公开(公告)号：US20090319213A1

公开(公告)日：2009-12-24

申请号：US12516056

申请日：2007-11-11

Applicant: Yasuo Okumura ,  Ryo Taniguchi ,  Kuniaki Nishimura ,  Roji Fujiwara ,  Takanobu Fujii ,  Kazuhiko Sumida

Inventor： Yasuo Okumura ,  Ryo Taniguchi ,  Kuniaki Nishimura ,  Roji Fujiwara ,  Takanobu Fujii ,  Kazuhiko Sumida

IPC: G01M17/00 ,  G06F19/00 ,  G05B11/01 ,  G06K7/10

CPC classification number: B62D65/005 ,  B62D65/06

Abstract: This door closing-inspection apparatus for a vehicle is provided with: a first lightening and light-receiving device which is arranged so as to stride over a transferring conveyer in a finished vehicle inspection line which inspects a finished vehicle while transferring the finished vehicle; a pair of door-closing devices arranged at positions where are on a downstream side of the first lightening and light-receiving device, and are on symmetrically both sides of a length of the transferring conveyer; a second lightening and light-receiving device arranged on downstream side of the door-closing devices so as to stride over the transferring conveyer; a pair of door distance-measuring sensors arranged at positions where are on a downstream side of the second lightening and light-receiving device, and are on symmetrically both sides of the length of the transferring conveyer; and a controller which is connected to the first lightening and light-receiving device, the second lightening and light-receiving device, the door-closing devices, the distance-measuring sensors, and a driving source controller of the transferring conveyer, wherein: each of the door-closing devices is provided with a linear cylinder which can control a rod stroke thereof, and a door-pressing pad which is attached via a spherical joint to a rod distal end portion of the linear cylinder; each of the door-closing devices is activated to close an opened door of the finished vehicle after a predetermined time has passed since the first lightening and light-receiving device has detected a vehicular body of the finished vehicle; and each of the distance-measuring sensors is activated to measure a distance with respect to a vehicular body side face of the finished vehicle after a predetermined time has passed since the second lightening and light-receiving device has detected the vehicular body of the finished vehicle.

公开(公告)号：USD623548S1

公开(公告)日：2010-09-14

申请号：US29352563

申请日：2009-12-22

Applicant: Takayuki Nishikawa ,  Yoshiaki Honda ,  Tomohiro Kamitsu ,  Sadayuki Sumi ,  Ryo Taniguchi

Designer： Takayuki Nishikawa ,  Yoshiaki Honda ,  Tomohiro Kamitsu ,  Sadayuki Sumi ,  Ryo Taniguchi

公开(公告)号：USD623547S1

公开(公告)日：2010-09-14

申请号：US29352544

申请日：2009-12-22

Applicant: Takayuki Nishikawa ,  Yoshiaki Honda ,  Tomohiro Kamitsu ,  Sadayuki Sumi ,  Ryo Taniguchi

Designer： Takayuki Nishikawa ,  Yoshiaki Honda ,  Tomohiro Kamitsu ,  Sadayuki Sumi ,  Ryo Taniguchi

公开(公告)号：US06513214B2

公开(公告)日：2003-02-04

申请号：US09807414

申请日：2001-04-19

Applicant: Makoto Nishimura ,  Kenichi Kimura ,  Nobuyuki Miyagawa ,  Masato Kawashima ,  Yoshimitsu Nakamura ,  Motoo Ikari ,  Yuji Takada ,  Ryo Taniguchi

Inventor： Makoto Nishimura ,  Kenichi Kimura ,  Nobuyuki Miyagawa ,  Masato Kawashima ,  Yoshimitsu Nakamura ,  Motoo Ikari ,  Yuji Takada ,  Ryo Taniguchi

IPC: H01L4100

CPC classification number: H01L37/02 ,  Y10T29/42 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method of producing plural device chips from a thin plate of a pyroelectric material comprises the following steps. First, plural device-forming regions each having an electrode and a circuit pattern for electrically connecting the electrodes are formed on each of front and rear surfaces of the thin plate to obtain a device substrate. By making an electrical connection between the circuit patterns, and grounding it, all of the device-forming regions on the device substrate are at the same potential. Next, a blast treatment is performed to the device substrate to remove a required region of the pyroelectric material, while leaving a bridge portion extending between adjacent device-forming regions and having the circuit patterns thereon, so that a device-chip aggregate is formed, in which adjacent device chips are coupled through the bridge portion. Subsequently, by removing the bridge portion, the device chip is separated from the device-chip aggregate.

公开(公告)号：US08571824B2

公开(公告)日：2013-10-29

申请号：US12516056

申请日：2007-11-05

Applicant: Yasuo Okumura ,  Ryo Taniguchi ,  Kuniaki Nishimura ,  Koji Fujiwara ,  Takanobu Fujii ,  Kazuhiko Sumida

Inventor： Yasuo Okumura ,  Ryo Taniguchi ,  Kuniaki Nishimura ,  Koji Fujiwara ,  Takanobu Fujii ,  Kazuhiko Sumida

IPC: G01N37/00 ,  B62D65/18

CPC classification number: B62D65/005 ,  B62D65/06

Abstract: A door closing-inspection apparatus for a vehicle includes a first lightening and light-receiving device which strides over a transferring conveyer in a finished vehicle inspection line which inspects a finished vehicle while being transferred; a pair of door-closing devices arranged at positions on a downstream side of the first lightening and light-receiving device and on symmetrically both sides of a length of the transferring conveyer; a second lightening and light-receiving device arranged on a downstream side of the door-closing devices which strides over the transferring conveyer; a pair of door distance-measuring sensors arranged at positions on a downstream side of the second lightening and light-receiving device is on symmetrically both sides of the length of the transferring conveyer; and a controller which is connected to the first and second lightening and light-receiving devices, the door-closing devices, the sensors, and a driving source controller of the transferring conveyer.

Abstract translation: 一种用于车辆的门关闭检查装置包括：第一减光和光接收装置，其跨越成品车辆检查线中的转印输送机，该成品车辆检查线在被转移时检查成品车辆; 一对门关闭装置，其布置在所述第一减光和光接收装置的下游侧的位置处，并且对称地设置在所述传送输送器的长度的两侧; 第二减光和光接收装置，布置在所述门关闭装置的下游侧，跨越所述传送传送器; 布置在第二减光和光接收装置的下游侧的位置的一对门距测量传感器对称地位于传送输送机的长度的两侧; 以及连接到第一和第二减光和光接收装置，闭门装置，传感器和转印输送机的驱动源控制器的控制器。

公开(公告)号：US06399947B2

公开(公告)日：2002-06-04

申请号：US09734397

申请日：2000-12-11

Applicant: Hiroyuki Yagyu ,  Tomoaki Matsushima ,  Motoo Ikari ,  Yuji Takada ,  Ryo Taniguchi ,  Makoto Nishimura ,  Nobuyuki Miyagawa ,  Masato Kawashima

Inventor： Hiroyuki Yagyu ,  Tomoaki Matsushima ,  Motoo Ikari ,  Yuji Takada ,  Ryo Taniguchi ,  Makoto Nishimura ,  Nobuyuki Miyagawa ,  Masato Kawashima

IPC: G01J102

CPC classification number: G01J5/34

Abstract: An infrared ray receiving element includes a substrate made of a pyroelectric material and having at least one cantilever portion surrounded by a slit, in which at least a part of the cantilever portion in the substrate is uniformly polarized in the same direction and the remainder in the substrate includes a portion polarized at random. At least a pair of electrodes are respectively provided on a top surface and a bottom surface of the cantilever portion.

Abstract translation: 一种红外线接收元件包括由热电材料制成的基片，并具有被狭缝包围的至少一个悬臂部分，其中基片中的悬臂部分的至少一部分在同一方向上均匀偏振，其余部分在 衬底包括随机偏振的部分。 至少一对电极分别设置在悬臂部分的顶表面和底表面上。

公开(公告)号：USD623546S1

公开(公告)日：2010-09-14

申请号：US29352543

申请日：2009-12-22

Applicant: Takayuki Nishikawa ,  Yoshiaki Honda ,  Tomohiro Kamitsu ,  Sadayuki Sumi ,  Ryo Taniguchi

Designer： Takayuki Nishikawa ,  Yoshiaki Honda ,  Tomohiro Kamitsu ,  Sadayuki Sumi ,  Ryo Taniguchi

公开(公告)号：US07671335B2

公开(公告)日：2010-03-02

申请号：US11883361

申请日：2006-11-08

Applicant: Takayuki Nishikawa ,  Sadayuki Sumi ,  Tomohiro Kamitsu ,  Ryo Taniguchi ,  Masaya Hirata ,  Shin Sato

Inventor： Takayuki Nishikawa ,  Sadayuki Sumi ,  Tomohiro Kamitsu ,  Ryo Taniguchi ,  Masaya Hirata ,  Shin Sato

IPC: G01J5/20

CPC classification number: H01L31/0203 ,  G01J1/02 ,  G01J1/0204 ,  G01J2001/0276 ,  H05K1/0218 ,  H05K1/185

Abstract: An infrared detector includes a circuit block carrying an infrared sensor element and electronic components. The circuit block is composed of a dielectric resin layer and a first substrate formed with a circuit pattern and mounting the electronic components. The dielectric resin layer is formed in its top with a recess which defines around its periphery with a shoulder for supporting opposite ends of the infrared sensor. The first substrate is integrated to the lower end of the dielectric resin layer with at least one of the electronic components being molded into the dielectric resin layer to make the circuit block of a unified mold structure. Thus, a part or all of the electronic components are molded into the dielectric layer to realize the circuit block of a simple and low profile structure, while retaining an advantage of keeping the infrared sensor element sufficiently away from the electronic components and an associated electronic circuit, thereby assuring to give the infrared detector which is simple in construction, economical in cost, and reliable in the infrared detection.

Abstract translation: 红外线检测器包括一个载有红外传感器元件和电子部件的电路块。 电路块由介电树脂层和形成有电路图案的第一基板和安装电子部件组成。 电介质树脂层在其顶部形成有凹部，凹部围绕其周边限定有用于支撑红外传感器的相对端的肩部。 将第一衬底集成到电介质树脂层的下端，其中至少一个电子部件被模制到电介质树脂层中，以使电路块具有统一的模具结构。 因此，将一部分或全部电子部件模制到电介质层中以实现简单和低轮廓结构的电路块，同时保持将红外传感器元件充分远离电子部件和相关电子电路的优点 从而确保得到结构简单，成本经济，红外检测可靠的红外检测器。

公开(公告)号：US20080111087A1

公开(公告)日：2008-05-15

申请号：US11883361

申请日：2006-11-08

Applicant: Takayuki Nishikawa ,  Sadayuki Sumi ,  Tomohiro Kamitsu ,  Ryo Taniguchi ,  Masaya Hirata ,  Shin Sato

Inventor： Takayuki Nishikawa ,  Sadayuki Sumi ,  Tomohiro Kamitsu ,  Ryo Taniguchi ,  Masaya Hirata ,  Shin Sato

IPC: G21G5/00

CPC classification number: H01L31/0203 ,  G01J1/02 ,  G01J1/0204 ,  G01J2001/0276 ,  H05K1/0218 ,  H05K1/185

Abstract: An infrared detector includes a circuit block carrying an infrared sensor element and electronic components. The circuit block is composed of a dielectric resin layer and a first substrate formed with a circuit pattern and mounting the electronic components. The dielectric resin layer is formed in its top with a recess which defines around its periphery with a shoulder for supporting opposite ends of the infrared sensor. The first substrate is integrated to the lower end of the dielectric resin layer with at least one of the electronic components being molded into the dielectric resin layer to make the circuit block of a unified mold structure. Thus, a part or all of the electronic components are molded into the dielectric layer to realize the circuit block of a simple and low profile structure, while retaining an advantage of keeping the infrared sensor element sufficiently away from the electronic components and an associated electronic circuit, thereby assuring to give the infrared detector which is simple in construction, economical in cost, and reliable in the infrared detection.

Abstract translation: 红外线检测器包括一个载有红外传感器元件和电子部件的电路块。 电路块由介电树脂层和形成有电路图案的第一基板和安装电子部件组成。 电介质树脂层在其顶部形成有凹部，凹部围绕其周边限定有用于支撑红外传感器的相对端的肩部。 将第一衬底集成到电介质树脂层的下端，其中至少一个电子部件被模制到电介质树脂层中，以使电路块具有统一的模具结构。 因此，将一部分或全部电子部件模制到电介质层中以实现简单和低轮廓结构的电路块，同时保持将红外传感器元件充分远离电子部件和相关电子电路的优点 从而确保得到结构简单，成本经济，红外检测可靠的红外检测器。

公开(公告)号：US07157709B2

公开(公告)日：2007-01-02

申请号：US10484406

申请日：2003-06-24

Applicant: Ryo Taniguchi ,  Yuji Takada ,  Masahiro Kodoh ,  Masato Shinotani ,  Hisanobu Tanaka ,  Atsushi Hironaka

Inventor： Ryo Taniguchi ,  Yuji Takada ,  Masahiro Kodoh ,  Masato Shinotani ,  Hisanobu Tanaka ,  Atsushi Hironaka

IPC: G01J5/34

CPC classification number: G01J5/02 ,  G01J5/0205 ,  G01J5/04 ,  G01J5/045 ,  G01J5/34

Abstract: An infrared sensor package has a dielectric support which is molded from a plastic material to have a sensor mount for securing a pyroelectric element as well as an IC mount for securing an IC chip that processes a signal from the pyroelectric element. The support is molded over to be integral with metal parts. The metal parts include sensor conductors for interconnection of the pyroelectric element with the IC chip, and I/O conductors for interconnection of the IC chip with I/O pins. The sensor conductors as well as the I/O conductors are both molded into and integrally with the dielectric support.

Abstract translation: 红外传感器封装具有由塑料材料模制的电介质支架，以具有用于固定热电元件的传感器座以及用于固定处理来自热电元件的信号的IC芯片的IC安装座。 支撑件被模制成与金属部件一体。 金属部件包括用于将热电元件与IC芯片互连的传感器导体，以及IC芯片与I / O引脚相互连接的I / O导体。 传感器导体以及I / O导体都被模制成和与电介质支撑体一体。