公开(公告)号：US09978656B2

公开(公告)日：2018-05-22

申请号：US13406270

申请日：2012-02-27

Applicant: Tsung-Shu Lin ,  Han-Ping Pu ,  Ming-Da Cheng ,  Chang-Chia Huang ,  Hao-Juin Liu

Inventor： Tsung-Shu Lin ,  Han-Ping Pu ,  Ming-Da Cheng ,  Chang-Chia Huang ,  Hao-Juin Liu

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/293 ,  H01L21/568 ,  H01L23/3157 ,  H01L24/02 ,  H01L24/03 ,  H01L24/04 ,  H01L24/05 ,  H01L24/06 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1181 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16237 ,  H01L2224/73104 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81416 ,  H01L2224/81439 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/206 ,  H01L2924/207 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

Abstract: The mechanisms of forming a copper post structures described enable formation of copper post structures on a flat conductive surface. In addition, the copper post structures are supported by a molding layer with a Young's modulus (or a harder material) higher than polyimide. The copper post structures formed greatly reduce the risk of cracking of passivation layer and delamination of at the dielectric interface surrounding the copper post structures.

公开(公告)号：US09887144B2

公开(公告)日：2018-02-06

申请号：US13227983

申请日：2011-09-08

Applicant: Wen-Yi Lin ,  Yu-Chih Liu ,  Ming-Chih Yew ,  Tsung-Shu Lin ,  Bor-Rung Su ,  Jing Ruei Lu ,  Wei-Ting Lin

Inventor： Wen-Yi Lin ,  Yu-Chih Liu ,  Ming-Chih Yew ,  Tsung-Shu Lin ,  Bor-Rung Su ,  Jing Ruei Lu ,  Wei-Ting Lin

IPC: H01L23/10 ,  H01L23/16 ,  H01L23/36 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/10 ,  H01L21/563 ,  H01L23/16 ,  H01L23/36 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29099 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner.

公开(公告)号：US09548283B2

公开(公告)日：2017-01-17

申请号：US13542528

申请日：2012-07-05

Applicant: Tsung-Shu Lin ,  Hung-Jui Kuo ,  Yi-Wen Wu

Inventor： Tsung-Shu Lin ,  Hung-Jui Kuo ,  Yi-Wen Wu

IPC: H01L29/49 ,  H01L23/00 ,  H01L23/538 ,  H01L25/10 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L24/73 ,  H01L23/3121 ,  H01L23/5389 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A package-on-package (PoP) device comprises a bottom package on a substrate and a first set of conductive elements coupling the bottom package and the substrate. The PoP device further comprises a top package over the bottom package and a redistribution layer coupling the top package to the substrate. A method of forming a PoP device comprises coupling a first package to a substrate; and forming a redistribution layer over the first package and a top surface of the substrate. The method further comprises coupling a second package to the redistribution layer, wherein the redistribution layer couples the second package to the substrate.

Abstract translation: 封装封装（PoP）器件包括在衬底上的底部封装和耦合底部封装和衬底的第一组导电元件。 PoP器件还包括在底部封装上的顶部封装以及将顶部封装耦合到衬底的再分配层。 形成PoP器件的方法包括将第一封装耦合到衬底; 以及在所述第一封装和所述衬底的顶表面上形成再分布层。 该方法还包括将第二包装物耦合到再分配层，其中再分配层将第二包装物耦合到基底。

公开(公告)号：US09214192B2

公开(公告)日：2015-12-15

申请号：US11495255

申请日：2006-07-28

Applicant: Shu Lin ,  Donald Henry Willis ,  Mark Alan Schultz

Inventor： Shu Lin ,  Donald Henry Willis ,  Mark Alan Schultz

IPC: H04N9/80 ,  G11B27/30 ,  G11B27/034 ,  G11B27/32 ,  G11B27/34 ,  G11B27/36

CPC classification number: G11B27/3027 ,  G11B27/034 ,  G11B27/309 ,  G11B27/329 ,  G11B27/34 ,  G11B27/36 ,  G11B2220/213 ,  G11B2220/216 ,  G11B2220/2562

Abstract: A video processing system adaptively generates and processes volume/file structure and navigation data of different data format and converts data between different formats for decoding, recording and other applications. The system processes the volume/file structure and navigation data in distinct modes including (a) pre-processing, (b) contemporaneous and (c) post-processing modes. In addition, the system provides navigation information supporting navigation through different images of one or more video programs by parsing encoded packetized data representative of a sequence of individual images to determine parameters to support navigation through the sequence of individual images. The determined parameters are formatted into a predetermined data structure and incorporated into a pre-formed navigation data field.

Abstract translation: 视频处理系统自适应地生成和处理不同数据格式的音量/文件结构和导航数据，并且在不同格式之间转换数据以进行解码，记录和其他应用。 系统以不同的模式处理音量/文件结构和导航数据，包括（a）预处理，（b）同时期和（c）后处理模式。 此外，该系统提供导航信息，以支持通过一个或多个视频节目的不同图像导航，通过解析表示单个图像序列的编码分组化数据来确定参数以支持通过单独图像序列的导航。 所确定的参数被格式化为预定的数据结构，并且被合并到预先形成的导航数据字段中。

公开(公告)号：US20150090139A1

公开(公告)日：2015-04-02

申请号：US14042678

申请日：2013-09-30

Applicant: YAN-SHU LIN

Inventor： YAN-SHU LIN

IPC: B44C1/24

CPC classification number: B44C1/24 ,  B41F16/0013 ,  B41F16/0033 ,  B41M1/14

Abstract: Disclosed is a collinear printing method with roller-type upfront gold-stamping, matting and snowflake printed patterns and a printed product manufactured by the method. In a roller-type seven-color automatic printing machine, an adhesive glue is filled into a first printing ink set, and a second printing ink set is modified to be a cold stamping device and mounted with a drum-shaped foil, and the middle section of each printing ink set is filled with printing inks of different desired colors, and the last printing ink set is filled with a repulsive paint and a gold paint. In a printing manufacturing process, a printed matter is processed by a partial cold stamping operation, each of the expected color printing operations is completed in a same-line procedure, the last printing ink set coats the repulsive paint and the gold paint onto the printed matter, and a ground or snowflake pattern is printed onto the printed matter in the same-line according to the mesh size of a mesh ink roller of the gold paint.

Abstract translation: 公开了一种具有辊式前期金印，消光和雪花印刷图案的共线印刷方法以及通过该方法制造的印刷产品。 在辊式七色自动印刷机中，将胶粘剂填充到第一印刷油墨组中，并且将第二印刷油墨组改性为冷冲压装置并安装有鼓形箔，并且中间 每个印刷油墨组的部分填充有不同所需颜色的印刷油墨，并且最后一个印刷油墨组填充有排斥油漆和金漆。 在印刷制造过程中，通过部分冷冲压操作处理印刷品，预期的彩色印刷操作以相同的程序完成，最后的印刷油墨组将排斥涂料和金漆涂覆到印刷 物质，并且根据金漆的网眼油墨辊的网格尺寸，在同一行上将印刷物或地面或雪花图案印刷到印刷品上。

公开(公告)号：US08976529B2

公开(公告)日：2015-03-10

申请号：US13007249

申请日：2011-01-14

Applicant: Wen-Yi Lin ,  Po-Yao Lin ,  Tsung-Shu Lin ,  Kuo-Chin Chang ,  Shou-Yi Wang

Inventor： Wen-Yi Lin ,  Po-Yao Lin ,  Tsung-Shu Lin ,  Kuo-Chin Chang ,  Shou-Yi Wang

IPC: H05K7/20 ,  H01L23/16 ,  H01L23/055 ,  H01L23/00

CPC classification number: H01L23/16 ,  H01L23/055 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00

Abstract: In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening.

Abstract translation: 在包装结构中，加强环在第一包装部件的顶表面上结合并结合。 第二包装部件在第一包装部件的顶部表面上结合并且被加强环环绕。 金属盖已经结合到加强环上。 金属盖具有通孔。

公开(公告)号：US20130256874A1

公开(公告)日：2013-10-03

申请号：US13559840

申请日：2012-07-27

Applicant: Yen-Liang Lin ,  Chen-Shien Chen ,  Tin-Hao Kuo ,  Sheng-Yu Wu ,  Tsung-Shu Lin ,  Chang-Chia Huang

Inventor： Yen-Liang Lin ,  Chen-Shien Chen ,  Tin-Hao Kuo ,  Sheng-Yu Wu ,  Tsung-Shu Lin ,  Chang-Chia Huang

IPC: H01L23/498

CPC classification number: H01L23/3192 ,  H01L23/293 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05005 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05541 ,  H01L2224/05555 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/13012 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/206 ,  H01L2924/01047

Abstract: A device includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. The passivation layer has a first opening overlapping the metal pad, wherein the first opening has a first lateral dimension measured in a direction parallel to a major surface of the substrate. A polymer layer is over the passivation layer and covering the edge portions of the metal pad. The polymer layer has a second opening overlapping the metal pad. The second opening has a second lateral dimension measured in the direction. The first lateral dimension is greater than the second lateral dimension by more than about 7 μm. A Under-Bump metallurgy (UBM) includes a first portion in the second opening, and a second portion overlying portions of the polymer layer.

Abstract translation: 一种器件包括衬底，衬底上的金属焊盘以及覆盖金属焊盘的边缘部分的钝化层。 钝化层具有与金属焊盘重叠的第一开口，其中第一开口具有在平行于衬底的主表面的方向上测量的第一横向尺寸。 聚合物层在钝化层上方并覆盖金属焊盘的边缘部分。 聚合物层具有与金属垫重叠的第二开口。 第二开口具有在该方向上测量的第二横向尺寸。 第一横向尺寸大于第二横向尺寸大于约7μm。 下冲击冶金（UBM）包括第二开口中的第一部分和覆盖聚合物层部分的第二部分。

公开(公告)号：US08486790B2

公开(公告)日：2013-07-16

申请号：US13184572

申请日：2011-07-18

Applicant: Po-Cheng Huang ,  Kuo-Chih Lai ,  Ching-I Li ,  Yu-Shu Lin ,  Ya-Jyuan Hung ,  Yen-Liang Lu ,  Yu-Wen Wang ,  Hsin-Chih Yu

Inventor： Po-Cheng Huang ,  Kuo-Chih Lai ,  Ching-I Li ,  Yu-Shu Lin ,  Ya-Jyuan Hung ,  Yen-Liang Lu ,  Yu-Wen Wang ,  Hsin-Chih Yu

IPC: H01L21/336

CPC classification number: H01L29/66545 ,  H01L29/4966 ,  H01L29/51 ,  H01L29/6659 ,  H01L29/66606 ,  H01L29/7833

Abstract: A manufacturing method for a metal gate includes providing a substrate having a dielectric layer and a polysilicon layer formed thereon, the polysilicon layer, forming a protecting layer on the polysilicon layer, forming a patterned hard mask on the protecting layer, performing a first etching process to etch the protecting layer and the polysilicon layer to form a dummy gate having a first height on the substrate, forming a multilayered dielectric structure covering the patterned hard mask and the dummy gate, removing the dummy gate to form a gate trench on the substrate, and forming a metal gate having a second height in the gate trench. The second height of the metal gate is substantially equal to the first height of the dummy gate.

Abstract translation: 金属栅极的制造方法包括提供具有形成在其上的电介质层和多晶硅层的基板，多晶硅层，在多晶硅层上形成保护层，在保护层上形成图案化的硬掩模，进行第一蚀刻工艺 蚀刻保护层和多晶硅层，以在衬底上形成具有第一高度的虚拟栅极，形成覆盖图案化硬掩模和伪栅极的多层介电结构，去除伪栅极以在衬底上形成栅极沟槽， 以及在所述栅极沟槽中形成具有第二高度的金属栅极。 金属栅极的第二高度基本上等于虚拟栅极的第一高度。

公开(公告)号：US08444793B2

公开(公告)日：2013-05-21

申请号：US12701615

申请日：2010-02-08

Applicant: Hsin-Chang Hsiung ,  Shu-Lin Ho

Inventor： Hsin-Chang Hsiung ,  Shu-Lin Ho

IPC: B29C73/04 ,  B29C65/54 ,  B29C63/22 ,  B32B37/06 ,  B32B37/12 ,  B32B38/10 ,  B32B43/00 ,  C08J5/12

CPC classification number: B32B38/1841 ,  B32B37/1284 ,  B32B2037/268 ,  B32B2307/542 ,  B32B2309/105 ,  B32B2457/14 ,  Y10T156/11 ,  Y10T156/1153 ,  Y10T428/31515

Abstract: The present invention provides a semiconductor device and a fabricating method thereof. The fabricating method comprises: providing a first substrate; forming a soft dry film having an adhesive film and a release film; sticking the soft dry film on the first substrate with the adhesive film; removing the release film; sticking a second substrate on the adhesive film; and heating the adhesive film to solidify the adhesive film to form a solid adhesive film. The semiconductor device comprises: a first substrate, a solid adhesive film, and a second substrate. The solid adhesive film is formed on the first substrate, and the second substrate is formed on the solid adhesive film.

Abstract translation: 本发明提供一种半导体器件及其制造方法。 制造方法包括：提供第一基板; 形成具有粘合膜和脱模膜的软干膜; 用粘合膜将柔软干膜粘在第一基片上; 去除脱模膜; 在粘合膜上粘贴第二衬底; 并加热粘合剂膜以固化粘合剂膜以形成固体粘合剂膜。 半导体器件包括：第一衬底，固体粘合膜和第二衬底。 固体粘合膜形成在第一基板上，第二基板形成在固体粘合膜上。

公开(公告)号：US20120217632A1

公开(公告)日：2012-08-30

申请号：US13035586

申请日：2011-02-25

Applicant: Yu-Feng Chen ,  Yuh Chern Shieh ,  Tsung-Shu Lin ,  Han-Ping Pu ,  Jiun Yi Wu ,  Tin-Hao Kuo

Inventor： Yu-Feng Chen ,  Yuh Chern Shieh ,  Tsung-Shu Lin ,  Han-Ping Pu ,  Jiun Yi Wu ,  Tin-Hao Kuo

IPC: H01L23/498

CPC classification number: H01L24/16 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/17 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16013 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A device includes a work piece, and a metal trace on a surface of the work piece. A Bump-on-Trace (BOT) is formed at the surface of the work piece. The BOT structure includes a metal bump, and a solder bump bonding the metal bump to a portion of the metal trace. The metal trace includes a metal trace extension not covered by the solder bump.

Abstract translation: 一种装置包括工件和工件表面上的金属迹线。 在工件的表面形成凸起跟踪（BOT）。 BOT结构包括金属凸块和将金属凸块接合到金属迹线的一部分的焊料凸块。 金属迹线包括未被焊料凸块覆盖的金属迹线延伸。