公开(公告)号：US08824152B2

公开(公告)日：2014-09-02

申请号：US13533058

申请日：2012-06-26

Applicant: Chao Chen ,  Tim Kyowski ,  Jason Griffin

Inventor： Chao Chen ,  Tim Kyowski ,  Jason Griffin

IPC: H05K5/00 ,  H04M1/02

CPC classification number: G06F1/1637 ,  H04M1/0266 ,  H05K7/1427

Abstract: The disclosure describes a cover for a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The cover comprises: a surface to cover a bottom of the display device and to be located on top of a frame section of a frame that is mounted on the PCB and surrounds a surface device on the PCB; a raised region in the surface to allow a part of the surface device to jut above the frame section; and a depressed region in the surface to receive a feature on a bottom of the display device to allow the feature to extend into an interior cavity bounded by the frame section.

Abstract translation: 本公开描述了一种用于将设备安装在电子设备中的印刷电路板（PCB）上方的框架的盖。 所述盖包括：覆盖所述显示装置的底部并且位于安装在所述PCB上且围绕所述PCB上的表面装置的框架的框架部分的顶部上的表面; 表面中的凸起区域，以允许表面装置的一部分突出在框架部分上方; 以及在所述表面中的凹陷区域以接收所述显示装置的底部上的特征，以允许所述特征延伸到由所述框架部分限定的内部空腔中。

公开(公告)号：US08233282B2

公开(公告)日：2012-07-31

申请号：US12049854

申请日：2008-03-17

Applicant: Chao Chen ,  Tim Kyowski ,  Jason Griffin

Inventor： Chao Chen ,  Tim Kyowski ,  Jason Griffin

IPC: H05K7/00

CPC classification number: G06F1/1637 ,  H04M1/0266 ,  H05K7/1427

Abstract: The disclosure describes a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The frame comprises: a frame section formed to be located on the PCB about a surface device on a section of the PCB; and a cover for placement on top of the frame section and for providing a support substrate for the device. In the frame, the frame section is securable to the PCB above at least a part of the surface device; the cover is locatable on the frame section with the device mounted to the cover; and the cover is shaped to allow a feature on the bottom of the device to extend downward towards an interior cavity of the frame.

Abstract translation: 本公开描述了一种用于将设备安装在电子设备中的印刷电路板（PCB）上方的框架。 框架包括：框架部分，其形成为围绕PCB的一部分上的表面装置定位在PCB上; 以及用于放置在框架部分的顶部上并用于为该装置提供支撑基板的盖。 在框架中，框架部分可以在表面装置的至少一部分上方安装到PCB上; 该盖可定位在框架部分上，该装置安装在该盖上; 并且盖被成形为允许装置的底部上的特征向下延伸到框架的内部空腔。

公开(公告)号：US20120268903A1

公开(公告)日：2012-10-25

申请号：US13533058

申请日：2012-06-26

Applicant: Chao Chen ,  Tim Kyowski ,  Jason Griffin

Inventor： Chao Chen ,  Tim Kyowski ,  Jason Griffin

IPC: H05K7/00

CPC classification number: G06F1/1637 ,  H04M1/0266 ,  H05K7/1427

Abstract: The disclosure describes a cover for a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The cover comprises: a surface to cover a bottom of the display device and to be located on top of a frame section of a frame that is mounted on the PCB and surrounds a surface device on the PCB; a raised region in the surface to allow a part of the surface device to jut above the frame section; and a depressed region in the surface to receive a feature on a bottom of the display device to allow the feature to extend into an interior cavity bounded by the frame section.

Abstract translation: 本公开描述了一种用于将设备安装在电子设备中的印刷电路板（PCB）上方的框架的盖。 所述盖包括：覆盖所述显示装置的底部并且位于安装在所述PCB上且围绕所述PCB上的表面装置的框架的框架部分的顶部上的表面; 表面中的凸起区域，以允许表面装置的一部分突出在框架部分上方; 以及在所述表面中的凹陷区域以接收所述显示装置的底部上的特征，以允许所述特征延伸到由所述框架部分限定的内部空腔中。

公开(公告)号：US07796398B2

公开(公告)日：2010-09-14

申请号：US12404705

申请日：2009-03-16

Applicant: Jason Everette Hamilton ,  Tim Kyowski

Inventor： Jason Everette Hamilton ,  Tim Kyowski

IPC: H05K7/00

CPC classification number: H05K7/1417 ,  H04M1/026 ,  H05K1/141 ,  H05K2201/10083 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10515 ,  Y10T29/49002

Abstract: The invention provides a system of components in an electronic device. The system comprises: a printed circuit board (PCB); a first component mounted to the PCB; a cap located about the first component, the cap having an arm extending outwardly from a body of the cap; a second component; and a platform for the second component.

Abstract translation: 本发明提供一种电子设备中的组件系统。 该系统包括：印刷电路板（PCB）; 安装在PCB上的第一个部件; 围绕第一部件设置的盖，帽具有从盖的主体向外延伸的臂; 第二个组成部分 和第二个组件的平台。

公开(公告)号：US20110096514A1

公开(公告)日：2011-04-28

申请号：US12832648

申请日：2010-07-08

Applicant: Jason Everette HAMILTON ,  Tim Kyowski

Inventor： Jason Everette HAMILTON ,  Tim Kyowski

IPC: H05K9/00 ,  H05K7/00 ,  H05K13/00

CPC classification number: H05K7/1417 ,  H04M1/026 ,  H05K1/141 ,  H05K2201/10083 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10515 ,  Y10T29/49002

Abstract: The disclosure provides a shield for a component in an electronic device. The shield comprises a cap for locating on the PCB about the first component, the cap having a first and a second arm extending outwardly from a body of the cap. For the shield, a platform is mountable on the cap to provide a top surface for mounting a second component thereon; and a connector is disposable on the PCB, located against the cap and the arm, the connector providing electrical connections between the PCB and the platform for the second component. The disclosure also provides a method of assembling components in an electronic device. The method comprises: assembling the cap on the PCB; and assembling the platform onto the cap without utilizing an external jig and utilizing alignment features provided on the cap and the platform, such that the platform is placed on top of the cap at a predetermined location about the cap defined by the alignment features.

Abstract translation: 本公开提供了电子设备中的部件的屏蔽。 屏蔽件包括用于围绕第一部件定位在PCB上的盖，帽具有从盖的主体向外延伸的第一和第二臂。 对于屏蔽，平台可安装在盖上以提供用于在其上安装第二部件的顶表面; 并且连接器在PCB上是一次性的，其位于盖和臂上，连接器提供PCB和用于第二部件的平台之间的电连接。 本公开还提供了一种在电子设备中组装组件的方法。 该方法包括：将盖组装在PCB上; 以及将所述平台组装到所述盖上而不利用外部夹具并且利用设置在所述盖和所述平台上的对准特征，使得所述平台在围绕由所述对准特征限定的所述盖的预定位置处放置在所述盖的顶部上。

公开(公告)号：US20060181841A1

公开(公告)日：2006-08-17

申请号：US11055083

申请日：2005-02-11

Applicant: Chao Chen ,  Tim Kyowski ,  Jason Griffin

Inventor： Chao Chen ,  Tim Kyowski ,  Jason Griffin

IPC: H05K5/00

CPC classification number: G06F1/1637 ,  H04M1/0266 ,  H05K7/1427

Abstract: The invention provides a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The frame comprises: a frame section formed to be located on the PCB about a surface device on a section of the PCB; and a cover for placement on top of the frame section and for providing a support substrate for the device. In the frame, the frame section is securable to the PCB above at least a part of the surface device; the cover is locatable on the frame section with the device mounted to the cover; and the cover is shaped to allow a feature on the bottom of the device to extend downward towards an interior cavity of the frame.

Abstract translation: 本发明提供了一种用于将设备安装在电子设备中的印刷电路板（PCB）上方的框架。 框架包括：框架部分，其形成为围绕PCB的一部分上的表面装置定位在PCB上; 以及用于放置在框架部分的顶部上并用于为该装置提供支撑基板的盖。 在框架中，框架部分可以在表面装置的至少一部分上方安装到PCB上; 该盖可定位在框架部分上，该装置安装在该盖上; 并且盖被成形为允许装置的底部上的特征向下延伸到框架的内部空腔。

公开(公告)号：US20090175013A1

公开(公告)日：2009-07-09

申请号：US12404705

申请日：2009-03-16

Applicant: Jason Everette HAMILTON ,  Tim Kyowski

Inventor： Jason Everette HAMILTON ,  Tim Kyowski

IPC: H05K1/18

CPC classification number: H05K7/1417 ,  H04M1/026 ,  H05K1/141 ,  H05K2201/10083 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10515 ,  Y10T29/49002

Abstract: The invention provides a system of components in an electronic device. The system comprises: a printed circuit board (PCB); a first component mounted to the PCB; a cap located about the first component, the cap having an arm extending outwardly from a body of the cap; a second component; and a platform for the second component.

Abstract translation: 本发明提供一种电子设备中的组件系统。 该系统包括：印刷电路板（PCB）; 安装在PCB上的第一个部件; 围绕第一部件设置的盖，帽具有从盖的主体向外延伸的臂; 第二个组成部分 和第二个组件的平台。

公开(公告)号：US07535726B2

公开(公告)日：2009-05-19

申请号：US11369855

申请日：2006-03-08

Applicant: Jason Everette Hamilton ,  Tim Kyowski

Inventor： Jason Everette Hamilton ,  Tim Kyowski

IPC: H05K7/00

CPC classification number: H05K7/1417 ,  H04M1/026 ,  H05K1/141 ,  H05K2201/10083 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10515 ,  Y10T29/49002

Abstract: The invention provides a system of components in an electronic device. The system comprises: a PCB; a first component mounted to the PCB; a cap located about the first component; a second component; and a platform for the second component. In the system, the platform and the cap cooperate with alignment features such that the platform may be placed on top of the cap at a predetermined location utilizing the alignment features. The invention also provides a method for assembling the device.

Abstract translation: 本发明提供一种电子设备中的组件系统。 该系统包括：一个PCB; 安装在PCB上的第一个部件; 位于第一组件周围的帽; 第二个组成部分 和第二个组件的平台。 在该系统中，平台和盖配合对准特征，使得平台可以利用对准特征在预定位置放置在盖的顶部上。 本发明还提供了一种组装该装置的方法。

公开(公告)号：US20080158804A1

公开(公告)日：2008-07-03

申请号：US12049854

申请日：2008-03-17

Applicant: Chao CHEN ,  Tim Kyowski ,  Jason Griffin

Inventor： Chao CHEN ,  Tim Kyowski ,  Jason Griffin

IPC: H05K7/00

CPC classification number: G06F1/1637 ,  H04M1/0266 ,  H05K7/1427

Abstract: The disclosure describes a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The frame comprises: a frame section formed to be located on the PCB about a surface device on a section of the PCB; and a cover for placement on top of the frame section and for providing a support substrate for the device. In the frame, the frame section is securable to the PCB above at least a part of the surface device; the cover is locatable on the frame section with the device mounted to the cover; and the cover is shaped to allow a feature on the bottom of the device to extend downward towards an interior cavity of the frame.

Abstract translation: 本公开描述了一种用于将设备安装在电子设备中的印刷电路板（PCB）上方的框架。 框架包括：框架部分，其形成为围绕PCB的一部分上的表面装置定位在PCB上; 以及用于放置在框架部分的顶部上并用于为该装置提供支撑基板的盖。 在框架中，框架部分可以在表面装置的至少一部分上方安装到PCB上; 该盖可定位在框架部分上，该装置安装在该盖上; 并且盖被成形为允许装置的底部上的特征向下延伸到框架的内部空腔。

公开(公告)号：US07362585B2

公开(公告)日：2008-04-22

申请号：US11055083

申请日：2005-02-11

Applicant: Chao Chen ,  Tim Kyowski ,  Jason Griffin

Inventor： Chao Chen ,  Tim Kyowski ,  Jason Griffin

IPC: H05K7/00

CPC classification number: G06F1/1637 ,  H04M1/0266 ,  H05K7/1427

Abstract: The invention provides a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The frame comprises: a frame section formed to be located on the PCB about a surface device on a section of the PCB; and a cover for placement on top of the frame section and for providing a support substrate for the device. In the frame, the frame section is securable to the PCB above at least a part of the surface device; the cover is locatable on the frame section with the device mounted to the cover; and the cover is shaped to allow a feature on the bottom of the device to extend downward towards an interior cavity of the frame.

Abstract translation: 本发明提供了一种用于将设备安装在电子设备中的印刷电路板（PCB）上方的框架。 框架包括：框架部分，其形成为围绕PCB的一部分上的表面装置定位在PCB上; 以及用于放置在框架部分的顶部上并用于为该装置提供支撑基板的盖。 在框架中，框架部分可以在表面装置的至少一部分上方安装到PCB上; 该盖可定位在框架部分上，该装置安装在该盖上; 并且盖被成形为允许装置的底部上的特征向下延伸到框架的内部空腔。