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    LOW COST VEHICLE ELECTRICAL AND ELECTRONIC COMPONENTS AND SYSTEMS MANUFACTURED FROM CONDUCTIVE LOADED RESIN-BASED MATERIALS
    1.
    发明申请
    LOW COST VEHICLE ELECTRICAL AND ELECTRONIC COMPONENTS AND SYSTEMS MANUFACTURED FROM CONDUCTIVE LOADED RESIN-BASED MATERIALS 审中-公开
    低成本车载电气和电子元件和系统由导电负载树脂材料制造

    公开(公告)号：US20140272117A1

    公开(公告)日：2014-09-18

    申请号：US14293315

    申请日：2014-06-02

    Applicant: INTEGRAL TECHNOLOGIES, INC.

    Inventor： THOMAS AISENBREY

    IPC: H01B13/00

    CPC classification number: H01B13/0026 ,  B60R16/02 ,  H01B1/22

    Abstract: Vehicle electrical and electronic components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

    Abstract translation: 车载电气和电子部件由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

    Low cost electrical cable connector housings and cable heads manufactured from conductive loaded resin-based materials
    3.
    发明申请
    Low cost electrical cable connector housings and cable heads manufactured from conductive loaded resin-based materials 失效
    低成本电缆连接器外壳和电缆头，由导电负载的树脂基材料制成

    公开(公告)号：US20040235351A1

    公开(公告)日：2004-11-25

    申请号：US10884322

    申请日：2004-07-02

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: H01R013/648

    CPC classification number: H01R13/6599 ,  Y10S439/916

    Abstract: Electrical connector housings are formed of a conductive loaded resin-based material which provides superior protection from EMI and RFI by absorbing such interfering signals. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination thereof, in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 40% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

    Abstract translation: 电连接器壳体由导电负载的树脂基材料形成，其通过吸收这种干扰信号而提供优于EMI和RFI的保护。 导电负载的树脂基材料在基础树脂主体中包含微米导电粉末，导电纤维或其组合。 导电粉末，导电纤维或其组合的重量百分比为导电负载树脂基材料重量的约20％至40％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀的等，或由金属如不锈钢，镍，铜，银，也可以是金属镀，或者 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

    Low cost inductor devices manufactured from conductive loaded resin-based materials
    4.
    发明申请
    Low cost inductor devices manufactured from conductive loaded resin-based materials 失效
    由导电负载树脂基材料制造的低成本电感器件

    公开(公告)号：US20040196201A1

    公开(公告)日：2004-10-07

    申请号：US10825979

    申请日：2004-04-16

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: H01Q001/00

    CPC classification number: H01Q7/00 ,  D01F1/09 ,  H01Q1/3225 ,  H01Q1/364

    Abstract: Inductors and inductive devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based inductors and inductive devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the inductors and inductive devices can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

    Abstract translation: 电感器和感应装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。 导电负载的树脂基电感器和感应装置可以使用诸如注射成型压缩成型或挤压的方法来形成。 用于形成电感器和电感器件的导电负载树脂基材料也可以是可以容易地切割成所需形状的薄柔性机织织物的形式。

    Low cost lighting circuits manufactured from conductive loaded resin-based materials
    5.
    发明申请
    Low cost lighting circuits manufactured from conductive loaded resin-based materials 有权
    由导电负载的树脂基材料制造的低成本照明电路

    公开(公告)号：US20040189170A1

    公开(公告)日：2004-09-30

    申请号：US10819809

    申请日：2004-04-07

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: H01J001/88

    CPC classification number: G06K19/07749 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  C09K11/08 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/095 ,  H05K1/167 ,  H05K1/18 ,  H05K1/181 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/10 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/0113 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Lighting devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based lighting devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the lighting devices can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

    Abstract translation: 照明装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。 导电负载的树脂基照明装置可以使用诸如注射成型压缩成型或挤出的方法来形成。 用于形成照明装置的导电负载树脂基材料也可以是可以容易地切割成所需形状的薄柔性机织织物的形式。

    Low cost antennas and electromagnetic ( EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials
    6.
    发明申请
    Low cost antennas and electromagnetic ( EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials 失效
    使用导电负载树脂基材料的电子电路封装或收发器中的低成本天线和电磁（EMF）吸收

    公开(公告)号：US20040160377A1

    公开(公告)日：2004-08-19

    申请号：US10780214

    申请日：2004-02-17

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: H01Q013/10 ,  H01Q001/42

    CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01B1/22 ,  H01Q1/1271 ,  H01Q1/364 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

    Abstract: Low cost antennas and electromagnetic absorbing parts formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises conductive fibers, conductive powders, or in combination thereof in a resin base host wherein the ratio of the weight of the conductor fibers, conductor powders, or combination of conductor fibers and conductor powders to the weight of the base resin host is between about 0.20 and 0.40. The conductive fibers or conductive powders can be stainless steel, nickel, copper, silver, carbon, graphite, plated fibers or particles, or the like. The antenna elements can be formed using methods such as injection molding or extrusion. Virtually any antenna, ground planes, or shielding packages fabricated by conventional means of metal can be fabricated using the conductive loaded resin-based materials. The conductive loaded resin-based material used to form the antenna elements, EMF absorbing elements, or ground planes can be in the form of a thin flexible material, which can be readily cut to the desired shape.

    Abstract translation: 由导电负载的树脂基材料形成的低成本天线和电磁吸收部件。 导电负载的树脂基材料包括导电纤维，导电粉末或其组合在树脂基质主体中，其中导体纤维，导体粉末或导体纤维和导体粉末的组合的重量比与 基础树脂主体在约0.20和0.40之间。 导电纤维或导电粉末可以是不锈钢，镍，铜，银，碳，石墨，电镀纤维或颗粒等。 可以使用诸如注射成型或挤出的方法来形成天线元件。 实际上，任何通过常规金属制造的天线，接地平面或屏蔽封装均可使用导电负载的树脂基材料制造。 用于形成天线元件，EMF吸收元件或接地平面的导电负载树脂基材料可以是薄的柔性材料的形式，其可以容易地切割成所需的形状。

    Low cost food processing belts and other conveyances manufactured from conductive loaded resin-based materials
    8.
    发明申请
    Low cost food processing belts and other conveyances manufactured from conductive loaded resin-based materials 有权
    低成本的食品加工带和其他由导电负载的树脂基材料制成的运输工具

    公开(公告)号：US20040211653A1

    公开(公告)日：2004-10-28

    申请号：US10823147

    申请日：2004-04-13

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: B65G035/00

    CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  B65G15/32 ,  B65G17/40 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/25

    Abstract: Conveyors, chutes, skids, guides, and ways for the transporting of material are formed of a conductive loaded resin-based material such that fragments of these structures can be detected by a metal detector. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders.

    Abstract translation: 用于输送材料的输送机，滑槽，滑道，导轨和方法由导电负载的树脂基材料形成，使得可以通过金属检测器检测这些结构的碎片。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20和0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。

    Low cost key actuators and other switching device actuators manufactured from conductive loaded resin-based materials
    9.
    发明申请
    Low cost key actuators and other switching device actuators manufactured from conductive loaded resin-based materials 有权
    由导电负载的树脂基材料制造的低成本钥匙致动器和其他开关装置致动器

    公开(公告)号：US20040206615A1

    公开(公告)日：2004-10-21

    申请号：US10811082

    申请日：2004-03-26

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: H01H001/02

    CPC classification number: H01H13/702 ,  H01H13/785 ,  H01H19/58 ,  H01H23/12 ,  H01H2011/0081 ,  H01H2201/032 ,  H01H2203/0085 ,  H01H2203/01 ,  H01H2209/078 ,  H01H2215/006 ,  H01H2215/008 ,  H01H2221/01 ,  H01H2221/012 ,  H01H2221/018 ,  H01H2239/006 ,  Y10T428/249958 ,  Y10T428/31681

    Abstract: Key actuators and other switching devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

    Abstract translation: 主要致动器和其他开关装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀的等，或由金属如不锈钢，镍，铜，银，也可以是金属镀，或者 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

    Low cost adjustable RF resonator devices manufactured from conductive loaded resin-based materials
    10.
    发明申请
    Low cost adjustable RF resonator devices manufactured from conductive loaded resin-based materials 有权
    由导电负载的树脂基材料制造的低成本可调RF谐振器装置

    公开(公告)号：US20040196198A1

    公开(公告)日：2004-10-07

    申请号：US10827061

    申请日：2004-04-19

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: H01Q009/00

    CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q7/00 ,  H01Q11/08 ,  H03B5/18 ,  H03H5/12 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

    Abstract: Inductor-capacitor (LC) RF resonator circuits are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based inductor-capacitor (LC) RF resonator circuits can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the inductor-capacitor (LC) RF resonator circuits can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

    Abstract translation: 电感电容器（LC）RF谐振器电路由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀的等，或由金属如不锈钢，镍，铜，银，也可以是金属镀，或者 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。 导电负载的树脂基电感器 - 电容器（LC）RF谐振器电路可以使用诸如注射成型压缩成型或挤出的方法形成。 用于形成电感器 - 电容器（LC）RF谐振器电路的导电负载树脂基材料也可以是可以容易地切割成所需形状的薄柔性机织织物的形式。

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