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1.发明申请PROBE HEAD FOR A MICROELECTRONIC CONTACTOR ASSEMBLY, AND METHODS OF MAKING SAME 有权用于微电子接触器组件的探头及其制造方法公开(公告)号：US20100237888A1
公开(公告)日：2010-09-23
申请号：US12709285
申请日：2010-02-19
Applicant: Yohannes Desta , Lakshmikanth Namburi , Matthew Losey
Inventor： Yohannes Desta , Lakshmikanth Namburi , Matthew Losey
IPC: G01R31/02
CPC classification number: G01R1/07378
Abstract: Microelectronic contactors on a probe contactor substrate, or adhesive elements on a probe contactor or space transformer substrate, are protected by a sacrificial material as 1) the microelectronic contactors or adhesive elements are planarized, or 2) a surface of the substrate on which the microelectronic contactors or adhesive elements are formed is planarized. The adhesive elements are used to bond the probe contactor substrate to the space transformer substrate.
Abstract translation: 探针接触器基板上的微电子接触器或探针接触器或空间变压器基板上的粘合元件由牺牲材料保护，如：1）微电子接触器或粘合元件被平坦化，或2）基板的表面，微电子 形成接触器或粘合剂元件。 粘合元件用于将探针接触器基板粘合到空间变换器基板。
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公开(公告)号：US20090021277A1
公开(公告)日：2009-01-22
申请号：US11778207
申请日：2007-07-16
Applicant: Lakshmikanth Namburi , Raffi Garabedian
Inventor： Lakshmikanth Namburi , Raffi Garabedian
CPC classification number: G01R3/00 , G01R1/06727 , G01R1/07342 , Y10T29/49144 , Y10T29/49149 , Y10T29/49179 , Y10T29/49728 , Y10T29/4973 , Y10T29/49732 , Y10T29/53178 , Y10T29/53274
Abstract: A novel device and method for repairing MEMS systems, including probe cards for use in semiconductor testing is disclosed. In one embodiment, a probe card for use with a diagnostic computer for testing semiconductor wafers comprises a substrate, a plurality of operational probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer and a plurality of replacement probes connected to the substrate, wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. Also disclosed is a novel probe card that can be repaired. Specifically, a probe card for use with a diagnostic computer for testing semiconductor wafers, the probe card comprises a substrate and a plurality operational of probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer, and wherein the plurality of operational probes include a sacrificial material that is activated by applying a voltage.A method for removing a damaged probe from a probe card is also disclosed. The method removes a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and the plurality of operational probes comprises a sacrificial material that is activated by applying a voltage. The method comprises identifying the damaged probe, applying the voltage to the damaged probe, exposing the damaged probe to an etching solution and removing the damaged probe from the probe card.A second method for repairing a damaged probe from a probe card is also disclosed. The method repairs a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and a plurality of replacement probes connected to the substrate and wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. The method comprising the steps of identifying the damaged probe, removing the damaged probe from the probe card, separating one of the plurality of replacement probes from the substrate, and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed. Several refinements to these devices and methods are disclosed.
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公开(公告)号：US20140070828A1
公开(公告)日：2014-03-13
申请号：US13609154
申请日：2012-09-10
Applicant: John W. Andberg , Ira H. Leventhal , Matthew W. Losey , Yohannes Desta , Lakshmikanth Namburi , Vincent E. Lopopolo , Sanjeev Grover , Erik Volkerink
Inventor： John W. Andberg , Ira H. Leventhal , Matthew W. Losey , Yohannes Desta , Lakshmikanth Namburi , Vincent E. Lopopolo , Sanjeev Grover , Erik Volkerink
CPC classification number: G01R1/073 , G01R1/0408 , G01R31/2891 , G01R31/2893 , G01R35/005
Abstract: Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel “split-cartridge” design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A “probe-card stops” design may be used within the cartridge to simplify the overall cartridge design and operation.
Abstract translation: 本文公开了一种成本有效，高效，大规模并行的多晶圆测试电池。 此外，该测试单元可用于单触地板和多触地应用。 本发明使用新颖的“分离式墨盒”设计，结合将晶片与探针卡组件分离时对准的方法，以创建成本有效的，高效的多晶圆测试单元。 可以在墨盒内使用“探针卡停止”设计，以简化总体墨盒的设计和操作。
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公开(公告)号：US20100308854A1
公开(公告)日：2010-12-09
申请号：US12754452
申请日：2010-04-05
Applicant: Raffi Garabedian , Salleh Ismail , Lakshmikanth Namburi
Inventor： Raffi Garabedian , Salleh Ismail , Lakshmikanth Namburi
CPC classification number: G01R3/00 , G01R1/07378 , Y10T29/49147
Abstract: The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.
Abstract translation: 本发明涉及一种探针头，其具有探针接触器基底，该探针接触器基底具有穿过该探针接触器基底的至少一个狭缝，至少一个探针接触器，其适用于测试被测器件，探针接触器与顶部 并且电连接到也设置在探针接触器基板顶部的端子，以及空间变压器，其具有耦合到空间变压器的顶侧的至少一个接合焊盘，以及电连接所述探针接触器基板 接合焊盘通过探头接触器基板中的插槽连接到端子。
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5.发明授权Probe head for a microelectronic contactor assembly, the probe head having SMT electronic components thereon 有权用于微电子接触器组件的探针头，探针头上具有SMT电子部件公开(公告)号：US08232818B2
公开(公告)日：2012-07-31
申请号：US12709297
申请日：2010-02-19
Applicant: Yohannes Desta , Lakshmikanth Namburi , Matthew Losey
Inventor： Yohannes Desta , Lakshmikanth Namburi , Matthew Losey
IPC: G01R31/00
CPC classification number: G01R1/07378
Abstract: A probe head for a microelectronic contactor assembly includes a space transformer substrate and a probe contactor substrate. Surface mount technology (SMT) electronic components are positioned close to conductive elements on the probe contactor substrate by placing the SMT electronic components in cavities in the probe contactor substrate, which cavities may be through-hole or non-through-hole cavities. In some cases, the SMT electronic components may be placed on pedestal substrates. SMT electronic components may also be positioned between the probe contactor and space transformer substrates.
Abstract translation: 用于微电子接触器组件的探头包括空间变压器基板和探针接触器基板。 表面贴装技术（SMT）电子部件通过将SMT电子部件放置在探针接触器基板中的空腔中而定位成靠近探针接触器基板上的导电元件，这些空腔可以是通孔或非通孔腔。 在某些情况下，SMT电子部件可以放置在基座基板上。 SMT电子部件也可以位于探针接触器和空间变压器基板之间。
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Patent Agency Ranking
公开(公告)号：US07692436B2
公开(公告)日：2010-04-06
申请号：US12077627
申请日：2008-03-20
Applicant: Raffi Garabedian , Salleh Ismail , Lakshmikanth Namburi
Inventor： Raffi Garabedian , Salleh Ismail , Lakshmikanth Namburi
IPC: G01R31/02
CPC classification number: G01R3/00 , G01R1/07378 , Y10T29/49147
Abstract: The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.
Abstract translation: 本发明涉及一种探针头，其具有探针接触器基底，该探针接触器基底具有穿过该探针接触器基底的至少一个狭缝，至少一个探针接触器，其适用于测试被测器件，探针接触器与顶部 并且电连接到也设置在探针接触器基板顶部的端子，以及空间变压器，其具有耦合到空间变压器的顶侧的至少一个接合焊盘，以及电连接所述探针接触器基板 接合焊盘通过探头接触器基板中的插槽连接到端子。
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公开(公告)号：US09335347B2
公开(公告)日：2016-05-10
申请号：US13609154
申请日：2012-09-10
Applicant: John W. Andberg , Ira H. Leventhal , Matthew W. Losey , Yohannes Desta , Lakshmikanth Namburi , Vincent E. Lopopolo , Sanjeev Grover , Erik Volkerink
Inventor： John W. Andberg , Ira H. Leventhal , Matthew W. Losey , Yohannes Desta , Lakshmikanth Namburi , Vincent E. Lopopolo , Sanjeev Grover , Erik Volkerink
CPC classification number: G01R1/073 , G01R1/0408 , G01R31/2891 , G01R31/2893 , G01R35/005
Abstract: Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel “split-cartridge” design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A “probe-card stops” design may be used within the cartridge to simplify the overall cartridge design and operation.
Abstract translation: 本文公开了一种成本有效，高效，大规模并行的多晶圆测试电池。 此外，该测试单元可用于单触地板和多触地应用。 本发明使用新颖的“分离式墨盒”设计，结合将晶片与探针卡组件分离时对准的方法，以创建成本有效的，高效的多晶圆测试单元。 可以在墨盒内使用“探针卡停止”设计，以简化总体墨盒的设计和操作。
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8.发明授权Microelectronic contactor assembly, structures thereof, and methods of constructing same 有权微电子接触器组件，其结构及其构造方法公开(公告)号：US08305101B2
公开(公告)日：2012-11-06
申请号：US12709268
申请日：2010-02-19
Applicant: Yohannes Desta , Chang Huang , Lakshmikanth Namburi , Matthew Losey
Inventor： Yohannes Desta , Chang Huang , Lakshmikanth Namburi , Matthew Losey
CPC classification number: G01R1/07378
Abstract: A plurality of inserts are anchored in holes or recesses in a probe head. Shafts are coupled to the inserts, and adjustable multi-part fasteners are attached to the shafts and to a stiffener. The multi-part fasteners are operated to move the shafts and couple the probe head, the stiffener, and other components of a microelectronic contactor assembly. In some embodiments, the inserts may be anchored in the probe head using an adhesive. In some embodiments, the probe head may comprise more than one major substrate, and the inserts may be anchored in either of the substrates.
Abstract translation: 多个插入件锚固在探针头中的孔或凹槽中。 轴联接到插入件，并且可调节的多部件紧固件附接到轴和加强件。 操作多部件紧固件以移动轴并耦合探针头，加强件和微电子接触器组件的其它部件。 在一些实施例中，插入件可以使用粘合剂锚定在探头中。 在一些实施例中，探针头可以包括多于一个主要基底，并且插入物可以锚固在任一基底中。
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9.发明授权Probe head for a microelectronic contactor assembly, and methods of making same 有权微电子接触器组件的探针头及其制造方法公开(公告)号：US08901950B2
公开(公告)日：2014-12-02
申请号：US12709285
申请日：2010-02-19
Applicant: Yohannes Desta , Lakshmikanth Namburi , Matthew Losey
Inventor： Yohannes Desta , Lakshmikanth Namburi , Matthew Losey
CPC classification number: G01R1/07378
Abstract: Microelectronic contactors on a probe contactor substrate, or adhesive elements on a probe contactor or space transformer substrate, are protected by a sacrificial material as 1) the microelectronic contactors or adhesive elements are planarized, or 2) a surface of the substrate on which the microelectronic contactors or adhesive elements are formed is planarized. The adhesive elements are used to bond the probe contactor substrate to the space transformer substrate.
Abstract translation: 探针接触器基板上的微电子接触器或探针接触器或空间变压器基板上的粘合元件由牺牲材料保护，如：1）微电子接触器或粘合元件被平坦化，或2）基板的表面，微电子 形成接触器或粘合剂元件。 粘合元件用于将探针接触器基板粘合到空间变换器基板。
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10.发明申请PROBE HEAD FOR A MICROELECTRONIC CONTACTOR ASSEMBLY, THE PROBE HEAD HAVING SMT ELECTRONIC COMPONENTS THEREON 有权用于微电子接触器组件的探头，具有SMT电子部件的探头公开(公告)号：US20100237889A1
公开(公告)日：2010-09-23
申请号：US12709297
申请日：2010-02-19
Applicant: Yohannes Desta , Lakshmikanth Namburi , Matthew Losey
Inventor： Yohannes Desta , Lakshmikanth Namburi , Matthew Losey
IPC: G01R31/02
CPC classification number: G01R1/07378
Abstract: A probe head for a microelectronic contactor assembly includes a space transformer substrate and a probe contactor substrate. Surface mount technology (SMT) electronic components are positioned close to conductive elements on the probe contactor substrate by placing the SMT electronic components in cavities in the probe contactor substrate, which cavities may be through-hole or non-through-hole cavities. In some cases, the SMT electronic components may be placed on pedestal substrates. SMT electronic components may also be positioned between the probe contactor and space transformer substrates.
Abstract translation: 用于微电子接触器组件的探头包括空间变压器基板和探针接触器基板。 表面贴装技术（SMT）电子部件通过将SMT电子部件放置在探针接触器基板中的空腔中而定位成靠近探针接触器基板上的导电元件，这些空腔可以是通孔或非通孔腔。 在某些情况下，SMT电子部件可以放置在基座基板上。 SMT电子部件也可以位于探针接触器和空间变压器基板之间。
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