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    GROOVE ON COVER PLATE OR SUBSTRATE
    3.
    发明申请
    GROOVE ON COVER PLATE OR SUBSTRATE 审中-公开
    盖在盖板或底板上

    公开(公告)号：US20090323170A1

    公开(公告)日：2009-12-31

    申请号：US12165429

    申请日：2008-06-30

    Applicant: Peng Cheng Lin

    Inventor： Peng Cheng Lin

    IPC: G02B26/00 ,  H01L21/50 ,  H01L29/84

    CPC classification number: G02B26/001 ,  B81C1/00333 ,  B81C1/00873

    Abstract: An improved substrate or cover plate design with a groove for effective singulation of individual display apparatus. In one embodiment, the display apparatus comprises a prefabricated groove on an inside face of a substrate or cover plate to facilitate separation of a MEMS device from a plurality of MEMS devices formed a substrate. In some embodiments, the prefabricated grooves make breaking at pseudo scribe lines simple by thinning and weakening the substrate or cover plate at a scribe zone and act as an improved guide for breaking. Scribe cut relief preserves components, structural integrity, and produces a clean break without inducing excessive or unwanted stresses into the MEMS core and ensures no damage at the panel ledge for subsequent interconnect assembly.

    Abstract translation: 改进的基板或盖板设计，具有用于单独显示装置的有效分割的凹槽。 在一个实施例中，显示装置包括在基板或盖板的内表面上的预制凹槽，以便于将MEMS装置与形成基板的多个MEMS装置分离。 在一些实施例中，预制凹槽通过在划刻区处减薄和削弱基板或盖板而简化了伪划线，并且作为改进的断裂引导件。 Scribe切割浮雕保留部件，结构完整性，并产生干净的断裂，而不会在MEMS芯中引起过大或不必要的应力，并确保在面板凸缘处不会对随后的互连组件造成损坏。

    METAL THIN SHIELD ON ELECTRICAL DEVICE
    6.
    发明申请
    METAL THIN SHIELD ON ELECTRICAL DEVICE 审中-公开
    电气设备上的金属薄膜

    公开(公告)号：US20130032385A1

    公开(公告)日：2013-02-07

    申请号：US13197162

    申请日：2011-08-03

    Applicant: Peng Cheng Lin ,  Mario Francisco Velez

    Inventor： Peng Cheng Lin ,  Mario Francisco Velez

    IPC: H05K1/18 ,  H05K3/30

    CPC classification number: B81B7/0058 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2207/095 ,  B81C2203/0136 ,  B81C2203/0163 ,  G01P1/023 ,  H01G5/16 ,  H01L23/315 ,  H01L23/552 ,  H01L2924/0002 ,  Y10T29/49146 ,  H01L2924/00

    Abstract: This disclosure provides systems and methods for forming a metal thin film shield over a thin film cap to protect electromechanical systems devices in a cavity beneath. In one aspect, a dual or multi layer thin film structure is used to seal a electromechanical device. For example, a metal thin film shield can be mated over an oxide thin film cap to encapsulate the electromechanical device and prevent degradation due to wafer thinning, dicing and package assembly induced stresses, thereby strengthening the survivability of the electromechanical device in the encapsulated cavity. During redistribution layer processing, a metal thin film shield, such as a copper layer, is formed over the wafer surface, patterned and metalized.

    Abstract translation: 本公开提供了用于在薄膜盖上形成金属薄膜屏蔽以保护下面空腔中的机电系统装置的系统和方法。 在一个方面，使用双层或多层薄膜结构来密封机电装置。 例如，金属薄膜屏蔽可以配合在氧化物薄膜帽上以封装机电装置，并防止由于晶片变薄，切割和封装组件引起的应力引起的劣化，从而增强机电装置在封装空腔中的生存性。 在再分配层处理期间，在晶片表面上形成诸如铜层的金属薄膜屏蔽，被图案化和金属化。

    Flex Design and Attach Method for Reducing Display Panel Periphery
    8.
    发明申请
    Flex Design and Attach Method for Reducing Display Panel Periphery 审中-公开
    用于减少显示屏周边的Flex设计和附件方法

    公开(公告)号：US20110254758A1

    公开(公告)日：2011-10-20

    申请号：US12763025

    申请日：2010-04-19

    Applicant: Peng Cheng Lin ,  Mithran Cheriyan Mathew

    Inventor： Peng Cheng Lin ,  Mithran Cheriyan Mathew

    IPC: G09G3/34 ,  H01J9/00 ,  H01J9/20

    CPC classification number: H05K1/189 ,  G02B26/001 ,  G02F1/13452 ,  H05K2201/10128

    Abstract: Various embodiments described herein involve making connections with the display leads on more than one side of the display array, e.g., on 2 sides, 3 sides or all 4 sides of the display array. By making connections with the display leads on more than one side of the display array, the available area for bonding leads and control circuitry may be increased. The driver chip(s), discrete components, and other active components necessary for addressing the display panel may be attached to the top or the bottom of a flexible printed circuit (“FPC”) or a similar device. Some embodiments involve attaching an FPC to the display such that that the backplate is substantially encased by the FPC.

    Abstract translation: 本文描述的各种实施例涉及在显示器阵列的不止一个侧面上，例如在显示器阵列的2个侧面，3个侧面或全部4个侧面上与显示器引线连接。 通过与显示器阵列的多于一侧的显示器引线连接，可以增加用于接合引线和控制电路的可用区域。 用于寻址显示面板所需的驱动器芯片，分立部件和其它有源部件可以附接到柔性印刷电路（“FPC”）或类似装置的顶部或底部。 一些实施例涉及将FPC附接到显示器，使得背板基本上被FPC包围。

    Lead frame including an inductor or other such magnetic component
    9.
    发明授权
    Lead frame including an inductor or other such magnetic component 失效
    引线框架包括电感器或其他这样的磁性部件

    公开(公告)号：US5428245A

    公开(公告)日：1995-06-27

    申请号：US239346

    申请日：1994-05-06

    Applicant: Peng-Cheng Lin ,  Seth R. Sanders ,  Hem P. Takiar

    Inventor： Peng-Cheng Lin ,  Seth R. Sanders ,  Hem P. Takiar

    IPC: G01R1/20 ,  H01L23/495 ,  H01L23/48

    CPC classification number: H01L23/495 ,  G01R1/20 ,  H01L23/49541 ,  H01L2924/0002 ,  Y10S257/924

    Abstract: A lead frame for use in an integrated circuit package is disclosed herein. The lead frame includes a magnetic component winding wherein the winding is formed as an integral part of the lead frame. Additional windings may be formed as an integral part of the lead frame and then folded into position over the first winding to form a multiple layered magnetic component winding. In one embodiment, the lead frame based winding is coated with a magnetic material to form a lead frame based inductor. There is also disclosed a method of producing a lead frame including a magnetic component winding wherein the winding is formed as an integral part of the lead frame.

    Abstract translation: 本文公开了一种用于集成电路封装的引线框架。 引线框架包括磁性部件绕组，其中绕组形成为引线框架的整体部分。 另外的绕组可以形成为引线框架的整体部分，然后折叠到第一绕组上的位置以形成多层磁性部件绕组。 在一个实施例中，基于引线框的绕组被涂覆有磁性材料以形成基于引线框架的电感器。 还公开了一种制造包括磁性部件绕组的引线框架的方法，其中绕组形成为引线框架的整体部分。

    Die collet with cavity wall recess
    10.
    发明授权
    Die collet with cavity wall recess 失效
    模具夹头与腔壁凹槽

    公开(公告)号：US5348316A

    公开(公告)日：1994-09-20

    申请号：US914950

    申请日：1992-07-16

    Applicant: Peng-Cheng Lin

    Inventor： Peng-Cheng Lin

    IPC: H01L21/683 ,  H05K13/04 ,  B25B11/00

    CPC classification number: H01L21/6838 ,  H01L24/75 ,  H05K13/0408 ,  H01L2221/68322 ,  Y10T279/11

    Abstract: The invention provides a method and apparatus for picking a separated semiconductor die 128 from a wafer and placing it on a die attach pad 144 for bonding thereto. In a preferred embodiment, the apparatus comprises a die collet having a body 124 with a proximal end 123 and a distal end 125; at least one pair of spaced-apart walls 136 extending distally from the distal end of the body and having opposing faces 181 defining an aperture 126, the faces of the walls being sloped such that a distal portion of the aperture is wider than the die and a proximal portion of the aperture is narrower than the die; a recess 152 on the faces of the walls extending substantially the length of the die, the recess having a distally-facing surface 154 for contacting at least a portion of the top side 138 of the die; and means for holding the die in the aperture, usually including a vacuum port 128. The method comprises providing a collet like the aforementioned; positioning the aperture 126 over a die 120; exerting a vacuum pressure through the vacuum port 128 to retain the die in the aperture such that a portion of the top side contacts the distally-facing surface 154 of the recess 152; positioning the die over the pad 144 such that the bottom side of the die is parallel to the pad; and discontinuing the vacuum pressure to release the die from the aperture.

    Abstract translation: 本发明提供了一种用于从晶片拾取分离的半导体管芯128并将其放置在管芯附接垫144上用于与其结合的方法和装置。 在优选实施例中，该装置包括具有主体124的模具夹头，其具有近端123和远端125; 至少一对隔开的壁136从主体的远端向远侧延伸并且具有限定孔126的相对面181，壁的表面倾斜，使得孔的远端部分比模具更宽， 孔的近端部分比模具更窄; 在壁的表面上的凹部152基本上延伸到模具的长度，凹部具有用于接触模具的顶侧138的至少一部分的朝向远端的表面154; 以及用于将模具保持在孔中的装置，通常包括真空端口128.该方法包括提供如上所述的夹头; 将孔126定位在模具120上; 通过真空端口128施加真空压力以将模具保持在孔中，使得顶侧的一部分接触凹部152的面向远端的表面154; 将管芯定位在焊盘144上，使得管芯的底侧平行于焊盘; 并停止真空压力以从孔中释放模具。

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