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    Electronic Assembly Having Stressable Contact Bridge with Fuse Function
    2.
    发明申请
    Electronic Assembly Having Stressable Contact Bridge with Fuse Function 有权
    具有保险丝功能的应力接触桥的电子组件

    公开(公告)号：US20110050386A1

    公开(公告)日：2011-03-03

    申请号：US12899941

    申请日：2010-10-07

    Applicant: Roberto SCHLENKER ,  Michael NAGEL ,  Juergen MARTIN

    Inventor： Roberto SCHLENKER ,  Michael NAGEL ,  Juergen MARTIN

    IPC: H01H37/76

    CPC classification number: H01H37/761 ,  H05K1/0201 ,  H05K1/0263 ,  H05K3/222 ,  H05K3/341 ,  H05K3/3415 ,  H05K2201/0311 ,  H05K2201/10181 ,  H05K2201/10265

    Abstract: An electronic circuit includes a conductor path on a circuit board, and at least one SMD component, electronic component and/or electromechanical component mounted on the circuit board and connected to the conductor path. A circuit connection is established via a soldered joint and a spring-loaded or stressed springy contact bridge that provides fuse protection. In the event of excessive power dissipation or high temperature, the soldered joint melts or softens and the contact bridge springs open to interrupt the circuit.

    Abstract translation: 电子电路包括电路板上的导体路径和安装在电路板上并连接到导体路径的至少一个SMD组件，电子组件和/或机电组件。 通过焊接接头和弹簧加载或应力弹性接触桥建立电路连接，提供保险丝保护。 在功耗过高或温度过高的情况下，焊接接头熔化或软化，接触桥弹簧打开以中断电路。

    Printed board for electronic devices controlling a motor vehicle
    3.
    发明申请
    Printed board for electronic devices controlling a motor vehicle 审中-公开
    用于控制汽车的电子设备的印刷电路板

    公开(公告)号：US20060102385A1

    公开(公告)日：2006-05-18

    申请号：US10517948

    申请日：2003-06-14

    Applicant: Andreas Heise ,  Jochen Beuss ,  Roberto Schlenker ,  Philipp Herbst

    Inventor： Andreas Heise ,  Jochen Beuss ,  Roberto Schlenker ,  Philipp Herbst

    IPC: H05K1/09 ,  H01H85/04

    CPC classification number: H05K1/0293 ,  H01H37/761 ,  H01H85/046 ,  H01H85/463 ,  H01H2037/046 ,  H01H2085/0275 ,  H05K1/0263 ,  H05K2201/0305 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2203/0415 ,  H05K2203/173

    Abstract: In order to protect a printed circuit board (1, 1′) especially against the development of heat by simple means, said printed circuit board includes strip conductors for electronic circuits and connections for a voltage supply unit equipped with at least one SMD-component and additional electronic and/or electromechanical parts that are soldered in a suitable manner. The voltage supply unit is connected to one or several supplying strip conductors (2). At least one of the supplying strip conductors (2) includes a break to this end which is bridged in a conductive manner by means of a fuse bridge (6), said fuse bridge (6) containing or being made of a basic material, the melting point of which is lower than the melting point of the material of which the strip conductors are made.

    Abstract translation: 为了通过简单的手段特别地防止印刷电路板（1,1'）保护发热，所述印刷电路板包括用于电子电路的带状导体和用于具有至少一个SMD分量和 额外的电子和/或机电零件以适当的方式焊接。 电压供应单元连接到一个或多个供电条导体（2）。 供电带状导体（2）中的至少一个包括通过熔丝桥（6）以导电方式桥接的该端部的断裂，所述熔断器桥（6）包含或由基本材料制成， 其熔点低于制造带状导体的材料的熔点。

    Electronic assembly having spring-loaded contact bridge with fuse function
    4.
    发明授权
    Electronic assembly having spring-loaded contact bridge with fuse function 有权
    电子组件具有带保险丝功能的弹簧加载接触桥

    公开(公告)号：US07864024B2

    公开(公告)日：2011-01-04

    申请号：US11886755

    申请日：2006-03-28

    Applicant: Roberto Schlenker ,  Michael Nagel ,  Juergen Martin

    Inventor： Roberto Schlenker ,  Michael Nagel ,  Juergen Martin

    IPC: H01H85/36 ,  H01H37/76

    CPC classification number: H01H37/761 ,  H01H2037/762 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10181 ,  H05K2201/10265 ,  H05K2203/176

    Abstract: An electronic assembly includes an electronic circuit on a circuit board. The circuit includes a conductor path on the circuit board, and at least one SMD component, electronic component and/or electromechanical component that is mounted on the circuit board and connected to the conductor path. A circuit connection between any two of the conductor paths and/or the components is established via a soldered joint and a spring-loaded contact bridge. In the event of excessive power dissipation, the soldered joint melts or weakens and the contact bridge opens due to the spring force.

    Abstract translation: 电子组件包括电路板上的电子电路。 该电路包括电路板上的导体路径，以及安装在电路板上并连接到导体路径的至少一个SMD组件，电子组件和/或机电组件。 通过焊接接头和弹簧加载的接触桥来建立任何两个导体路径和/或部件之间的电路连接。 在功率过大的情况下，由于弹簧力，焊接接头熔化或变弱，接触桥打开。

    Electronic Assembly
    5.
    发明申请
    Electronic Assembly 有权
    电子组装

    公开(公告)号：US20090027156A1

    公开(公告)日：2009-01-29

    申请号：US11886755

    申请日：2006-03-28

    Applicant: Roberto Schlenker ,  Michael Nagel ,  Juergen Martin

    Inventor： Roberto Schlenker ,  Michael Nagel ,  Juergen Martin

    IPC: H01H37/76

    CPC classification number: H01H37/761 ,  H01H2037/762 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10181 ,  H05K2201/10265 ,  H05K2203/176

    Abstract: An electronic assembly (1) with a circuit board (2) that is provided with conductor paths or strips (6) and, for forming an electronic circuit, is equipped with a number of SMD components (4) and/or further electronic and/or electromechanical elements through use of a suitable solder, shall be secured with simple means against high power dissipation. For that purpose, according to the invention, a number of connections between conductor strips (6), components and/or elements is produced via respectively one spring-loaded contact bridge (12, 12′, 12″, 12′″).

    Abstract translation: 具有设置有导体路径或条带（6）的电路板（2）和用于形成电子电路的电子组件（1）配备有多个SMD部件（4）和/或电子和/ 或通过使用合适的焊料的机电元件，应通过简单的手段确保高功率消耗。 为此，根据本发明，导体条（6），部件和/或元件之间的多个连接分别通过一个弹簧加载的接触桥（12,12'，12“，12”'） 。

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