公开(公告)号：US07615256B2

公开(公告)日：2009-11-10

申请号：US11575973

申请日：2005-09-21

Applicant: Christoph Rickert ,  Jurgen Kress ,  Michel Probst

Inventor： Christoph Rickert ,  Jurgen Kress ,  Michel Probst

IPC: B05D1/04

CPC classification number: H05K3/4626 ,  B05D1/24 ,  B05D1/28 ,  B05D3/0254 ,  B05D3/14 ,  B05D2252/02 ,  H05K2201/0358 ,  H05K2201/083 ,  H05K2203/105 ,  H05K2203/1355

Abstract: Disclosed is a process for mixing and gentle transport and transfer of powders to substrates.

Abstract translation: 公开了一种将粉末混合并缓和输送和转移至基底的方法。

公开(公告)号：US08715780B2

公开(公告)日：2014-05-06

申请号：US13054565

申请日：2010-02-19

Applicant: Alex Bruderer ,  Jurgen Herbert ,  Max Hunziker ,  Michel Probst

Inventor： Alex Bruderer ,  Jurgen Herbert ,  Max Hunziker ,  Michel Probst

IPC: B05D1/26 ,  B05D3/00 ,  B05C19/04

CPC classification number: B05C19/04 ,  B05C9/12 ,  B05C9/14 ,  B05C19/02 ,  B05C19/06 ,  B05D1/30 ,  B05D3/007 ,  B05D3/0254 ,  B05D2401/32 ,  H05K3/022 ,  H05K2201/0358 ,  H05K2203/1355 ,  H05K2203/1545

Abstract: Method for producing a plastic layer having a layer thickness of less than 200 μm on an upper side of a substrate includes the following steps: applying plastic powder to the substrate upper side by means of a powder scattering device, then cleaning the substrate underside, then melting the applied plastic powder in a furnace, as a result of which the plastic layer is formed on the substrate, and cooling the substrate, wherein the substrate is transported continuously from method step to method step.

Abstract translation: 在基板的上侧制造层厚度小于200μm的塑料层的方法包括以下步骤：通过粉末散射装置将塑料粉末施加到基板上侧，然后清洁基板下侧，然后 在炉中熔化所施加的塑料粉末，由此在衬底上形成塑料层，并冷却衬底，其中衬底从方法步骤连续输送到方法步骤。

公开(公告)号：US20130199825A1

公开(公告)日：2013-08-08

申请号：US13817825

申请日：2011-10-21

Applicant: Alex Bruderer ,  Norbert Galster ,  Jurgen Kress ,  Michel Probst

Inventor： Alex Bruderer ,  Norbert Galster ,  Jurgen Kress ,  Michel Probst

IPC: H05K3/00 ,  H05K1/03

CPC classification number: H05K3/0085 ,  H05K1/0313 ,  H05K3/0032 ,  H05K3/4673 ,  H05K2201/0112 ,  H05K2201/0195 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T29/49155 ,  Y10T428/24967

Abstract: Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer (1), a resin layer without reinforcement (2), and a resin layer with reinforcement (3). The circuitry (9) is embedded into the resin layer without reinforcement (2).

Abstract translation: 公开了用于制造印刷电路板，IC基板，芯片封装等的复合材料堆积材料。 复合材料堆积材料适用于嵌入诸如微孔，沟槽和垫的电路。 复合堆积材料包括载体层（1），没有增强层（2）的树脂层和具有加强层（3）的树脂层。 电路（9）嵌入树脂层而不加固（2）。

公开(公告)号：US20110293823A1

公开(公告)日：2011-12-01

申请号：US13054565

申请日：2010-02-19

Applicant: Alex Bruderer ,  Jurgen Herbert ,  Max Hunziker ,  Michel Probst

Inventor： Alex Bruderer ,  Jurgen Herbert ,  Max Hunziker ,  Michel Probst

IPC: B05D7/24 ,  B05C11/10 ,  B05C11/00 ,  B05D3/02 ,  B05C9/14

CPC classification number: B05C19/04 ,  B05C9/12 ,  B05C9/14 ,  B05C19/02 ,  B05C19/06 ,  B05D1/30 ,  B05D3/007 ,  B05D3/0254 ,  B05D2401/32 ,  H05K3/022 ,  H05K2201/0358 ,  H05K2203/1355 ,  H05K2203/1545

Abstract: Method for producing a plastic layer having a layer thickness of less than 200 μm on an upper side of a substrate, comprising the following steps: applying plastic powder to the substrate upper side by means of a powder scattering device, then cleaning the substrate underside, then melting the applied plastic powder in a furnace, as a result of which the plastic layer is formed on the substrate, and cooling the substrate, wherein the substrate is transported continuously from method step to method step.

Abstract translation: 在基板的上侧制造层厚度小于200μm的塑料层的方法，包括以下步骤：通过粉末散射装置将塑料粉末施加到基板上侧，然后清洁基板底面， 然后在炉中熔化所施加的塑料粉末，由此在衬底上形成塑料层，并冷却衬底，其中衬底从方法步骤连续输送到方法步骤。

公开(公告)号：US20080268166A1

公开(公告)日：2008-10-30

申请号：US11575973

申请日：2005-09-21

Applicant: Christoph Rickert ,  Jurgen Kress ,  Michel Probst

Inventor： Christoph Rickert ,  Jurgen Kress ,  Michel Probst

IPC: B05D1/28 ,  B05D1/24

CPC classification number: H05K3/4626 ,  B05D1/24 ,  B05D1/28 ,  B05D3/0254 ,  B05D3/14 ,  B05D2252/02 ,  H05K2201/0358 ,  H05K2201/083 ,  H05K2203/105 ,  H05K2203/1355

Abstract: The invention relates to a process for the mixing and gentle transport and the transfer of powders to substrates wherein the powder particles are first charged by friction in the presence of magnetic particles and then transported by means of a fluidized bed and optionally one or more mixing rolls and then transferred and applied to a substrate by means of an electric field between a brush drum and a substrate drum carrying said substrate, characterized in that the mixing and the transport of the powder particles and the magnetic particles are carried out by means of a boiling bed.

Abstract translation: 本发明涉及一种用于混合和平缓输送和将粉末转移到基材的方法，其中粉末颗粒首先通过摩擦在磁性颗粒存在下进料，然后通过流化床和任选的一个或多个混合辊 然后通过电刷鼓和承载所述基底的基底鼓之间的电场转移并施加到基底上，其特征在于，粉末颗粒和磁性颗粒的混合和输送通过沸腾 床。