公开(公告)号：US07566961B2

公开(公告)日：2009-07-28

申请号：US11609840

申请日：2006-12-12

Applicant: Yeoung-Jun Cho

Inventor： Yeoung-Jun Cho

IPC: H01L23/02

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0002 ,  H05K2201/0379 ,  H05K2201/10515 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00

Abstract: A multi-stacked package includes a first package, a second package and a combining member. The second package supports the first package, and is electrically connected to the first package and has at least one joint hole. The combining member extends from the first package to below the second package to pass through the joint hole so that the combining member is partially exposed to improve the coherence between the first package and the second package.

Abstract translation: 多层堆叠包括第一包装，第二包装和组合部件。 第二包装件支撑第一包装，并且电连接到第一包装并且具有至少一个接合孔。 组合构件从第一包装延伸到第二包装下方以通过接合孔，使得组合构件部分地露出以改善第一包装和第二包装之间的相干性。

公开(公告)号：US08692133B2

公开(公告)日：2014-04-08

申请号：US12659435

申请日：2010-03-09

Applicant: Yeoung-Jun Cho

Inventor： Yeoung-Jun Cho

IPC: H05K1/11 ,  H05K1/09 ,  H05K1/16 ,  H05K7/00 ,  H05K7/10 ,  H05K9/00

CPC classification number: H01L23/49838 ,  H01L23/50 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/15173 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided is a semiconductor package. The semiconductor package includes an insulation substrate with top and bottom surfaces. The semiconductor package further includes a circuit pattern on the top surface. The circuit pattern includes a first signal conductive pattern and first and second ground conductive patterns. The semiconductor package includes a first insulation film covering the first signal conductive pattern and exposing a first portion of the first ground conductive pattern and a portion of the second ground conductive pattern. The semiconductor package further includes a first conductive member on the first signal conductive pattern and the first and second ground conductive patterns. The first conductive member electrically connects the first and second ground conductive patterns by covering a portion of the first insulation film and coming in contact with the first portion of the first ground conductive pattern and the portion of the second ground conductive pattern.

Abstract translation: 提供半导体封装。 半导体封装包括具有顶表面和底表面的绝缘衬底。 半导体封装还包括顶表面上的电路图案。 电路图案包括第一信号导电图案和第一和第二接地导电图案。 半导体封装包括覆盖第一信号导电图案并暴露第一接地导电图案的第一部分和第二接地导电图案的一部分的第一绝缘膜。 半导体封装还包括在第一信号导电图案上的第一导电构件和第一和第二接地导电图案。 第一导电构件通过覆盖第一绝缘膜的一部分并与第一接地导电图案的第一部分和第二接地导电图案的部分接触而电连接第一和第二接地导电图案。

公开(公告)号：US20100238638A1

公开(公告)日：2010-09-23

申请号：US12659435

申请日：2010-03-09

Applicant: Yeoung-Jun Cho

Inventor： Yeoung-Jun Cho

IPC: H05K1/18

CPC classification number: H01L23/49838 ,  H01L23/50 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/15173 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided is a semiconductor package. The semiconductor package includes an insulation substrate with top and bottom surfaces. The semiconductor package further includes a circuit pattern on the top surface. The circuit pattern includes a first signal conductive pattern and first and second ground conductive patterns. The semiconductor package includes a first insulation film covering the first signal conductive pattern and exposing a first portion of the first ground conductive pattern and a portion of the second ground conductive pattern. The semiconductor package further includes a first conductive member on the first signal conductive pattern and the first and second ground conductive patterns. The first conductive member electrically connects the first and second ground conductive patterns by covering a portion of the first insulation film and coming in contact with the first portion of the first ground conductive pattern and the portion of the second ground conductive pattern.

Abstract translation: 提供半导体封装。 半导体封装包括具有顶表面和底表面的绝缘衬底。 半导体封装还包括顶表面上的电路图案。 电路图案包括第一信号导电图案和第一和第二接地导电图案。 半导体封装包括覆盖第一信号导电图案并暴露第一接地导电图案的第一部分和第二接地导电图案的一部分的第一绝缘膜。 半导体封装还包括在第一信号导电图案上的第一导电构件和第一和第二接地导电图案。 第一导电构件通过覆盖第一绝缘膜的一部分并与第一接地导电图案的第一部分和第二接地导电图案的部分接触而电连接第一和第二接地导电图案。

公开(公告)号：US20070138631A1

公开(公告)日：2007-06-21

申请号：US11609840

申请日：2006-12-12

Applicant: Yeoung-Jun CHO

Inventor： Yeoung-Jun CHO

IPC: H01L23/34

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0002 ,  H05K2201/0379 ,  H05K2201/10515 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00

Abstract: A multi-stacked package includes a first package, a second package and a combining member. The second package supports the first package, and is electrically connected to the first package and has at least one joint hole. The combining member extends from the first package to below the second package to pass through the joint hole so that the combining member is partially exposed to improve the coherence between the first package and the second package.

Abstract translation: 多堆叠包装包括第一包装，第二包装和组合部件。 第二包装件支撑第一包装，并且电连接到第一包装并且具有至少一个接合孔。 组合构件从第一包装延伸到第二包装下方以通过接合孔，使得组合构件部分地露出以改善第一包装和第二包装之间的相干性。