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公开(公告)号：US20080074324A1
公开(公告)日：2008-03-27
申请号：US11533848
申请日：2006-09-21
Applicant: Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
Inventor： Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
IPC: H01Q1/38
CPC classification number: H01Q21/22 , H01Q21/0025
Abstract: A radiator includes a waveguide having an aperture and a patch antenna disposed in the aperture. In one embodiment, an antenna includes an array of waveguide antenna elements, each element having a cavity, and an array of patch antenna elements including an upper patch element and a lower patch element disposed in the cavity.
Abstract translation: 散热器包括具有开口的波导和布置在孔中的贴片天线。 在一个实施例中，天线包括波导天线元件的阵列，每个元件具有空腔，以及包括设置在空腔中的上贴片元件和下贴片元件的贴片天线元件阵列。
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公开(公告)号：US20100126010A1
公开(公告)日：2010-05-27
申请号：US12694450
申请日：2010-01-27
Applicant: Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
Inventor： Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
CPC classification number: H01Q21/0087 , H03H7/38 , H05K1/0251 , H05K1/116 , H05K3/429 , H05K3/4623 , H05K2201/09145 , H05K2201/09454 , H05K2201/09536 , H05K2201/09718 , H05K2201/09727 , H05K2201/209 , H05K2203/061 , Y10T29/49165
Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.
Abstract translation: 多层电路板组件包括构成电路板组件的不同电路板上的不同电路层之间的一个或多个射频（RF）互连。 RF互连可以包括一个或多个RF匹配焊盘，其提供用于匹配RF短截线的阻抗特性的机制，以在期望的RF工作频带上提供具有期望的插入损耗和阻抗特性的RF互连。 RF匹配焊盘允许制造具有RF互连的电路板，而不需要执行任何后钻和反向填充操作以去除多层电路板组件中的RF互连的短截线部分。
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Patent Agency Ranking
公开(公告)号：US07671696B1
公开(公告)日：2010-03-02
申请号：US11558126
申请日：2006-11-09
Applicant: Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
Inventor： Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
IPC: H03H7/38
CPC classification number: H01Q21/0087 , H03H7/38 , H05K1/0251 , H05K1/116 , H05K3/429 , H05K3/4623 , H05K2201/09145 , H05K2201/09454 , H05K2201/09536 , H05K2201/09718 , H05K2201/09727 , H05K2201/209 , H05K2203/061 , Y10T29/49165
Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.
Abstract translation: 多层电路板组件包括构成电路板组件的不同电路板上的不同电路层之间的一个或多个射频（RF）互连。 RF互连可以包括一个或多个RF匹配焊盘，其提供用于匹配RF短截线的阻抗特性的机制，以在期望的RF工作频带上提供具有期望的插入损耗和阻抗特性的RF互连。 RF匹配焊盘允许制造具有RF互连的电路板，而不需要执行任何后钻和反向填充操作以去除多层电路板组件中的RF互连的短截线部分。
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公开(公告)号：US06731189B2
公开(公告)日：2004-05-04
申请号：US10185853
申请日：2002-06-27
Applicant: Angelo Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica
Inventor： Angelo Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica
IPC: H01L21768
CPC classification number: H01P3/085 , H01P3/088 , H05K1/0237 , H05K3/321 , H05K3/462 , H05K2201/09509 , H05K2201/09536 , H05K2201/096 , H05K2201/10234 , H05K2203/061
Abstract: A multi-layer stripline assembly interconnection includes a first stripline sub-assembly having a first surface and a first plurality of vias disposed in the first surface adapted to receive a plurality of solid metal balls. The interconnection further includes a second stripline sub-assembly having a second plurality of vias disposed in the first surface of the second sub-assembly adapted to be aligned with the first plurality of vias. Reflowed solder is wetted to the second plurality of vias and to the corresponding plurality of solid metal balls.
Abstract translation: 多层带状线组合互连包括具有第一表面的第一带状线子组件和设置在第一表面中的适于容纳多个固体金属球的第一多个通孔。 互连还包括第二带状线子组件，其具有设置在第二子组件的第一表面中的适于与第一多个通孔对准的第二多个通孔。 回流焊料被润湿到第二多个通孔和对应的多个固体金属球。
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公开(公告)号：US20100033262A1
公开(公告)日：2010-02-11
申请号：US11558126
申请日：2006-11-09
Applicant: Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
Inventor： Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
IPC: H03H7/38
CPC classification number: H01Q21/0087 , H03H7/38 , H05K1/0251 , H05K1/116 , H05K3/429 , H05K3/4623 , H05K2201/09145 , H05K2201/09454 , H05K2201/09536 , H05K2201/09718 , H05K2201/09727 , H05K2201/209 , H05K2203/061 , Y10T29/49165
Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.
Abstract translation: 多层电路板组件包括构成电路板组件的不同电路板上的不同电路层之间的一个或多个射频（RF）互连。 RF互连可以包括一个或多个RF匹配焊盘，其提供用于匹配RF短截线的阻抗特性的机制，以在期望的RF工作频带上提供具有期望的插入损耗和阻抗特性的RF互连。 RF匹配焊盘允许制造具有RF互连的电路板，而不需要执行任何后钻和反向填充操作以去除多层电路板组件中的RF互连的短截线部分。
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公开(公告)号：US07348932B1
公开(公告)日：2008-03-25
申请号：US11533848
申请日：2006-09-21
Applicant: Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
Inventor： Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
IPC: H01Q21/00
CPC classification number: H01Q21/22 , H01Q21/0025
Abstract: A radiator includes a waveguide having an aperture and a patch antenna disposed in the aperture. In one embodiment, an antenna includes an array of waveguide antenna elements, each element having a cavity, and an array of patch antenna elements including an upper patch element and a lower patch element disposed in the cavity.
Abstract translation: 散热器包括具有开口的波导和布置在孔中的贴片天线。 在一个实施例中，天线包括波导天线元件的阵列，每个元件具有空腔，以及包括设置在空腔中的上贴片元件和下贴片元件的贴片天线元件阵列。
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公开(公告)号：US08981869B2
公开(公告)日：2015-03-17
申请号：US12694450
申请日：2010-01-27
Applicant: Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
Inventor： Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
CPC classification number: H01Q21/0087 , H03H7/38 , H05K1/0251 , H05K1/116 , H05K3/429 , H05K3/4623 , H05K2201/09145 , H05K2201/09454 , H05K2201/09536 , H05K2201/09718 , H05K2201/09727 , H05K2201/209 , H05K2203/061 , Y10T29/49165
Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.
Abstract translation: 多层电路板组件包括构成电路板组件的不同电路板上的不同电路层之间的一个或多个射频（RF）互连。 RF互连可以包括一个或多个RF匹配焊盘，其提供用于匹配RF短截线的阻抗特性的机制，以在期望的RF工作频带上提供具有期望的插入损耗和阻抗特性的RF互连。 RF匹配焊盘允许制造具有RF互连的电路板，而不需要执行任何后钻和反向填充操作以去除多层电路板组件中的RF互连的短截线部分。
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