-
1.发明申请Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same 有权具有减少热膨胀的无卤素电路化基板，其制造方法，利用其的多层基板结构以及利用其的信息处理系统公开(公告)号：US20090175000A1
公开(公告)日：2009-07-09
申请号：US12380618
申请日：2009-03-02
Applicant: Robert M. Japp , Voya R. Markovich , Kostas I. Papthomas
Inventor： Robert M. Japp , Voya R. Markovich , Kostas I. Papthomas
CPC classification number: H05K3/4688 , H01L23/145 , H01L23/3733 , H01L23/49833 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/3011 , H05K1/0366 , H05K1/0373 , H05K3/4652 , H05K3/4655 , H05K2201/0209 , H05K2201/0278 , H05K2201/09309 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , H01L2224/0401
Abstract: A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein. A method of making such a substrate is also provided, as is a multilayered assembly including one or more such circuitized substrates, possibly in combination with other substrates. An information handling system designed for having one or more such circuitized substrates is also provided.
Abstract translation: 一种电路化基板，包括复合层，该复合层包括由不含卤素的树脂和分散在其中的纤维构成的第一介电子层和不含纤维的第二电介质子层，并且还包括无卤素树脂和无机颗粒。 还提供了制造这种基板的方法，以及包括一个或多个这样的电路化基板的多层组件，可能与其它基板组合。 还提供了设计用于具有一个或多个这样的电路化基板的信息处理系统。
-
2.发明授权Method of making halogen-free circuitized substrate with reduced thermal expansion 有权制造具有降低的热膨胀的无卤电路基板的方法公开(公告)号：US08499440B2
公开(公告)日：2013-08-06
申请号：US12380618
申请日：2009-03-02
Applicant: Robert M. Japp , Voya R. Markovich , Kostas I. Papthomas
Inventor： Robert M. Japp , Voya R. Markovich , Kostas I. Papthomas
CPC classification number: H05K3/4688 , H01L23/145 , H01L23/3733 , H01L23/49833 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/3011 , H05K1/0366 , H05K1/0373 , H05K3/4652 , H05K3/4655 , H05K2201/0209 , H05K2201/0278 , H05K2201/09309 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , H01L2224/0401
Abstract: A method of making a circuitized substrate including a composite layer having a first dielectric sub-layer including a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein.
Abstract translation: 一种制造电路化基板的方法，该基板包括具有包含无卤素树脂的第一介电子层和分散在其中的纤维的复合层和不含纤维的第二电介质子层，并且还包括无卤素树脂和无机颗粒。
-
3.发明授权Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same 失效具有减少热膨胀的无卤素电路化基板，其制造方法，利用其的多层基板结构以及利用其的信息处理系统公开(公告)号：US07687722B2
公开(公告)日：2010-03-30
申请号：US11541776
申请日：2006-10-03
Applicant: Robert M. Japp , Voya R. Markovich , Kostas I. Papthomas
Inventor： Robert M. Japp , Voya R. Markovich , Kostas I. Papthomas
IPC: H05K1/03
CPC classification number: H05K3/4688 , H01L23/145 , H01L23/3733 , H01L23/49833 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/3011 , H05K1/0366 , H05K1/0373 , H05K3/4652 , H05K3/4655 , H05K2201/0209 , H05K2201/0278 , H05K2201/09309 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , H01L2224/0401
Abstract: A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein. A method of making such a substrate is also provided, as is a multilayered assembly including one or more such circuitized substrates, possibly in combination with other substrates. An information handling system designed for having one or more such circuitized substrates is also provided.
Abstract translation: 一种电路化基板，包括复合层，该复合层包括由不含卤素的树脂和分散在其中的纤维构成的第一介电子层和不含纤维的第二电介质子层，并且还包括无卤素树脂和无机颗粒。 还提供了制造这种基板的方法，以及包括一个或多个这样的电路化基板的多层组件，可能与其它基板组合。 还提供了设计用于具有一个或多个这样的电路化基板的信息处理系统。
-
4.发明申请Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing 失效具有减少的热膨胀的无卤素电路基板，制造方法，利用其的多层基板结构以及利用其的信息处理系统公开(公告)号：US20080078570A1
公开(公告)日：2008-04-03
申请号：US11541776
申请日：2006-10-03
Applicant: Robert M. Japp , Voya R. Markovich , Kostas I. Papthomas
Inventor： Robert M. Japp , Voya R. Markovich , Kostas I. Papthomas
CPC classification number: H05K3/4688 , H01L23/145 , H01L23/3733 , H01L23/49833 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/3011 , H05K1/0366 , H05K1/0373 , H05K3/4652 , H05K3/4655 , H05K2201/0209 , H05K2201/0278 , H05K2201/09309 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , H01L2224/0401
Abstract: A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein. A method of making such a substrate is also provided, as is a multilayered assembly including one or more such circuitized substrates, possibly in combination with other substrates. An information handling system designed for having one or more such circuitized substrates is also provided.
Abstract translation: 一种电路化基板，包括复合层，该复合层包括由不含卤素的树脂和分散在其中的纤维构成的第一介电子层和不含纤维的第二电介质子层，并且还包括无卤素树脂和无机颗粒。 还提供了制造这种基板的方法，以及包括一个或多个这样的电路化基板的多层组件，可能与其它基板组合。 还提供了设计用于具有一个或多个这样的电路化基板的信息处理系统。
-
-
-
Search Results
4
records
(took 0.027 seconds)
