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公开(公告)号：US20100188499A1
公开(公告)日：2010-07-29
申请号：US12657089
申请日：2010-01-13
Applicant: Ajharali Amanullah , Han Cheng Ge
Inventor： Ajharali Amanullah , Han Cheng Ge
CPC classification number: G01N21/9501 , G01N21/8806 , G01N2021/8825 , G06T7/001 , G06T2207/10152 , G06T2207/20212 , G06T2207/30148 , H01L22/12
Abstract: A method and a system for inspecting a wafer. The system comprises an optical inspection head, a wafer table, a wafer stack, a XY table and vibration isolators. The optical inspection head comprises a number of illuminators, image capture devices, objective lens and other optical components. The system and method enables capture of brightfield images, darkfield images, 3D profile images and review images. Captured images are converted into image signals and transmitted to a programmable controller for processing. Inspection is performed while the wafer is in motion. Captured images are compared with reference images for detecting defects on the wafer. An exemplary reference creation process for creating reference images and an exemplary image inspection process is also provided by the present invention. The reference image creation process is an automated process.
Abstract translation: 一种用于检查晶片的方法和系统。 该系统包括光学检测头，晶片台，晶片堆叠，XY工作台和隔振器。 光学检查头包括多个照明器，图像捕获装置，物镜和其它光学部件。 该系统和方法能够捕获亮场图像，暗场图像，3D轮廓图像和检查图像。 捕获的图像被转换为图像信号并传输到可编程控制器进行处理。 在晶片运动时进行检查。 捕获的图像与用于检测晶片上的缺陷的参考图像进行比较。 本发明还提供了用于创建参考图像和示例性图像检查过程的示例性参考创建过程。 参考图像创建过程是一个自动化过程。
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公开(公告)号：US20080246958A1
公开(公告)日：2008-10-09
申请号：US11732888
申请日：2007-04-05
Applicant: Ajharali Amanullah , Han Cheng Ge , Huek Choy Tan , Hing Tim Lai
Inventor： Ajharali Amanullah , Han Cheng Ge , Huek Choy Tan , Hing Tim Lai
IPC: G01N21/00
CPC classification number: G01N21/8806
Abstract: A system for inspecting components is provided. The system includes a prism having a first end, a second end, a first reflecting surface, and a second reflecting surface. The first end of the prism is located in a plane that is parallel to and axially separated from a plane of one or more of a plurality of inspection pieces. An image data system is disposed beyond the second end of the prism and generates image data of one or more of the inspection piece that includes a top surface of at least one of the inspection pieces and at least one side of at least one of the inspection pieces. An inspection piece transportation system, such as a pick and place tool or conveyor, moves a plurality of inspection pieces past the first end of the prism through an inspection area.
Abstract translation: 提供了一个用于检查组件的系统。 该系统包括具有第一端，第二端，第一反射表面和第二反射表面的棱镜。 棱镜的第一端位于与多个检查件中的一个或多个的平面平行并与其轴向分离的平面中。 图像数据系统设置在棱镜的第二端之外，并且生成检查片中的一个或多个的图像数据，其包括至少一个检查片的顶表面和至少一个检查件的至少一个 件 诸如拾放工具或输送机的检查件运送系统通过检查区域将多个检查件移动经过棱镜的第一端。
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公开(公告)号：US20100188486A1
公开(公告)日：2010-07-29
申请号：US12657068
申请日：2010-01-13
Applicant: Ajharali Amanullah , Lin Jing , Han Cheng Ge , Kok Weng Wong
Inventor： Ajharali Amanullah , Lin Jing , Han Cheng Ge , Kok Weng Wong
CPC classification number: G01N21/8806 , G01N21/9501 , G01N2021/8825 , G01N2201/06113 , G01N2201/0636 , G06T7/0008 , G06T7/001 , G06T2207/10152 , G06T2207/20212 , G06T2207/30148 , H01L22/12 , H01L2924/0002 , H04N5/2354 , H01L2924/00
Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer. The system comprises a reflector assembly for enabling the third image capture device to receive illumination reflected from the semiconductor wafer in multiple directions.
Abstract translation: 用于检查半导体晶片的检查系统。 检查系统包括用于提供宽带照明的照明设备。 宽带照明可以具有不同的对比度，例如明场和暗场宽带照明。 检查系统还包括第一图像捕获装置和第二图像捕获装置，每个被配置为在半导体晶片运动的同时接收宽带照明以捕获半导体晶片的图像。 该系统包括许多用于使准直宽带照明的管透镜。 该系统还包括稳定机构和物镜组件。 该系统还包括细线照明发射器和用于接收细线照明从而捕获半导体晶片的三维图像的第三图像捕获装置。 该系统包括反射器组件，用于使得第三图像捕获装置能够在多个方向上接收从半导体晶片反射的照明。
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Patent Agency Ranking
公开(公告)号：US09863889B2
公开(公告)日：2018-01-09
申请号：US12657089
申请日：2010-01-13
Applicant: Ajharali Amanullah , Han Cheng Ge
Inventor： Ajharali Amanullah , Han Cheng Ge
CPC classification number: G01N21/9501 , G01N21/8806 , G01N2021/8825 , G06T7/001 , G06T2207/10152 , G06T2207/20212 , G06T2207/30148 , H01L22/12
Abstract: A method and a system for inspecting a wafer. The system comprises an optical inspection head, a wafer table, a wafer stack, a XY table and vibration isolators. The optical inspection head comprises a number of illuminators, image capture devices, objective lens and other optical components. The system and method enables capture of brightfield images, darkfield images, 3D profile images and review images. Captured images are converted into image signals and transmitted to a programmable controller for processing. Inspection is performed while the wafer is in motion. Captured images are compared with reference images for detecting defects on the wafer. An exemplary reference creation process for creating reference images and an exemplary image inspection process is also provided by the present invention. The reference image creation process is an automated process.
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公开(公告)号：US07768633B2
公开(公告)日：2010-08-03
申请号：US11732888
申请日：2007-04-05
Applicant: Ajharali Amanullah , Han Cheng Ge , Huek Choy Tan , Hing Tim Lai
Inventor： Ajharali Amanullah , Han Cheng Ge , Huek Choy Tan , Hing Tim Lai
IPC: G01N21/00
CPC classification number: G01N21/8806
Abstract: A system for inspecting components is provided. The system includes a prism having a first end, a second end, a first reflecting surface, and a second reflecting surface. The first end of the prism is located in a plane that is parallel to and axially separated from a plane of one or more of a plurality of inspection pieces. An image data system is disposed beyond the second end of the prism and generates image data of one or more of the inspection piece that includes a top surface of at least one of the inspection pieces and at least one side of at least one of the inspection pieces. An inspection piece transportation system, such as a pick and place tool or conveyor, moves a plurality of inspection pieces past the first end of the prism through an inspection area.
Abstract translation: 提供了一个用于检查组件的系统。 该系统包括具有第一端，第二端，第一反射表面和第二反射表面的棱镜。 棱镜的第一端位于与多个检查件中的一个或多个的平面平行并与其轴向分离的平面中。 图像数据系统设置在棱镜的第二端之外，并且生成检查片中的一个或多个的图像数据，其包括至少一个检查片的顶表面和至少一个检查件的至少一个 件 诸如拾放工具或输送机的检查件运送系统通过检查区域将多个检查件移动经过棱镜的第一端。
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公开(公告)号：US20090073426A1
公开(公告)日：2009-03-19
申请号：US12118209
申请日：2008-05-09
Applicant: Ajharali Amanullah , Han Cheng Ge , Huek Choy Tan , Hing Tim Lai
Inventor： Ajharali Amanullah , Han Cheng Ge , Huek Choy Tan , Hing Tim Lai
IPC: G01N21/00
CPC classification number: G01N21/8806
Abstract: A system for on-the-fly inspection of components is provided. The system includes a prism structure disposed below an inspection item transit path. An image data system is disposed below the prism structure. A lighting assembly provides a first lighting source to illuminate a plurality of sides of an inspection item and a second lighting source to illuminate a bottom of the inspection item.
Abstract translation: 提供了用于组件的即时检查的系统。 该系统包括设置在检查物品输送路径下方的棱镜结构。 图像数据系统设置在棱镜结构的下方。 照明组件提供第一照明源以照亮检查项目的多个侧面和第二照明源以照亮检查项目的底部。
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公开(公告)号：US10161881B2
公开(公告)日：2018-12-25
申请号：US12657068
申请日：2010-01-13
Applicant: Ajharali Amanullah , Lin Jing , Han Cheng Ge , Kok Weng Wong
Inventor： Ajharali Amanullah , Lin Jing , Han Cheng Ge , Kok Weng Wong
Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer. The system comprises a reflector assembly for enabling the third image capture device to receive illumination reflected from the semiconductor wafer in multiple directions.
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公开(公告)号：US07869021B2
公开(公告)日：2011-01-11
申请号：US12118209
申请日：2008-05-09
Applicant: Ajharali Amanullah , Han Cheng Ge , Huek Choy Tan , Hing Tim Lai
Inventor： Ajharali Amanullah , Han Cheng Ge , Huek Choy Tan , Hing Tim Lai
IPC: G01N21/00
CPC classification number: G01N21/8806
Abstract: A system for on-the-fly inspection of components is provided. The system includes a prism structure disposed below an inspection item transit path. An image data system is disposed below the prism structure. A lighting assembly provides a first lighting source to illuminate a plurality of sides of an inspection item and a second lighting source to illuminate a bottom of the inspection item.
Abstract translation: 提供了用于组件的即时检查的系统。 该系统包括设置在检查物品输送路径下方的棱镜结构。 图像数据系统设置在棱镜结构的下方。 照明组件提供第一照明源以照亮检查项目的多个侧面和第二照明源以照亮检查项目的底部。
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