ANALYSIS SYSTEM, AUXILIARY ANALYSIS APPARATUS AND ANALYSIS METHOD

    公开(公告)号:US20230326730A1

    公开(公告)日:2023-10-12

    申请号:US17852321

    申请日:2022-06-28

    CPC classification number: H01J49/0031 G01N30/7206 G01N30/8651 G01N2030/025

    Abstract: An analysis system, an auxiliary analysis apparatus, and an analysis method are provided. The analysis method is used to perform a composition analysis operation on an analyte of a sample, and includes: a first heating step, a first mass spectrometry analysis step, a second heating step, a second mass spectrometry analysis step, and an analysis step. A heating device heats a non-analyzed area and a to-be-analyzed area of the sample in the first and the second heating step, respectively. In the first and the second mass spectrometry analysis step, gas generated after heating of the sample is guided into a gas chromatography-mass spectrometer, and two pieces of analysis data are correspondingly obtained. The analysis step is to compare the two pieces of analysis data and generate analysis result data. The analysis result data contains components of a composition that forms at least one portion of the analyte.

    SAMPLE ANALYZING METHOD AND SAMPLE PREPARING METHOD

    公开(公告)号:US20220334140A1

    公开(公告)日:2022-10-20

    申请号:US17388125

    申请日:2021-07-29

    Abstract: A sample analyzing method and a sample preparing method are provided. The sample analyzing method includes a sample preparing step, a placing step, and an analyzing step. The sample preparing step includes an obtaining step implemented by obtaining an identification information; and a marking and placing step implemented by placing a sample carrying component having a sample disposed thereon into a marking equipment, allowing the marking equipment to utilize the identification information to form an identification structure on the sample carrying component, and placing the sample carrying component into one of the accommodating slots according to the identification information. The placing step is implemented by taking out the sample carrying component from one of the accommodating slots and placing the sample carrying component into an electron microscope equipment. The analyzing step is implemented by utilizing the electron microscope equipment to photograph the sample to generate an analyzation image.

    CARRIER DEVICE AND CARRIER KIT
    3.
    发明申请

    公开(公告)号:US20220013325A1

    公开(公告)日:2022-01-13

    申请号:US17026317

    申请日:2020-09-21

    Inventor: HUNG-JEN CHEN

    Abstract: A carrier device and a carrier kit are provided. The carrier kit includes the carrier device and a specimen carrier. The carrier device carries the specimen carrier and is configured to be fixedly disposed on a specimen holder. The specimen carrier has two observation grooves and a containing channel that is formed therein, and the two observation grooves are configured to expose a part of the containing channel The carrier device has a containing groove that is recessed on a side of a main body and an observation port. When the specimen carrier is disposed in the containing groove, one of the observation grooves is exposed from the main body through the observation port. At least one limiting element is configured to limit a range of movement of the specimen carrier disposed in the containing groove relative to the main body.

    Soldering quality inspection method and soldering quality inspection apparatus

    公开(公告)号:US12260541B2

    公开(公告)日:2025-03-25

    申请号:US17853859

    申请日:2022-06-29

    Abstract: A soldering quality inspection method and a soldering quality inspection apparatus are provided. The soldering quality inspection method includes: acquiring an inspection image; calculating, by a processing device, a dyed area percentage of an area of a part of a soldering region in the inspection image that is dyed by a dye ink relative to an area of the soldering region, and determining whether the dyed area percentage is greater than a predetermined dyed percentage. When the dyed area percentage is determined to be equal to or less than the predetermined dyed percentage, a position under inspection is determined to be of good soldering quality, and a corresponding inspection result information is generated. When the dyed area percentage is determined to be greater than the predetermined dyed percentage, the position under inspection is determined to be of poor soldering quality, and the corresponding inspection result information is generated.

    Analysis system, auxiliary analysis apparatus and analysis method

    公开(公告)号:US12154775B2

    公开(公告)日:2024-11-26

    申请号:US17852321

    申请日:2022-06-28

    Abstract: An analysis system, an auxiliary analysis apparatus, and an analysis method are provided. The analysis method is used to perform a composition analysis operation on an analyte of a sample, and includes: a first heating step, a first mass spectrometry analysis step, a second heating step, a second mass spectrometry analysis step, and an analysis step. A heating device heats a non-analyzed area and a to-be-analyzed area of the sample in the first and the second heating step, respectively. In the first and the second mass spectrometry analysis step, gas generated after heating of the sample is guided into a gas chromatography-mass spectrometer, and two pieces of analysis data are correspondingly obtained. The analysis step is to compare the two pieces of analysis data and generate analysis result data. The analysis result data contains components of a composition that forms at least one portion of the analyte.

    Sample analyzing method and sample preparing method

    公开(公告)号:US11946945B2

    公开(公告)日:2024-04-02

    申请号:US17388125

    申请日:2021-07-29

    Abstract: A sample analyzing method and a sample preparing method are provided. The sample analyzing method includes a sample preparing step, a placing step, and an analyzing step. The sample preparing step includes an obtaining step implemented by obtaining an identification information; and a marking and placing step implemented by placing a sample carrying component having a sample disposed thereon into a marking equipment, allowing the marking equipment to utilize the identification information to form an identification structure on the sample carrying component, and placing the sample carrying component into one of the accommodating slots according to the identification information. The placing step is implemented by taking out the sample carrying component from one of the accommodating slots and placing the sample carrying component into an electron microscope equipment. The analyzing step is implemented by utilizing the electron microscope equipment to photograph the sample to generate an analyzation image.

    PHYSICAL ANALYSIS METHOD, SAMPLE FOR PHYSICAL ANALYSIS AND PREPARING METHOD THEREOF

    公开(公告)号:US20220223373A1

    公开(公告)日:2022-07-14

    申请号:US17560460

    申请日:2021-12-23

    Abstract: A physical analysis method, a sample for physical analysis and a preparing method thereof are provided. The preparing method of the sample for physical analysis includes: providing a sample to be inspected; and forming a contrast enhancement layer on a surface of the sample to be inspected. The contrast enhancement layer includes a plurality of first material layers and a plurality of second material layers stacked upon one another. The first material layer and the second material layer are made of different materials. Each one of the first and second material layers has a thickness that does not exceed 0.1 nm. In an image captured by an electron microscope, a difference between an average grayscale value of a surface layer image of the sample to be inspected and an average grayscale value of an image of the contrast enhancement layer is at least 50.

    Dimension calculation method for a semiconductor device
    9.
    发明授权
    Dimension calculation method for a semiconductor device 有权
    半导体器件的尺寸计算方法

    公开(公告)号:US09558565B2

    公开(公告)日:2017-01-31

    申请号:US14175278

    申请日:2014-02-07

    Inventor: Sajal Biring

    Abstract: An automatic calculation method for thickness calculation of a deposition layer in a Fin-type field-effect transistor (FinFET) is disclosed through mapping edge lines onto an Excel spreadsheet. The similar method is also applied to the thickness calculation of superlattice or multiple quantum well for a light emitting diode (LED). The edge lines are obtained and transformed from an electronic image taken by Transmission Electron Microscopy (TEM), Focus Ion Beam (FIB), Atomic Force Microscopy (AFM), or X-Ray Diffraction (XRD) of the device.

    Abstract translation: 通过将边缘线映射到Excel电子表格上,公开了Fin型场效应晶体管(FinFET)中的沉积层的厚度计算的自动计算方法。 类似的方法也适用于发光二极管(LED)的超晶格或多量子阱的厚度计算。 从透射电子显微镜(TEM),聚焦离子束(FIB),原子力显微镜(AFM)或X射线衍射(XRD)获得的电子图像获得边缘线并进行变换。

    Sample carrier device and method for operating the same

    公开(公告)号:US11291991B2

    公开(公告)日:2022-04-05

    申请号:US16576780

    申请日:2019-09-20

    Inventor: Hung-Jen Chen

    Abstract: A sample carrier device including a single substrate, a penetration structure and a fixing structure is provided. The penetration structure is formed on a side of the substrate. The penetration structure has a fluid passage. The fixing structure is formed on a side of the penetration structure. The sample carrier device is divided into an end portion, an observation portion and an operation portion. The user can separate the observation portion from the end portion by operating the operation portion. After the observation portion is separated from the end portion, the user can inject the sample into the fluid passage through a port of the fluid passage exposed to the observation portion. Once the sample is carried by the fluid passage of the observation portion, the user can seal the port of the fluid passage and place the observation portion in an electron microscope device.

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