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    Method for forming semiconductor package and mold cast used for the same
    1.
    发明申请
    Method for forming semiconductor package and mold cast used for the same 审中-公开
    用于形成半导体封装和模铸件的方法

    公开(公告)号：US20090029537A1

    公开(公告)日：2009-01-29

    申请号：US11878731

    申请日：2007-07-26

    Applicant: Chih Tai Hsu ,  Chung Ju Wu ,  Chung Yin Fang

    Inventor： Chih Tai Hsu ,  Chung Ju Wu ,  Chung Yin Fang

    IPC: H01L21/20

    CPC classification number: H01L23/3128 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A method for fabricating a thermally enhanced semiconductor package including the steps of providing a substrate having a first surface and a second surface; providing a die on the first surface of the substrate and electrically connecting the die with the substrate; placing the die, the substrate, and a heat slug in a mold cavity defined by a mold cast, the mold cast having a protruding portion that touches the periphery on the surface of the heat slug, wherein the contact area is defined as a periphery region and the non-contact area enclosed by the periphery region is defined as a central region; and encapsulating the die and the heat slug by molding materials, wherein the periphery region and the central region of the heat slug are exposed to the ambient air.

    Abstract translation: 一种制造热增强半导体封装的方法，包括以下步骤：提供具有第一表面和第二表面的衬底; 在所述基板的所述第一表面上提供模具并将所述管芯与所述基板电连接; 将模具，基板和热芯块放置在由模铸件限定的模腔中，模铸件具有接触热芯块表面周边的突出部分，其中接触区域被定义为周边区域 并且由周边区域包围的非接触区域被定义为中心区域; 并且通过模制材料封装模具和热块，其中热块的周边区域和中心区域暴露于环境空气中。

    Integrated circuit package capable of improving signal quality
    4.
    发明授权
    Integrated circuit package capable of improving signal quality 有权
    集成电路封装，能够提高信号质量

    公开(公告)号：US06744128B2

    公开(公告)日：2004-06-01

    申请号：US10262958

    申请日：2002-10-03

    Applicant: Chung-Ju Wu ,  Kuei-Chen Liang ,  Wei-Feng Lin

    Inventor： Chung-Ju Wu ,  Kuei-Chen Liang ,  Wei-Feng Lin

    IPC: H01L2302

    CPC classification number: H01L23/49833 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00

    Abstract: An integrated circuit package capable of improving signal quality is disclosed. The integrated circuit package comprises a first substrate, an integrated circuit chip attached on the first surface of the first substrate. This integrated circuit package further comprises a plurality of external terminals mounted on the first substrate and a plurality of first bonding pads mounted on the edge portion of the first surface of the first substrate and respectively connected to the corresponding external terminals. Also, the integrated circuit package further comprises a second substrate and a plurality of second bonding pads mounted on the second surface of the second substrate and connected to the first bonding pads formed on the first substrate. Furthermore, this integrated circuit package further comprises a plurality of passive components disposed on the second substrate.

    Abstract translation: 公开了能够提高信号质量的集成电路封装。 集成电路封装包括第一衬底，附接在第一衬底的第一表面上的集成电路芯片。 该集成电路封装还包括安装在第一基板上的多个外部端子和安装在第一基板的第一表面的边缘部分上并分别连接到相应的外部端子的多个第一接合焊盘。 此外，集成电路封装还包括第二衬底和安装在第二衬底的第二表面上并连接到形成在第一衬底上的第一焊盘的多个第二焊盘。 此外，该集成电路封装还包括设置在第二基板上的多个无源部件。

    Method for allocating registers for a processor based on cycle information
    6.
    发明授权
    Method for allocating registers for a processor based on cycle information 有权
    基于周期信息为处理器分配寄存器的方法

    公开(公告)号：US08539462B2

    公开(公告)日：2013-09-17

    申请号：US12974291

    申请日：2010-12-21

    Applicant: Chung Ju Wu ,  Yu Te Lin ,  Jenq Kuen Lee

    Inventor： Chung Ju Wu ,  Yu Te Lin ,  Jenq Kuen Lee

    IPC: G06F9/45

    CPC classification number: G06F9/3891

    Abstract: A method of allocating registers for a processor based on cycle information is disclosed. The processor comprises a first cluster and a second cluster. Each cluster comprises a first functional unit, a second functional unit, a first local register file connected to the first functional unit, a second local register file connected to the second register file, and a global register file having a ping-pong structure formed by a first register bank and a second register bank. After building a Component/Register Type Associated Data Dependency Graph (CRTA-DDG), a functional unit assignment, register file assignment, ping-pong register bank assignment, and cluster assignment are performed to take full advantage of the properties of a processor as well as cycle information.

    Abstract translation: 公开了一种基于周期信息为处理器分配寄存器的方法。 处理器包括第一集群和第二集群。 每个集群包括第一功能单元，第二功能单元，连接到第一功能单元的第一本地寄存器文件，连接到第二寄存器堆的第二本地寄存器文件，以及具有乒乓结构的全局寄存器堆，所述乒乓结构由 第一个注册银行和第二个注册银行。 在构建组件/寄存器类型关联数据依赖图（CRTA-DDG）之后，执行功能单元分配，寄存器文件分配，乒乓寄存器组分配和集群分配，以充分利用处理器的属性 作为循环信息。

    Method for copy propagations for a processor with distributed register file design
    7.
    发明授权
    Method for copy propagations for a processor with distributed register file design 有权
    具有分布式寄存器文件设计的处理器的复制传播方法

    公开(公告)号：US08051411B2

    公开(公告)日：2011-11-01

    申请号：US11835828

    申请日：2007-08-08

    Applicant: Jenq Kuen Lee ,  Chung Ju Wu ,  Sheng Yuan Chen

    Inventor： Jenq Kuen Lee ,  Chung Ju Wu ,  Sheng Yuan Chen

    IPC: G06F9/45 ,  G06F9/445

    CPC classification number: G06F9/3885 ,  G06F8/443 ,  G06F9/3012 ,  G06F9/3828 ,  G06F9/3891

    Abstract: A method for copy propagations of a processor including two clusters, each cluster comprising a first function unit and a second function unit, a first local register file and a second local register file being respectively accessible by the first and second function unit only, and a global register file having a ping-pong structure to access the first and second local register files, the method comprising the steps of: (a) listing possible copy propagation paths between two nodes of a data flow graph; (b) calculating a profit of machine cycles for each of the copy propagation paths according to constraints of the processor; and (c) performing a copy propagation through the copy propagation path if the profit thereof is greater than a threshold value.

    Abstract translation: 一种用于包括两个群集的处理器的复制传播的方法，每个簇包括第一功能单元和第二功能单元，第一本地寄存器文件和第二本地寄存器文件分别仅由第一和第二功能单元访问， 具有乒乓结构以访问第一和第二本地寄存器文件的全局寄存器文件，所述方法包括以下步骤：（a）列出数据流图的两个节点之间的可能的复制传播路径; （b）根据处理器的约束计算每个复制传播路径的机器周期的利润; 以及（c）如果其利润大于阈值，则通过复制传播路径执行复制传播。

    Heat dissipation mechanism for electronic apparatus
    8.
    发明授权
    Heat dissipation mechanism for electronic apparatus 有权
    电子设备散热机构

    公开(公告)号：US07307844B2

    公开(公告)日：2007-12-11

    申请号：US11056533

    申请日：2005-02-11

    Applicant: Chung-Ju Wu

    Inventor： Chung-Ju Wu

    IPC: H05K7/20

    CPC classification number: H05K7/20445 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    Abstract: This disclosure presents a heat dissipation mechanism, which conducts generated heat of a thermal device to the housing of an electronic apparatus by a metal piece fastened between the thermal device and electronic apparatus, and then dissipates heat into the air through multiple holes opened over an apparatus shell. Besides, the presented mechanism is also suitable to mini-size, portable electronic apparatus to solve the thermal dissipation technique thereof.

    Abstract translation: 本公开提供了一种散热机构，其通过紧固在热装置和电子装置之间的金属片将热装置的发热传导到电子装置的壳体，然后通过在装置上打开的多个孔将热量散发到空气中 贝壳。 此外，所提出的机构也适用于微型尺寸的便携式电子设备来解决其散热技术。

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