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公开(公告)号：US20250059372A1
公开(公告)日：2025-02-20
申请号：US18368712
申请日：2023-09-15
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu HSIEH
Abstract: A resin composition includes a vinyl group-containing resin and a phosphorus-containing compound of Formula (1) or a prepolymer thereof, wherein: relative to 100 parts by weight of the vinyl group-containing resin, the phosphorus-containing compound of Formula (1) is 35 to 60 parts by weight; or relative to 100 parts by weight of the vinyl group-containing resin, the prepolymer of the phosphorus-containing compound of Formula (1) is 50 to 90 parts by weight. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more properties can be improved.
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公开(公告)号：US20240010791A1
公开(公告)日：2024-01-11
申请号：US17881299
申请日：2022-08-04
Applicant: Elite Material Co., Ltd.
Inventor： Shu-Hao CHANG
IPC: C08G65/48 , C08G73/10 , C08K5/159 , C08K5/057 , C08K5/544 , C08K3/36 , C08K3/38 , C08J5/24 , C08J5/18
CPC classification number: C08G65/485 , C08G73/10 , C08K5/159 , C08K5/057 , C08K5/544 , C08K3/36 , C08K3/38 , C08J5/24 , C08J5/18 , C08G2650/04 , C08K2003/385
Abstract: A resin composition includes 120 parts by weight of a vinyl group-containing polyphenylene ether resin, 5 parts by weight to 10 parts by weight of a compound of Formula (1), 15 parts by weight to 25 parts by weight of a compound of Formula (2), and 70 parts by weight to 110 parts by weight of an inorganic filler. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including difference rate of dissipation factor, gel time stability and stickiness.
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公开(公告)号：US20230391806A1
公开(公告)日：2023-12-07
申请号：US18322323
申请日：2023-05-23
Applicant: Elite Material Co., Ltd.
Inventor： Chien-Hsiang CHEN , Chun-Hsiung CHANG
IPC: C07F9/12
CPC classification number: C07F9/12
Abstract: A phosphorus-containing compound of Formula (1) and a preparation method thereof are provided. The phosphorus-containing compound is a compound having a reactive functional group and containing a phosphorus atom in its structure. The preparation method includes: (1) reacting magnolol and phosphoryl chloride in a first alkaline environment to obtain an intermediate product; and (2) reacting the intermediate product and a benzenediol in a second alkaline environment to obtain the phosphorus-containing compound.
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公开(公告)号：US11572469B2
公开(公告)日：2023-02-07
申请号：US17339566
申请日：2021-06-04
Applicant: Elite Material Co., Ltd.
Inventor： Ching-Hsien Hsu , Tse-Hung Liu , Tsan-Hung Tsai
IPC: C08K5/3492 , C08L71/12
Abstract: A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
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公开(公告)号：US20210371656A1
公开(公告)日：2021-12-02
申请号：US16923340
申请日：2020-07-08
Applicant: Elite Material Co., Ltd.
Inventor： Yi-Fei YU , Chien-Hung LEE , Chen-Yu HSIEH
Abstract: A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.
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Patent Agency Ranking
公开(公告)号：US20200047463A1
公开(公告)日：2020-02-13
申请号：US16660046
申请日：2019-10-22
Applicant: Elite Material Co., Ltd.
Inventor： Chia-Hui HUANG , Hsing-Lung LI
Abstract: Disclosed is an assembly manufacturing method comprising: cutting a prepreg into a prepreg sheet according to a first parameter; moving the prepreg sheet to an assembly arrangement area according to a second parameter; superimposing a metal foil and a plate according to a fourth parameter to form a copper foil set; and assembling the copper foil set and the prepreg sheet according to a third parameter to form an assembly.
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公开(公告)号：US10557033B2
公开(公告)日：2020-02-11
申请号：US15373915
申请日：2016-12-09
Applicant: Elite Material Co., Ltd.
Inventor： Shu-Hao Chang
Abstract: The disclosure relates to a resin composition, comprising an epoxy resin, a high molecular weight polyetheramine and an amine-terminated acrylonitrile rubber. Various products can be made from the resin composition, such as prepregs, laminates, printed circuit boards or rigid-flex boards, in which one, multiple or all of the following properties can be met: low resin flow, low dust weight loss, high peel strength at room temperature and at high temperature, low moisture absorption rate, and better varnish stability.
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公开(公告)号：US20190300556A1
公开(公告)日：2019-10-03
申请号：US15977127
申请日：2018-05-11
Applicant: Elite Material Co., Ltd.
Inventor： Shu-Hao CHANG , Zhilong HU , Ching-Hsien HSU
IPC: C07F9/6571 , C09K21/12 , C09D5/18 , C09D123/08 , C09D123/02 , C09D171/12
Abstract: A phosphorus-containing flame retardant, a preparation method thereof, a resin composition comprising the phosphorus-containing flame retardant and an article made therefrom are disclosed. The phosphorus-containing flame retardant is characterized by having the advantages of high phosphorus content, high resin compatibility, not increasing gel time of varnish and low water absorption rate, and is therefore suitable for use as a flame retardant of various resin materials.
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公开(公告)号：US20180170011A1
公开(公告)日：2018-06-21
申请号：US15644176
申请日：2017-07-07
Applicant: Elite Material Co., Ltd.
Inventor： Chia-Hui HUANG , Hsing-Lung LI
CPC classification number: B32B15/20 , B32B15/08 , B32B2260/02
Abstract: Disclosed is an assembly arrangement system, comprising a feeding unit, a conveyor unit and an assembling unit. The feeding unit comprises a supplying part and a cutting part. The supplying part is provided with a prepreg and configured to supply the prepreg to the cutting part. The cutting part cuts the prepreg to continuously form one or more prepreg sheets. The conveyor unit receives and conveys the prepreg sheet. The assembling unit comprises a metal foil supplying part, a first assembling part and a second assembling part. The second assembling part assembles a plate and a metal foil from the metal foil supplying part with the prepreg sheet from the conveyor unit into an assembly, and the first assembling part bears the assembly. Also provided is an assembly manufacturing method.
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公开(公告)号：US10000599B2
公开(公告)日：2018-06-19
申请号：US15373834
申请日：2016-12-09
Applicant: Elite Material Co., Ltd.
Inventor： Chen Yu Hsieh
IPC: C08K7/18 , C08F230/02
Abstract: The disclosure relates to a phosphorus-containing vinyl polyphenylene ether obtained by reacting a phosphorus-containing vinyl compound with a vinyl polyphenylene ether, a resin composition including the phosphorus-containing vinyl polyphenylene ether and a product thereof. Various products can be made from the resin composition, such as resin films, prepregs, resin-coated coppers, laminates or printed circuit boards, and they have one, multiple or all of the following properties: lower coefficient of thermal expansion, lower thermal expansion, higher thermal resistance, better flame retardancy, lower dielectric constant, lower dielectric loss and so forth.
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