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公开(公告)号：US20210288087A1
公开(公告)日：2021-09-16
申请号：US17264166
申请日：2019-07-29
Applicant: SILIOS TECHNOLOGIES
Inventor： Stephane TISSERAND , Laurent ROUX , Marc HUBERT , Vincent SAUGET
IPC: H01L27/146 , H04N5/378 , H04N5/33 , H04N5/357
Abstract: A hybrid multispectral imaging sensor, characterized in that it comprises a photosensitive backside-illumination detector (DET) that is made on a substrate (100) made of InP, and that is formed of a matrix of pixels (105, P1, P2, P3) that are themselves made in a structure based on InGaAs (103), and a filter module (MF) that is formed of a matrix of elementary filters (λ1, λ2, λ3) reproducing said matrix of pixels, and that is mounted into contact with said substrate (100), said substrate (100) made of InP having a thickness less than 50 μm, and preferably less than 30 μm.
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公开(公告)号：US11143554B2
公开(公告)日：2021-10-12
申请号：US16096996
申请日：2017-04-27
Applicant: SILIOS TECHNOLOGIES
Inventor： Stephane Tisserand , Laurent Roux , Marc Hubert , Vincent Sauget , Aurelien Faiola
Abstract: The invention relates to a multispectral imaging device including: a photosensitive detector DET made up of a matrix of pixels; an array of microlenses ML1, ML2, ML3 reproducing the matrix of pixels; and a filter module MF formed by a matrix of individual filters λ1, λ2, λ3 reproducing the matrix of pixels. The device is remarkable in that the array of microlenses is arranged directly in contact with the detector DET, and the filter module MF is made on a substrate SS that is put into contact with the array of microlenses.
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公开(公告)号：US20190145823A1
公开(公告)日：2019-05-16
申请号：US16096996
申请日：2017-04-27
Applicant: SILIOS TECHNOLOGIES
Inventor： Stephane TISSERAND , Laurent ROUX , Marc HUBERT , Vincent SAUGET , Aurélien FAIOLA
Abstract: The invention relates to a multispectral imaging device including: a photosensitive detector DET made up of a matrix of pixels; an array of microlenses ML1, ML2, ML3 reproducing the matrix of pixels; and a filter module MF formed by a matrix of individual filters λ1, λ2, λ3 reproducing the matrix of pixels. The device is remarkable in that the array of microlenses is arranged directly in contact with the detector DET, and the filter module MF is made on a substrate SS that is put into contact with the array of microlenses.
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Patent Agency Ranking
4.发明申请公开(公告)号：US20160103019A1
公开(公告)日：2016-04-14
申请号：US14833672
申请日：2015-08-24
Applicant: SILIOS TECHNOLOGIES
Inventor： Stephane TISSERAND , Marc HUBERT , Laurent ROUX
CPC classification number: G01J3/26 , G01J3/02 , G01J3/0256 , G01J3/10 , G01J3/45
Abstract: A wavelength spectroscopy device includes, on a substrate, a filter cell CF constituted by two mirrors separated by a spacer membrane, the filter cell being made up of a plurality of interference filters. Furthermore, the device also includes an emission cell CE having a plurality of emission sources, each of the sources being associated with one of the interference filters.
Abstract translation: 波长分析装置在基板上包括由间隔膜隔开的两个反射镜构成的滤波电池CF，滤波电池由多个干涉滤波器构成。 此外，该装置还包括具有多个发射源的发射单元CE，每个源与干涉滤波器之一相关联。
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公开(公告)号：US20240102861A1
公开(公告)日：2024-03-28
申请号：US18039052
申请日：2021-11-18
Applicant: SILIOS TECHNOLOGIES
Inventor： Stéphane TISSERAND , Laurent ROUX
CPC classification number: G01J3/2823 , G01J3/26 , G01J2003/1239
Abstract: Disclosed is a multispectral imager designed for analyzing a spectral domain of interest, comprising an image sensor (100) formed of an array of macropixels and comprising a first and a second photosensitive pixel (115) respectively dedicated to a first and a second spectral band, and a filtering structure (150) comprising a first and second interference filter (160) which are superimposed respectively on the first and second photosensitive pixel (115) and which are arranged to respectively transmit a first and second electromagnetic radiation belonging respectively to the first and second spectral bands, the multispectral imager in which a wavelength half of that of the second electromagnetic radiation is located in the spectral domain of interest, and a filtering layer (170) is superimposed on the second photosensitive pixel (160) and configured to block the passage of a third electromagnetic radiation of wavelength half that of the second electromagnetic radiation.
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公开(公告)号：US11199446B2
公开(公告)日：2021-12-14
申请号：US16305673
申请日：2017-05-30
Applicant: SILIOS TECHNOLOGIES
Inventor： Stéphane Tisserand , Laurent Roux , Marc Hubert , Vincent Sauget , Aurélien Faiola
Abstract: A method of limiting cross-talk in an imaging sensor, the sensor being in the form of a matrix of macropixels defining an image, each macropixel being formed by a matrix of individual pixels, each of which is dedicated to a distinct spectral band, all of the individual pixels dedicated to the same spectral band forming a sub-image, the image being topologically subdivided into at least one parcel, and the method including the following steps: measuring the spectral response of each individual pixel λ1, λ2, λ3, . . . , λ9; calculating the mean spectral response of each sub-image in a parcel; targeting to define the ideal response of each sub-image in the parcel; estimating a series of coefficients for minimizing cross-talk in the parcel; and applying the coefficients to the macropixels in order to correct the sub-images in the parcel. The method is remarkable in that the ideal response is a Gaussian function.
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公开(公告)号：US11862658B2
公开(公告)日：2024-01-02
申请号：US17264166
申请日：2019-07-29
Applicant: SILIOS TECHNOLOGIES
Inventor： Stephane Tisserand , Laurent Roux , Marc Hubert , Vincent Sauget
IPC: H01L27/146 , H04N25/75 , H04N25/60 , H04N23/11
CPC classification number: H01L27/1464 , H01L27/1465 , H01L27/14634 , H04N23/11 , H04N25/60 , H04N25/75
Abstract: A hybrid multispectral imaging sensor, characterized in that it comprises a photosensitive backside-illumination detector (DET) that is made on a substrate (100) made of InP, and that is formed of a matrix of pixels (105, P1, P2, P3) that are themselves made in a structure based on InGaAs (103), and a filter module (MF) that is formed of a matrix of elementary filters (λ1, λ2, λ3) reproducing said matrix of pixels, and that is mounted into contact with said substrate (100), said substrate (100) made of InP having a thickness less than 50 μm, and preferably less than 30 μm.
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公开(公告)号：US20200326235A1
公开(公告)日：2020-10-15
申请号：US16305673
申请日：2017-05-30
Applicant: SILIOS TECHNOLOGIES
Inventor： Stephane TISSERAND , Laurent ROUX , Marc HUBERT , Vincent SAUGET , Aurelien FAIOLA
Abstract: A method of limiting cross-talk in an imaging sensor, the sensor being in the form of a matrix of macropixels defining an image, each macropixel being formed by a matrix of individual pixels, each of which is dedicated to a distinct spectral band, all of the individual pixels dedicated to the same spectral band forming a sub-image, the image being topologically subdivided into at least one parcel, and the method including the following steps: measuring the spectral response of each individual pixel λ1, λ2, λ3, . . . , λ9; calculating the mean spectral response of each sub-image in a parcel; targeting to define the ideal response of each sub-image in the parcel; estimating a series of coefficients for minimizing cross-talk in the parcel; and applying the coefficients to the macropixels in order to correct the sub-images in the parcel. The method is remarkable in that the ideal response is a Gaussian function.
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