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公开(公告)号：US10420251B2
公开(公告)日：2019-09-17
申请号：US15773150
申请日：2015-11-16
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
Abstract: An electronic device is immersed in a coolant in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, storage units attached to a first surface of the metal board and a second surface opposite the first surface, and a backplane including connectors for electrically connecting the respective storage units, attached orthogonally to the first surface of the metal board, and the second surface opposite the first surface. The metal board includes a primary member including cuts in a width direction for fixing support plates that support the storage units to the primary member, and a secondary member includes pawls inserted into slits in the backplane, and fixed to the primary member. The support plates include holes for passage of the coolant.
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公开(公告)号：US10123454B2
公开(公告)日：2018-11-06
申请号：US15563428
申请日：2015-03-30
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
IPC: H05K7/20 , G06F1/20 , H01L23/473
Abstract: Provided is a cooling system capable of improving the cooling performance of an electronic device and being simple and efficient. The cooling system has a cooling tank, and the cooling tank contains in its open space a second cooling liquid having a boiling point T2. An electronic device mounting a processor as a heating element on a board is stored within the open space of the cooling tank and is immersed in the second cooling liquid. A boiling cooling device is a cooling device thermally connected to the processor and encloses a first cooling liquid having a boiling point T1 (provided T1=T2 or T1 T3).
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公开(公告)号：US20180196484A1
公开(公告)日：2018-07-12
申请号：US15741094
申请日：2015-07-02
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: G06F1/20 , B66D3/26 , G06F2200/201 , H01L23/44 , H05K7/20236 , H05K7/20272 , H05K7/20763 , H05K7/20781
Abstract: Inner partitions disposed within a cooling tank have an open space to form arrayed housing parts, and at least one unit of electronic device housed in each of the housing parts. A lifting mechanism includes a tower having a guide and a driving source for raising and lowering an arm, a slide mechanism attached to the cooling tank, and a stopper for restricting the tower's movement so that a range of the tower's motion in a width direction of the cooling tank does not exceed at least a width of the open space. The slide mechanism supports the tower movably with respect to the cooling tank in a horizontal plane located above the open space. The liquid immersion cooling system can safely lift or lower the electronic devices densely housed within the cooling tank without requiring the stage in the periphery of the installation surface of the cooling tank.
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公开(公告)号：US20180020571A1
公开(公告)日：2018-01-18
申请号：US15545651
申请日：2015-01-22
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: H05K7/20236 , F25D9/005 , G06F1/20 , G06F1/206 , G06F2200/201 , H01L23/44 , H01L23/473 , H05K5/0026 , H05K7/20 , H05K7/20272 , H05K7/20281 , H05K7/20636
Abstract: In a cooling system for electronic apparatuses, the electronic apparatus includes inner partitioning walls disposed in a cooling tank with an open space, defined by a bottom wall and side walls for dividing the open space into arrayed storage sections. An electronic apparatus is stored in the storage section. Inflow openings for the cooling liquid are formed in a bottom portion or a side surface of the respective storage sections, and outflow openings are formed at a position near the liquid surface of the cooling liquid flowing in the respective storage sections. The electronic apparatus includes a first board having a first surface on which at least one processor is mounted, and a second surface opposite the first surface, a second board having the third surface that faces the second surface of the first board, and a flow channel formed as a gap between the second and third surface.
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公开(公告)号：US20170354061A1
公开(公告)日：2017-12-07
申请号：US15533348
申请日：2014-12-05
Applicant: EXASCALER INC.
Inventor： Motoaki SAITO
CPC classification number: H05K7/20236 , F24T10/10 , F25D9/00 , F25D9/005 , G06F1/20 , G06F1/206 , H01L23/44 , H01L23/473 , H01L2924/0002 , H05K7/20 , H05K7/20636 , Y02E10/12 , H01L2924/00
Abstract: Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the variance in the cooling performances and of being improved in the handling and maintainability of the electronic apparatuses. A plurality of inner partitioning walls are provided in a cooling tank having an open space defined by a bottom wall and side walls to divide the open space, and a plurality of arrayed storage sections are defined. An electronic apparatus is stored in each of the storage sections. Each of the storage sections is formed with an inflow opening and an outflow opening for the cooling liquid. The inflow opening is formed at a bottom portion or a side surface of each storage section, and the outflow opening is formed in the vicinity of the liquid level of the cooling liquid flowing through each storage section.
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Patent Agency Ranking
公开(公告)号：US11026345B2
公开(公告)日：2021-06-01
申请号：US16612705
申请日：2017-05-11
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
Abstract: A processor module includes a first circuit substrate and a second circuit substrate each having a processor mounting area and a memory mounting area on one surface thereof. One processor is mounted in the processor mounting area, while comb-like arranged memory modules are mounted in the memory mounting area. The surface of the first circuit substrate and the surface of the second circuit substrate are combined face-to-face and positioned such that the processor mounting area and the memory mounting area of the first circuit substrate are placed face-to-face respectively with the processor mounting area and the memory mounting area of the second circuit substrate, and end parts of the plurality of comb-like arranged memory modules of the first circuit substrate and end parts of the plurality of comb-like arranged memory modules of the second circuit substrate are alternately arranged with clearances produced between adjacent memory modules.
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公开(公告)号：US11009925B2
公开(公告)日：2021-05-18
申请号：US16302580
申请日：2016-05-16
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
Abstract: An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in a housing part of the cooling apparatus, and includes a base board, storage substrates to be arranged on at least one surface of the base board, a backplane mounted orthogonally onto the one surface of the base board, and flash storage units mounted on the respective storage substrates. The backplane includes a combination of backplane units each including a signal connector and a power connector. The signal connector and the power connector are disposed separately for each of the backplane units. The flash storage units are arranged on a surface parallel to at least one surface of each of the storage substrates so as to be adjacent one another in a width or a length direction of the flash storage unit.
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公开(公告)号：US20190357384A1
公开(公告)日：2019-11-21
申请号：US16347782
申请日：2016-11-12
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
Abstract: Provided is a power supply unit which is immersed and directly cooled in a coolant filled in a cooling apparatus. The power supply unit includes a unit substrate, and a voltage step-down device mounted on the unit substrate. The unit substrate includes a voltage input terminal for supplying an external power supply voltage, and a voltage output terminal. The voltage output terminal is electrically connected to a voltage input terminal of an electronic device. The power supply unit is mounted on a bottom of a cooling tank of the cooling apparatus so that the electronic device is positioned at an upper part of the power supply unit upon electrical connection between the electronic device and the power supply unit, and cooled by the coolant flowing from the bottom, or flowing from another section of the cooling tank. The unit substrate may be disposed apart from the bottom so as to form a flow channel which allows passage of the coolant between one surface of the unit substrate and the bottom. The voltage step-down device may be configured to include a converter module which steps down the external high voltage DC voltage from 200V to 420V to the DC voltage from 24V to 52V.
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公开(公告)号：US20190317570A1
公开(公告)日：2019-10-17
申请号：US16347759
申请日：2016-11-12
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
Abstract: Provided are an electronic device and a power supply unit, both of which are immersed and directly cooled in a coolant filled in a cooling apparatus. The electronic device includes a carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, a plurality of module connectors arranged on one surface of the carrier substrate, a plurality of module substrates, a plurality of supporting plates for holding both ends of the respective module substrates, and a supporting member for supporting the carrier substrate. The voltage input terminal is electrically connected to a voltage output terminal of the power supply unit. Each of the module substrates includes a module connector plug electrically coupled to each of the module connectors. The supporting member supports the carrier substrate so as to be positioned at the upper part of the power supply unit mounted on the bottom of the cooling tank of the cooling apparatus upon electrical connection between the electronic device and the power supply unit. The power supply unit includes a unit substrate, a voltage step-down device mounted on the unit substrate, and a stage to which the unit substrate is fixed.
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公开(公告)号：US20180363994A1
公开(公告)日：2018-12-20
申请号：US15773140
申请日：2015-11-11
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
Abstract: A cooling system 400 configured to directly cool an electronic device immersed in a coolant includes a cooling tank 50 containing the coolant C, and a leakage receiving portion 21 disposed between the cooling tank 50 and a floor surface 32 so as to receive the coolant L leaked from the cooling tank 50. The cooling tank 50 includes a lower structure 53 fixed to the floor surface 32, an upper structure 51 having the electronic device immersed in the coolant C, and a seismic isolation device 55 disposed between the lower structure 53 and the upper structure 51. It is possible to provide the cooling system which is highly durable against externally exerted strong impact and vibration caused by such disaster as earthquake.
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