公开(公告)号：US20230238411A1

公开(公告)日：2023-07-27

申请号：US17749077

申请日：2022-05-19

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： CHIEN-CHEN LEE ,  LI-CHUN HUNG ,  YA-HAN CHANG

IPC: H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L24/32

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip, a ring-shaped supporting layer, and a light-permeable sheet. The sensor chip is disposed on and electrically coupled to the substrate. The ring-shaped supporting layer is disposed on the sensor chip and surrounds a sensing region of the sensor chip. The light-permeable sheet has a ring-shaped notch recessed in a peripheral edge of an inner surface of the light-permeable sheet, and a depth of the ring-shaped notch with respect to the inner surface is at least 10 tim. The light-permeable sheet is disposed on the ring-shaped supporting layer through the ring-shaped notch, and the inner surface is not in contact with the ring-shaped supporting layer, so that the inner surface of the light-permeable sheet, an inner side of the ring-shaped supporting layer, and the top surface of the sensor chip jointly define an enclosed space.

公开(公告)号：US20230073527A1

公开(公告)日：2023-03-09

申请号：US17564142

申请日：2021-12-28

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： CHIEN-YUAN WANG ,  CHIEN-CHEN LEE

IPC: H01L27/146

Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a sensor chip, and a cover. The sensor chip is disposed on and electrically coupled to the substrate. The cover is disposed on the substrate along an assembling direction, so that the sensor chip is arranged in a space surroundingly defined by the cover. The cover includes a light-permeable sheet, a light-shielding film, and an opaque frame. The light-shielding film is ring-shaped and is disposed on an inner surface of the light-permeable sheet, so as to divide the inner surface into a light-permeable region arranged inside of the light-shielding film and a formation region arranged outside of the light-shielding film The opaque frame is gaplessly formed on the formation region and is disposed on the substrate, and the opaque frame does not cover the light-shielding film.

公开(公告)号：US20210057470A1

公开(公告)日：2021-02-25

申请号：US16803430

申请日：2020-02-27

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： LI-CHUN HUNG ,  CHIEN-CHEN LEE ,  JUI-HUNG HSU ,  SHENG YANG ,  JO-WEI YANG

IPC: H01L27/146 ,  H01L23/31

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light permeable layer arranged above the sensor chip, and a glue layer formed on the substrate. The light permeable layer includes a top surface, a bottom surface, and a plurality of lateral surfaces. The top surface has a plurality of edges respectively connected to the lateral surfaces covered by the glue layer. The glue layer includes a top curved surface having a top edge connected to the edges, and defines a plurality of tangent planes respectively passing through the edges and being tangent to the top curved surface. Between any one of the lateral surfaces and the adjacent one of the tangent planes, there exists an angle ranging from 38 to 53 degrees. And a difference between any two of the angles is equal to or less than 8 degrees.

公开(公告)号：US10825851B2

公开(公告)日：2020-11-03

申请号：US16390280

申请日：2019-04-22

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Sheng Yang ,  Li-Chun Hung ,  Hsiu-Wen Tu ,  Jo-Wei Yang ,  Chien-Chen Lee ,  Jian-Ru Chen

IPC: H01L23/498 ,  H01L27/146 ,  H01L23/00 ,  H01L23/31 ,  H01L23/04

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically connecting the substrate and the sensor chip, a glass cover disposed on the sensor chip, and an adhesive layer connecting the glass cover to the substrate. The substrate is made of a material having a coefficient of thermal expansion (CTE) that is less than 10 ppm/° C. The glass cover includes a board body and an annular supporting body connected to the board body. The annular supporting body of the glass cover is fixed onto the substrate through the adhesive layer, so that the glass cover and the substrate jointly surround an enclosed accommodating space. The sensor chip and the metal wires are arranged in the accommodating space, and the sensing region of the sensor chip faces the light-permeable portion of the board body.

公开(公告)号：US20200273766A1

公开(公告)日：2020-08-27

申请号：US16454143

申请日：2019-06-27

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： LI-CHUN HUNG ,  CHIEN-CHEN LEE ,  HSIU-WEN TU

IPC: H01L23/31 ,  H01L31/0203 ,  H01L31/02

Abstract: A chip-scale sensor package structure includes a sensor chip, a ring-shaped support disposed on a top surface of the sensor chip, a light permeable member disposed on the ring-shaped support, a package body, and a redistribution layer (RDL). The package body surrounds outer lateral sides of the sensor chip, the ring-shaped support and the light permeable member. A bottom surface of the sensor chip and a surface of the light permeable member are exposed from the package body. The RDL is directly formed on the bottom surface of the sensor chip and a bottom side of the package body. The RDL includes a plurality of external contacts arranged on a bottom surface thereof and electrically coupled to the sensor chip. A portion of the external contacts are arranged outside of a projection region defined by orthogonally projecting the sensor chip onto the bottom surface of the RDL.

公开(公告)号：US10600830B2

公开(公告)日：2020-03-24

申请号：US15819741

申请日：2017-11-21

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Jian-Ru Chen ,  Jo-Wei Yang ,  Li-Chun Hung ,  Hsiu-Wen Tu ,  Chung-Hsien Hsin

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/31

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically connected to the substrate and the sensor chip, a transparent layer facing the sensor chip, a support disposed on the substrate, and a packaging compound disposed on the substrate and covering side edges of the support and the transparent layer. A part of each wire is embedded in the support. A height from the upper surface of the substrate to the top of the support is larger than a height from the upper surface of the substrate to the top of any of the wires. The bottom surface of the transparent layer has a central region facing the sensor chip and a ring-shaped supporting region surrounded by the central region. The support is arranged outside the sensor chip and abuts against the supporting region.

公开(公告)号：US10411055B2

公开(公告)日：2019-09-10

申请号：US15907360

申请日：2018-02-28

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chun-Hua Chuang ,  Wen-Chung Huang ,  Chung-Hsien Hsin ,  Chen-Pin Peng ,  Li-Chun Hung

IPC: H01L27/146 ,  H01L23/053 ,  H01L23/10 ,  H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

Abstract: A sensor package structure includes a substrate, a sensor chip, a plurality of wires, a supporting frame, a transparent cover, and a molding compound. The substrate includes a chip bonding region and a plurality of first pads outside the chip bonding region. The sensor chip is disposed on the chip bonding region, and includes a sensing region and a plurality of second pads. Each wire has two opposite ends respectively connected to one of the first pads and one of the second pads. The supporting frame is arranged above the substrate and/or the sensor chip and includes a positioning portion. The transparent cover is fixed in position above the sensor chip by the positioning portion so as to maintain a vertical distance there-between. The molding compound fills the space in-between the substrate and the supporting frame and covers a part of an upper surface of the supporting frame.

公开(公告)号：US20190057992A1

公开(公告)日：2019-02-21

申请号：US15819741

申请日：2017-11-21

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： JIAN-RU CHEN ,  JO-WEI YANG ,  LI-CHUN HUNG ,  HSIU-WEN TU ,  CHUNG-HSIEN HSIN

IPC: H01L27/146 ,  H01L23/00

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically connected to the substrate and the sensor chip, a transparent layer facing the sensor chip, a support disposed on the substrate, and a packaging compound disposed on the substrate and covering side edges of the support and the transparent layer. A part of each wire is embedded in the support. A height from the upper surface of the substrate to the top of the support is larger than a height from the upper surface of the substrate to the top of any of the wires. The bottom surface of the transparent layer has a central region facing the sensor chip and a ring-shaped supporting region surrounded by the central region. The support is arranged outside the sensor chip and abuts against the supporting region.

公开(公告)号：US20190057952A1

公开(公告)日：2019-02-21

申请号：US15911574

申请日：2018-03-05

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Jian-Ru Chen ,  Jo-Wei Yang ,  Li-Chun Hung ,  Hsiu-Wen Tu

IPC: H01L23/00 ,  B81B7/02 ,  B81B7/00 ,  B81C3/00 ,  H01L27/146 ,  H04N5/225

CPC classification number: H01L24/85 ,  B81B7/0009 ,  B81B7/0032 ,  B81B7/02 ,  B81C3/001 ,  H01L24/17 ,  H01L24/24 ,  H01L24/30 ,  H01L24/46 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2224/16225 ,  H01L2224/32147 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H04N5/2253 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A stack type sensor package structure includes a substrate, a semiconductor chip disposed on the substrate, a frame disposed on the substrate and aside the semiconductor chip, a sensor chip disposed on the frame, a plurality of wires electrically connecting the sensor chip and the substrate, a transparent layer being of its position corresponding to the sensor chip, a support maintaining the relative position between the sensor chip and the transparent layer, and a package compound disposed on the substrate and partially covering the frame, the support, and the transparent layer. Thus, through disposing a frame within the stack type sensor package structure, the structural strength of the overall sensor package structure is reinforced, and the stability of the wiring of the sensor chip is effectively increased.

公开(公告)号：US20180012920A1

公开(公告)日：2018-01-11

申请号：US15641401

申请日：2017-07-05

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： HSIU-WEN TU ,  CHUNG-HSIEN HSIN ,  JIAN-RU CHEN

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2224/48091 ,  H01L2924/16235 ,  H01L2924/00014

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, several metal wires electrically connected to the substrate and the sensor chip, a translucent layer corresponding in position to the sensor chip, a combining layer firmly fixing the translucent layer to the sensor chip, and a packaging compound. A top surface of the sensor chip has a sensing region and a spacing region around the sensing region. The sensor chip includes several connecting pads arranged on the top surface between at least part of the edges thereof and the spacing region. The translucent layer has a fixing region arranged outside a portion thereof adhered to the combining layer. The packaging compound covers the fixing region and the external sides of the sensor chip, the combining layer, and the translucent layer. Each metal wire is embedded in the combining layer and the packaging compound.