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1.发明申请公开(公告)号：US20130236995A1
公开(公告)日：2013-09-12
申请号：US13450097
申请日：2012-04-18
Applicant: Daniel Sekowski , Frederick Lloyd Carpenter , Mark Anthony Hand , Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dicker , Christian Miesner , Lothar Schopmann , Herfried Zimmer
Inventor： Daniel Sekowski , Frederick Lloyd Carpenter , Mark Anthony Hand , Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dicker , Christian Miesner , Lothar Schopmann , Herfried Zimmer
IPC: H01L33/52
CPC classification number: H01L33/52 , H01L2924/0002 , H05K1/0256 , H05K3/0061 , H05K3/284 , H05K2201/0715 , H05K2201/10106 , H05K2201/10287 , H05K2201/2018 , H05K2203/1316 , Y10T29/49172 , H01L2924/00
Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.
Abstract translation: 在包括支撑半导体部件的电路板和用于向半导体部件供电的迹线或导体的电子设备中，以及将导体连接到电源电缆的连接装置，电路板被电绝缘封装 层，模制框架部分安装在电路板上以覆盖连接装置，模制框架部分具有在一端延伸到封装层中的周边边缘结构，而另一端在封装层上方突出，以便 以产生内部空间，当封装层至少部分地固化时，内部空间填充有另外的封装化合物，以在固化之后在导线或电缆和导体连接区域上形成相对较厚的保护层。
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2.发明授权Electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board 有权电子设备在模制框架的内部和外部具有覆盖电路板上的连接装置的封装层公开(公告)号：US08184440B2
公开(公告)日：2012-05-22
申请号：US12434313
申请日：2009-05-01
Applicant: Daniel Sekowski , Frederick Lloyd Carpenter , Mark Anthony Hand , Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Lothar Schopmann , Herfried Zimmer
Inventor： Daniel Sekowski , Frederick Lloyd Carpenter , Mark Anthony Hand , Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Lothar Schopmann , Herfried Zimmer
IPC: H05K7/20
CPC classification number: H01L33/52 , H01L2924/0002 , H05K1/0256 , H05K3/0061 , H05K3/284 , H05K2201/0715 , H05K2201/10106 , H05K2201/10287 , H05K2201/2018 , H05K2203/1316 , Y10T29/49172 , H01L2924/00
Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.
Abstract translation: 在包括支撑半导体部件的电路板和用于向半导体部件供电的迹线或导体的电子设备中，以及将导体连接到电源电缆的连接装置，电路板被电绝缘封装 层，模制框架部分安装在电路板上以覆盖连接装置，模制框架部分具有在一端延伸到封装层中的周边边缘结构，而另一端在封装层上方突出，以便 以产生内部空间，当封装层至少部分地固化时，内部空间填充有另外的封装化合物，以在固化之后在导线或电缆和导体连接区域上形成相对较厚的保护层。
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公开(公告)号：US08348460B2
公开(公告)日：2013-01-08
申请号：US12434282
申请日：2009-05-01
Applicant: Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Lothar Schopmann , Herfried Zimmer , Daniel Sekowski , Mark Anthony Hand
Inventor： Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Lothar Schopmann , Herfried Zimmer , Daniel Sekowski , Mark Anthony Hand
IPC: F21S4/00
CPC classification number: F21V31/04 , F21S4/20 , F21V15/013 , F21V29/75 , F21V29/763 , F21W2111/02 , F21W2131/103 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10
Abstract: In a lighting apparatus, comprising a heatsink having at one side thereof a recess with at least one groove extending over the length of the heatsink, a plurality of lighting units are arranged in the groove or grooves oriented toward the opening of the recess for the emission of light therefrom and the frame is provided at the side opposite the opening with heatsink ribs, the lighting units in the groove or grooves being encapsulated by an encapsulating material added into the groove or grooves and being cured therein so as to be in direct contact with the groove walls and enclosing the lighting units at least up to the light emitting lenses thereof.
Abstract translation: 在一种照明装置中，包括散热器，该散热器的一侧具有至少一个在散热器的长度上延伸的凹槽的凹部，多个照明单元布置在朝向凹部的开口定向的凹槽中，用于发射 并且框架设置在具有散热肋的开口相对的一侧，凹槽或凹槽中的照明单元被添加到凹槽中的封装材料封装并在其中固化，以便直接与 凹槽壁并且包围照明单元至少直至其发光透镜。
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Patent Agency Ranking
公开(公告)号：US08093609B2
公开(公告)日：2012-01-10
申请号：US12434242
申请日：2009-05-01
Applicant: Mark Anthony Hand , Daniel Sekowski , Frederick Lloyd Carpenter , Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Peter Schöpper , Lothar Schopmann , Herfried Zimmer
Inventor： Mark Anthony Hand , Daniel Sekowski , Frederick Lloyd Carpenter , Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Peter Schöpper , Lothar Schopmann , Herfried Zimmer
IPC: H01L33/00
CPC classification number: H05K3/284 , F21K9/00 , H05K1/0256 , H05K3/301 , H05K3/3421 , H05K2201/012 , H05K2201/10977 , H05K2201/2018
Abstract: In a light emitting diode arrangement for lighting purposes, comprising a circuit board with at least one light generating semiconductor element disposed on the circuit board and conductors extending on the circuit board to the semiconductor element and being electrically connected to terminals of the semiconductor element, a light transmissive element is disposed on the circuit board and covers the semiconductor element and a flame resistant cover element is disposed below the light transmissive element and on top of the terminals to cover the terminals to provide for electrical and flame insulation thereof.
Abstract translation: 在用于照明目的的发光二极管装置中，包括具有设置在电路板上的至少一个光产生半导体元件的电路板和在电路板上延伸到半导体元件并与半导体元件的端子电连接的导体， 透光元件设置在电路板上并覆盖半导体元件，并且阻燃覆盖元件设置在透光元件下方并且在端子的顶部上以覆盖端子以提供其电气和火焰绝缘。
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公开(公告)号：US20100277921A1
公开(公告)日：2010-11-04
申请号：US12434313
申请日：2009-05-01
Applicant: Daniel Sekowski , Frederick Lloyd Carpenter , Mark Anthony Hand , Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Lothar Schopmann , Herfried Zimmer
Inventor： Daniel Sekowski , Frederick Lloyd Carpenter , Mark Anthony Hand , Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Lothar Schopmann , Herfried Zimmer
CPC classification number: H01L33/52 , H01L2924/0002 , H05K1/0256 , H05K3/0061 , H05K3/284 , H05K2201/0715 , H05K2201/10106 , H05K2201/10287 , H05K2201/2018 , H05K2203/1316 , Y10T29/49172 , H01L2924/00
Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.
Abstract translation: 在包括支撑半导体部件的电路板和用于向半导体部件供电的迹线或导体的电子设备中，以及将导体连接到电源电缆的连接装置，电路板被电绝缘封装 层，模制框架部分安装在电路板上以覆盖连接装置，模制框架部分具有在一端延伸到封装层中的周边边缘结构，而另一端在封装层上方突出，以便 以产生内部空间，当封装层至少部分地固化时，内部空间填充有另外的封装化合物，以在固化之后在导线或电缆和导体连接区域上形成相对较厚的保护层。
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6.发明授权Method for making an electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board 有权一种制造电子设备的方法，所述电子设备在覆盖在电路板上的连接装置上的模制框架内和外部具有封装层公开(公告)号：US09105819B2
公开(公告)日：2015-08-11
申请号：US13450097
申请日：2012-04-18
Applicant: Daniel Sekowski , Frederick Lloyd Carpenter , Mark Anthony Hand , Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Lothar Schopmann , Herfried Zimmer
Inventor： Daniel Sekowski , Frederick Lloyd Carpenter , Mark Anthony Hand , Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Lothar Schopmann , Herfried Zimmer
CPC classification number: H01L33/52 , H01L2924/0002 , H05K1/0256 , H05K3/0061 , H05K3/284 , H05K2201/0715 , H05K2201/10106 , H05K2201/10287 , H05K2201/2018 , H05K2203/1316 , Y10T29/49172 , H01L2924/00
Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.
Abstract translation: 在包括支撑半导体部件的电路板和用于向半导体部件供电的迹线或导体的电子设备中，以及将导体连接到电源电缆的连接装置，电路板被电绝缘封装 层，模制框架部分安装在电路板上以覆盖连接装置，模制框架部分具有在一端延伸到封装层中的周边边缘结构，而另一端在封装层上方突出，以便 以产生内部空间，当封装层至少部分地固化时，内部空间填充有另外的封装化合物，以在固化之后在导线或电缆和导体连接区域上形成相对较厚的保护层。
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公开(公告)号：US20100277914A1
公开(公告)日：2010-11-04
申请号：US12434282
申请日：2009-05-01
Applicant: Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Lothar Schopmann , Herfried Zimmer , Daniel Sekowski , Mark Anthony Hand
Inventor： Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Lothar Schopmann , Herfried Zimmer , Daniel Sekowski , Mark Anthony Hand
CPC classification number: F21V31/04 , F21S4/20 , F21V15/013 , F21V29/75 , F21V29/763 , F21W2111/02 , F21W2131/103 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10
Abstract: In a lighting apparatus, comprising a heatsink having at one side thereof a recess with at least one groove extending over the length of the heatsink, a plurality of lighting units are arranged in the groove or grooves oriented toward the opening of the recess for the emission of light therefrom and the frame is provided at the side opposite the opening with heatsink ribs, the lighting units in the groove or grooves being encapsulated by an encapsulating material added into the groove or grooves and being cured therein so as to be in direct contact with the groove walls and enclosing the lighting units at least up to the light emitting lenses thereof.
Abstract translation: 在一种照明装置中，包括散热器，该散热器的一侧具有至少一个在散热器的长度上延伸的凹槽的凹部，多个照明单元布置在朝向凹部的开口定向的凹槽中，用于发射 并且框架设置在具有散热肋的开口相对的一侧，凹槽或凹槽中的照明单元被添加到凹槽中的封装材料封装并在其中固化，以便直接与 凹槽壁并且包围照明单元至少直至其发光透镜。
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公开(公告)号：US20100276711A1
公开(公告)日：2010-11-04
申请号：US12434242
申请日：2009-05-01
Applicant: Mark Anthony Hand , Daniel Sekowski , Frederick Lloyd Carpenter , Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Peter Schopper , Lothar Schopmann , Herfried Zimmer
Inventor： Mark Anthony Hand , Daniel Sekowski , Frederick Lloyd Carpenter , Bernhard Bachl , Bernd Bienek , Olaf Cladders , Henning Dieker , Christian Miesner , Peter Schopper , Lothar Schopmann , Herfried Zimmer
IPC: H01L33/00
CPC classification number: H05K3/284 , F21K9/00 , H05K1/0256 , H05K3/301 , H05K3/3421 , H05K2201/012 , H05K2201/10977 , H05K2201/2018
Abstract: In a light emitting diode arrangement for lighting purposes, comprising a circuit board with at least one light generating semiconductor element disposed on the circuit board and conductors extending on the circuit board to the semiconductor element and being electrically connected to terminals of the semiconductor element, a light transmissive element is disposed on the circuit board and covers the semiconductor element and a flame resistant cover element is disposed below the light transmissive element and on top of the terminals to cover the terminals to provide for electrical and flame insulation thereof.
Abstract translation: 在用于照明目的的发光二极管装置中，包括具有设置在电路板上的至少一个光产生半导体元件的电路板和在电路板上延伸到半导体元件并与半导体元件的端子电连接的导体， 透光元件设置在电路板上并覆盖半导体元件，并且阻燃覆盖元件设置在透光元件下方并且在端子的顶部上以覆盖端子以提供其电气和火焰绝缘。
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