHIANG ,  Chuan-Fa LIN ,  Ching-Huan LIAO

Inventor： Chung-I CHIANG ,  Chuan-Fa LIN ,  Ching-Huan LIAO

IPC: F21V8/00

CPC classification number: G02B6/0055 ,  G02B6/0043

Abstract: A light guide plate with an adjustable illumination angle and an illumination device using the same are provided. The light guide plate has a first surface and a second surface opposite to the first surface. The second surface further has a plurality of deformable microstructures thereon. The deformable microstructures will be deformed when an external force is applied to the deformable microstructures. The illumination device has a light source and a light guide plate that is disposed next to the light source. A light beam emitted from the light source enters into the light guide plate and leaves the light guide plate via reflecting or refracting by the deformable microstructures. By applying a different external force to the light guide plate, the deformation of the deformable microstructures will be varied. Therefore, the illumination angle of the light beam could be changed according to the deformation of the deformable microstructures.

Abstract translation: 提供具有可调节照明角度的导光板和使用其的照明装置。 导光板具有与第一表面相对的第一表面和第二表面。 第二表面还具有多个可变形微结构。 当外力施加到可变形微结构时，可变形的微结构将变形。 照明装置具有设置在光源旁边的光源和导光板。 从光源发射的光束进入导光板，并通过可变形微结构的反射或折射离开导光板。 通过对导光板施加不同的外力，可变形微结构的变形将变化。 因此，可以根据可变形微结构的变形来改变光束的照明角度。

公开(公告)号：US20130026524A1

公开(公告)日：2013-01-31

申请号：US13563402

申请日：2012-07-31

Applicant: Chung-I CHIANG ,  Chuan-Fa Lin ,  Ching-Huan Liao

Inventor： Chung-I CHIANG ,  Chuan-Fa Lin ,  Ching-Huan Liao

IPC: H01L33/44

CPC classification number: H01L33/20 ,  H01L33/505 ,  H01L33/508

Abstract: A light emitting diode (LED) is provided. The LED comprises a semiconductor composite layer stacked laterally and a phosphor substrate. The phosphor substrate covers a lateral surface of the semiconductor composite layer.

Abstract translation: 提供了一种发光二极管（LED）。 LED包括横向堆叠的半导体复合层和荧光体基板。 荧光体基板覆盖半导体复合层的侧表面。

公开(公告)号：US20120094407A1

公开(公告)日：2012-04-19

申请号：US13328083

申请日：2011-12-16

Applicant: BILY WANG ,  JONNIE CHUANG ,  CHUAN-FA LIN ,  CHI-WEN HUNG

Inventor： BILY WANG ,  JONNIE CHUANG ,  CHUAN-FA LIN ,  CHI-WEN HUNG

IPC: H01L33/62

CPC classification number: H01L23/544 ,  H01L23/60 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L25/167 ,  H01L27/0248 ,  H01L33/46 ,  H01L33/62 ,  H01L2223/54493 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2224/45111 ,  H01L2224/131 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer level LED package structure includes a light-emitting unit, a reflecting unit, a first conductive unit and a second conductive unit. The light-emitting unit has a substrate body, a light-emitting body disposed on the substrate body, a positive and a negative conductive layers formed on the light-emitting body, and a light-emitting area formed in the light-emitting body. The reflecting unit has a reflecting layer formed between the positive and the negative conductive layers and on the substrate body for covering external sides of the light-emitting body. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive structure formed on the first positive conductive layer and a second negative conductive structure formed on the first negative conductive layer.

Abstract translation: 晶圆级LED封装结构包括发光单元，反射单元，第一导电单元和第二导电单元。 发光单元具有基板主体，设置在基板主体上的发光体，形成在发光体上的正极和负极导电层，以及形成在发光体中的发光区域。 反射单元具有形成在正导电层和负导电层之间的反射层和用于覆盖发光体的外侧的基板主体。 第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。 第二导电单元具有形成在第一正导电层上的第二正导电结构和形成在第一负导电层上的第二负导电结构。

公开(公告)号：US20090152574A1

公开(公告)日：2009-06-18

申请号：US12379258

申请日：2009-02-18

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin

IPC: H01L33/00

CPC classification number: C09K11/7787 ,  C09K11/7789 ,  C09K11/7794 ,  F21K9/00 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  Y02B20/181 ,  H01L2924/00014

Abstract: A multi-wavelength white light-emitting structure uses a UV light emitting diode chip and a blue light emitting diode chip to excite a red phosphor and a green phosphor and generates a white light-emitting structure having good color rendering. The multi-wavelength white light-emitting structure uses a UV light emitting diode chip that emits light having a wavelength of between 350˜430 nm to excite a red phosphor to emit red light having a wavelength of between 600˜700 nm. The present invention then uses a blue light emitting diode chip that emits light having a wavelength between of 400˜500 nm to emit blue light and uses the blue light emitting diode chip to excite a green phosphor to emit green light having a wavelength of between 490˜560 nm. Mixing the red light, the blue light and the green light forms a white light.

Abstract translation: 多波长白色发光结构使用UV发光二极管芯片和蓝色发光二极管芯片来激发红色荧光体和绿色荧光体，并产生具有良好显色性能的白色发光结构。 多波长白色发光结构使用发射波长在350〜430nm之间的光的UV发光二极管芯片，以激发红色荧光体发射波长在600〜700nm之间的红色光。 然后，本发明使用发射波长在400〜500nm之间的光的蓝色发光二极管芯片发射蓝色光并使用蓝色发光二极管芯片来激发绿色荧光体，发出波长在490nm之间的绿色光 〜560nm。 混合红光，蓝光和绿光形成白光。