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    Methods for Forming an Electrode Device with Reduced Impedance
    4.
    发明申请
    Methods for Forming an Electrode Device with Reduced Impedance 审中-公开

    公开(公告)号：US20190038892A1

    公开(公告)日：2019-02-07

    申请号：US15999381

    申请日：2018-08-20

    Applicant: NeuroNexus Technologies, Inc.

    Inventor： John P Seymour

    IPC: A61N1/04 ,  A61B5/04

    Abstract: A method for providing a neural interface system. At least one primary metallization layer is deposited on a substrate. The primary metallization layer has a thickness. A monolayer of nanospheres is deposited in a substantially uniform distribution. The nanospheres contact an upper surface of the primary metallization layer. The upper surface of the primary metallization layer not contacted by the nanospheres is treated to form a plurality of undulating structures having a substantially uniform arrangement. The treating comprises etching recesses part-way through the thickness of exposed portions of the primary metallization layer from the upper surface thereof.

    Implantable neural interface device with a deformable carrier
    8.
    发明授权
    Implantable neural interface device with a deformable carrier 有权
    具有可变形载体的植入式神经接口装置

    公开(公告)号：US08958890B2

    公开(公告)日：2015-02-17

    申请号：US13740310

    申请日：2013-01-14

    Applicant: NeuroNexus Technologies, Inc.

    Inventor： Daryl R. Kipke ,  Jamille Farraye Hetke ,  Rio J. Vetter ,  John P. Seymour

    IPC: A61N1/05 ,  A61N1/36 ,  A61B5/0478 ,  A61B5/04 ,  A61B5/00

    CPC classification number: A61B5/0478 ,  A61B5/04001 ,  A61B5/686 ,  A61B5/6868 ,  A61B2562/187 ,  A61N1/05 ,  A61N1/0529 ,  A61N1/0539 ,  A61N1/0551 ,  A61N1/36

    Abstract: An improved deformable carrier or connector for an implantable neural interface device is described. The neural interface device comprises a carrier supporting at least one electrode array. The carrier comprises a tubular sidewall extending from a proximal carrier portion to a distal carrier portion. At least one deformable segment is provided in the carrier sidewall. The deformable segment is more pliable than the remainder of the carrier sidewall to preferably move in response to forces imparted on the carrier and the electrode array by the shifting forces in body tissue. The deformable segment takes the form of a thinned sidewall segment or a slitted wall segment.

    Abstract translation: 描述了用于可植入神经接口装置的改进的可变形载体或连接器。 神经接口装置包括支撑至少一个电极阵列的载体。 载体包括从近端载体部分延伸到远端载体部分的管状侧壁。 至少一个可变形段设置在承载器侧壁中。 可变形部分比载体侧壁的其余部分更柔韧，优选地响应于通过身体组织中的移动力施加在载体和电极阵列上的力而移动。 可变形段采取变薄的侧壁段或切开的壁段的形式。

    System and method to manufacture an implantable electrode
    9.
    发明授权
    System and method to manufacture an implantable electrode 有权
    制造可植入电极的系统和方法

    公开(公告)号：US08703537B2

    公开(公告)日：2014-04-22

    申请号：US14030069

    申请日：2013-09-18

    Applicant: NeuroNexus Technologies, Inc.

    Inventor： David S. Pellinen ,  Jamille Farraye Hetke ,  Daryl R. Kipke ,  Kc Kong ,  Rio J. Vetter ,  Mayurachat Ning Gulari

    IPC: H01L23/48

    CPC classification number: H01L23/49541 ,  A61N1/05 ,  H01L21/561 ,  H01L23/293 ,  H01L23/3185 ,  H01L2924/0002 ,  H01L2924/3025 ,  H01L2924/00

    Abstract: The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.

    Abstract translation: 优选实施例的方法包括提供具有框架部分和中心部分的基部的步骤; 建立与基地相结合的初步结构; 去除所述初步结构的一部分以限定一系列装置和多个桥; 移除所述基座的中心部分使得所述框架部分限定开放区域，其中所述多个桥将所述一系列装置悬挂在由所述框架限定的开放区域中; 并封装了一系列设备。 该方法优选地设计用于制造半导体器件，更具体地设计用于制造封装的可植入电极。 然而，该方法可以替代地在任何合适的环境中用于任何合适的原因。

    Neurotrophic Electrode Array
    10.
    发明公开
    Neurotrophic Electrode Array 审中-公开

    公开(公告)号：US20240156385A1

    公开(公告)日：2024-05-16

    申请号：US18384628

    申请日：2023-10-27

    Applicant: Neural Logistics LLC ,  NeuroNexus Technologies, Inc.

    Inventor： Philip R. Kennedy ,  Jamille Hetke

    IPC: A61B5/268 ,  H05K1/02 ,  H05K1/03

    CPC classification number: A61B5/268 ,  H05K1/0296 ,  H05K1/0346 ,  A61B2562/125 ,  H05K2201/0154 ,  H05K2201/09027

    Abstract: An electrode array includes a fan-shaped substrate member. The fan-shaped substrate member includes a dielectric material and that has a triangular portion with a convexly curved base from which a first side and an opposite second side extend to a truncated apex that includes a concavely curved surface. An elongated lead member includes the dielectric material and extends from the base adjacent to a selected one of the first side and the second side. The elongated lead member is contiguous with the fan-shaped substrate member. Each of a plurality of wires is embedded in the fan-shaped substrate member and the elongated lead member. Each of a corresponding plurality of electrodes is electrically coupled to a different one of the plurality of wires. Each of the corresponding plurality of electrodes includes an exposed surface.

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