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公开(公告)号：US11060929B2
公开(公告)日：2021-07-13
申请号：US16724166
申请日：2019-12-20
Applicant: Silicon Microstructures, Inc.
Inventor： Keyanoush Razavidinani , Gertjan van Sprakelaar , Chris Wagner
IPC: G01L1/22
Abstract: Pressure sensor systems and methods of assembling pressure sensor systems that reduce the need for accurate placement of a pressure sensor die in a pressure sensor package, reduce leakage in pressure sensor systems, and provides a consistent attachment of a pressure sensor die to a package.
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公开(公告)号：US20160178467A1
公开(公告)日：2016-06-23
申请号：US15040899
申请日：2016-02-10
Applicant: Silicon Microstructures, Inc.
Inventor： Steve Terry , Fernando Alfaro , Marc Konradt
CPC classification number: G01L9/0048 , B81B7/0016 , B81B7/0029 , B81B2201/0264 , B81B2203/0127 , G01L9/0042 , G01L9/0047 , G01L9/0051 , G01L9/0055 , G01L19/0092
Abstract: Structures and methods of protecting membranes on pressure sensors. One example may provide a pressure sensor having a backside cavity defining a frame and under a membrane formed in a device layer. The sensor may further include a cap joined to the device layer by a bonding layer. A recess for a reference cavity may be formed in one or more of the cap, bonding layer, and membrane or other device layer portion. The recess may have a width that is narrower than a width of the backside cavity in at least one direction. A eutectically bondable metal stack may be provided on a bottom side of the sensor. Conductive traces in the sensor may be formed by implanting and annealing ions. An implanted field shield may be formed to protect the conductive traces that form sense elements. Damage prevention circuitry and a temperature sensing diode may also be provided.
Abstract translation: 在压力传感器上保护膜的结构和方法。 一个示例可以提供一种压力传感器，该压力传感器具有限定框架的背侧空腔以及在器件层中形成的膜下方。 传感器还可以包括通过粘合层连接到器件层的盖。 用于参考空腔的凹槽可以形成在帽，粘合层，膜或其它器件层部分中的一个或多个中。 所述凹部的宽度可以在至少一个方向上比所述背侧腔的宽度窄。 可以在传感器的底侧设置可共熔的金属叠层。 传感器中的导电迹线可以通过植入和退火离子形成。 可以形成植入场屏蔽以保护形成感测元件的导电迹线。 还可以提供防损伤电路和温度感测二极管。
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公开(公告)号：US11604110B2
公开(公告)日：2023-03-14
申请号：US16734229
申请日：2020-01-03
Applicant: Silicon Microstructures, Inc.
Inventor： Chris Wagner
Abstract: Pressure sensor systems that include a pressure sensor die and other components in a small, space-efficient package, where the package allow gas or liquid to reach either or both sides of a membranes of the pressure sensor die. A package can include a substrate and a cap, where either or both the substrate and the cap divide the package internally into two chambers. The substrate can have a solid bottom layer, a middle layer having a slot or path running a portion of the length of the layer, and a top layer having two through-holes that provide access to the slot or path. The cap can have two ports. A first port can lead to a first chamber where a top side of a pressure sensor is in the first chamber. A second port can lead to a second chamber and the slot or path, where the slot or path leads to a bottom side of the pressure sensor.
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公开(公告)号：US11454561B2
公开(公告)日：2022-09-27
申请号：US16513561
申请日：2019-07-16
Applicant: Silicon Microstructures, Inc.
Inventor： Armin Jamali
IPC: G01L7/18
Abstract: Contact-force-sensing systems that can provide additional information about the forces that are applied by catheters and other devices to cell walls and other surfaces. One example can provide directional information for a contact-force-sensing system. For example, magnitude, plane angle, and off-plane angle information can be provided by a contact-force-sensing system. Another example can provide guiding functionality for a contact-force-sensing system. For example, a contact-force-sensing system can provide tactile response to a surgeon or operator to allow a device to be accurately guided though a body.
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公开(公告)号：US10655989B2
公开(公告)日：2020-05-19
申请号：US16129355
申请日：2018-09-12
Applicant: Silicon Microstructures, Inc.
Inventor： Holger Doering , Omar Abed
Abstract: Pressure sensors that may be used in flowrate monitoring or measuring systems, where the pressure sensors may enable simple, low-cost designs that are readily implemented. One example may provide a pressure sensor having a built-in flow path with a dimensional variation. Pressures of a fluid on each side of the dimensional variation may be compared to each other. The measured differential pressure may then be converted to a flowrate through the flow path.
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Patent Agency Ranking
公开(公告)号：US10041851B2
公开(公告)日：2018-08-07
申请号：US15227370
申请日：2016-08-03
Applicant: Silicon Microstructures, Inc.
Inventor： Holger Doering , Stephen C. Terry , Justin Gaynor , Omar Abed , Fernando Alfaro
Abstract: Pressure sensors and their methods of manufacturing, where the pressure sensors have a small, thin form factor and may include features designed to improve manufacturability and where the method of manufacturing may improve yield and reduce overall costs.
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公开(公告)号：US20150316436A1
公开(公告)日：2015-11-05
申请号：US14269052
申请日：2014-05-02
Applicant: Silicon Microstructures, Inc.
Inventor： Holger Doering
IPC: G01L9/00
CPC classification number: G01L9/0047 , G01L9/0051 , G01L19/0618
Abstract: Pressure sensors having vertical diaphragms or membranes. A vertical diaphragm may be located in a first silicon wafer between a first and second cavity, where the first and second cavities are covered by a second silicon wafer. One or more active or passive devices or components may be located on a top of the vertical diaphragm.
Abstract translation: 压力传感器具有垂直隔膜或隔膜。 垂直隔膜可以位于第一和第二空腔之间的第一硅晶片中，其中第一和第二空腔被第二硅晶片覆盖。 一个或多个有源或无源器件或部件可以位于垂直隔膜的顶部上。
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公开(公告)号：US20150143926A1
公开(公告)日：2015-05-28
申请号：US14088397
申请日：2013-11-23
Applicant: Silicon Microstructures, Inc.
Inventor： Holger Doering
CPC classification number: H01L21/52 , G01L9/0054 , G01L19/146 , H01L2224/48091 , H01L2924/10158 , H01L2924/00014
Abstract: Circuits, methods, and apparatus that provide pressure sensing devices having a pressure sensor including a diaphragm supported by a frame. The pressure sensor may be mounted on an application-specific integrated circuit. A passage may extend through the application-specific integrated circuit from its underside to its topside where it may terminate in a cavity formed under the diaphragm. Circuit components may be formed in the second wafer portion and located in areas that are not under the first wafer portion. Circuit components may be formed in the second wafer in areas under the first wafer portion, such as under the frame or under the diaphragm. Circuit components may be formed in the second wafer such that they are partially under the first wafer portion, or partially under the frame or partially under the diaphragm.
Abstract translation: 提供压力传感装置的电路，方法和装置，其具有包括由框架支撑的隔膜的压力传感器。 压力传感器可以安装在专用集成电路上。 通道可以从专用集成电路的下侧延伸到其顶侧，其可以终止在形成在隔膜下方的空腔中。 电路部件可以形成在第二晶片部分中并且位于不在第一晶片部分下方的区域中。 电路部件可以在第一晶片部分下方的区域中形成在第二晶片中，例如在框架下或隔膜下方。 电路组件可以形成在第二晶片中，使得它们部分地位于第一晶片部分下方，或部分地位于框架下方或部分地位于隔膜下方。
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公开(公告)号：US11268839B2
公开(公告)日：2022-03-08
申请号：US16734359
申请日：2020-01-05
Applicant: Silicon Microstructures, Inc.
Inventor： Omar Abed , Gertjan van Sprakelaar , Justin Gaynor
Abstract: Reliable flow sensors with enclosures that have predictable thermal variations and reduced mechanical tolerances for a more consistent fluid flow and more consistent flow measurements. Thermal variations can be made predictable by using etched structures in silicon blocks. Mechanical tolerances can be reduced using lithography and high-precision semiconductor manufacturing equipment and techniques.
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公开(公告)号：US20190078914A1
公开(公告)日：2019-03-14
申请号：US16129355
申请日：2018-09-12
Applicant: Silicon Microstructures, Inc.
Inventor： Holger Doering , Omar Abed
Abstract: Pressure sensors that may be used in flowrate monitoring or measuring systems, where the pressure sensors may enable simple, low-cost designs that are readily implemented. One example may provide a pressure sensor having a built-in flow path with a dimensional variation. Pressures of a fluid on each side of the dimensional variation may be compared to each other. The measured differential pressure may then be converted to a flowrate through the flow path.
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