公开(公告)号：US20140011905A1

公开(公告)日：2014-01-09

申请号：US14006062

申请日：2012-03-19

Applicant: You-Jin Kyung ,  Hee-Jung Kim ,  Kwang-Joo Lee ,  Jung-Hak Kim

Inventor： You-Jin Kyung ,  Hee-Jung Kim ,  Kwang-Joo Lee ,  Jung-Hak Kim

IPC: H05K3/00

CPC classification number: H05K3/0076 ,  C08G73/1046 ,  C08G73/105 ,  C08L79/08 ,  C09D179/08 ,  G03F7/031 ,  G03F7/037 ,  H05K3/287

Abstract: The present invention relates to novel polyamic acid; a photosensitive resin composition satisfying excellent flexibility and low stiffness and exhibiting excellent heat resistance and plating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.

Abstract translation: 本发明涉及新型聚酰胺酸; 满足优异的柔韧性和低刚度并且显示优异的耐热性和电镀电阻的感光性树脂组合物; 由感光性树脂组合物得到的干膜; 以及包括干膜的电路板。

公开(公告)号：US20120012366A1

公开(公告)日：2012-01-19

申请号：US13243519

申请日：2011-09-23

Applicant: Kwang-Joo LEE ,  You-Jin Kyung ,  Joo-Eun Ko ,  Heon-Sik Song ,  Jung-Jin Shim ,  Hee-Jung Kim

Inventor： Kwang-Joo LEE ,  You-Jin Kyung ,  Joo-Eun Ko ,  Heon-Sik Song ,  Jung-Jin Shim ,  Hee-Jung Kim

IPC: H05K1/02 ,  G03F7/038 ,  G03F7/031 ,  C08G73/10

CPC classification number: G03F7/037 ,  C08G73/10 ,  C08L79/08 ,  G03F7/0387 ,  G03F7/0388 ,  H05K3/287

Abstract: The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition.

Abstract translation: 本发明涉及包含热聚合性或光聚合性官能团的聚酰胺酸或聚酰亚胺，包含聚酰胺酸或聚酰亚胺的感光性树脂组合物，能够提供固化膜的感光性树脂组合物，其可以用于 以高分辨率进行图案化，并且在碱性水溶液中具有优异的显影性，柔性，粘合强度，耐焊接热和耐压试验（PCT）电阻，以及由该组合物制备的干膜。

公开(公告)号：US20110200939A1

公开(公告)日：2011-08-18

申请号：US12870118

申请日：2010-08-27

Applicant: Kwang-Joo LEE ,  You-Jin KYUNG ,  Joo-Eun KO ,  Heon-Sik SONG ,  Jung-Jin SHIM ,  Hee-Jung KIM

Inventor： Kwang-Joo LEE ,  You-Jin KYUNG ,  Joo-Eun KO ,  Heon-Sik SONG ,  Jung-Jin SHIM ,  Hee-Jung KIM

IPC: G03F7/004 ,  C08F22/38 ,  C08F26/06

CPC classification number: G03F7/037 ,  C08G73/10 ,  C08L79/08 ,  G03F7/0387 ,  G03F7/0388 ,  H05K3/287

Abstract: The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition.

Abstract translation: 本发明涉及包含热聚合性或光聚合性官能团的聚酰胺酸或聚酰亚胺，包含聚酰胺酸或聚酰亚胺的感光性树脂组合物，能够提供固化膜的感光性树脂组合物，其可以用于 以高分辨率进行图案化，并且在碱性水溶液中具有优异的显影性，柔性，粘合强度，耐焊接热和耐压试验（PCT）电阻，以及由该组合物制备的干膜。

公开(公告)号：US08354219B2

公开(公告)日：2013-01-15

申请号：US13191027

申请日：2011-07-26

Applicant: Hee-Jung Kim ,  You-Jin Kyung ,  Kwang-Joo Lee

Inventor： Hee-Jung Kim ,  You-Jin Kyung ,  Kwang-Joo Lee

IPC: G03F7/038

CPC classification number: G03F7/037

Abstract: The present invention relates to a photosensitive resin composition which is developable with an alkaline aqueous solution and does not need a high temperature for curing and the like, and has all the properties suitable for use in a cover film of a printed circuit board or a laminated body for a semiconductor, and a dry film comprising the same. The photosensitive resin composition comprises (A) a polyamic acid comprising a polymer of at least one diamine compound and at least one acid dianhydride; (B) a photopolymerizable compound having at least one polymerizable ethylenic unsaturated bond in its molecule; and (C) a photoinitiator.

Abstract translation: 本发明涉及一种可用碱性水溶液显影而不需要高温固化等的感光性树脂组合物，并且具有适用于印刷电路板的覆盖膜或叠层的全部性能 半导体用主体以及包含该半导体的干膜。 感光性树脂组合物包含（A）包含至少一种二胺化合物的聚合物和至少一种酸二酐的聚酰胺酸; （B）分子中具有至少一个可聚合的烯键式不饱和键的光聚合化合物; 和（C）光引发剂。

公开(公告)号：US20110067907A1

公开(公告)日：2011-03-24

申请号：US12870116

申请日：2010-08-27

Applicant: Kwang-Joo LEE ,  Joo-Eun KO ,  Byung-Nam KIM ,  Heon-Sik SONG ,  You-Jin KYUNG ,  Hee-Jung KIM

Inventor： Kwang-Joo LEE ,  Joo-Eun KO ,  Byung-Nam KIM ,  Heon-Sik SONG ,  You-Jin KYUNG ,  Hee-Jung KIM

IPC: H05K1/02 ,  C08F2/46 ,  C08F2/50

CPC classification number: C08F2/48 ,  C08G73/1025 ,  C08K5/0025 ,  C08K5/34 ,  C08L79/08 ,  C09D4/00 ,  G03F7/037 ,  G03F7/40 ,  H05K3/287 ,  H05K2201/0154 ,  H05K2203/124

Abstract: The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be cured at a low temperature to offer process safety and work convenience, and has excellent bending resistance, soldering heat resistance, and a property of filling the pattern, as well as excellent heat resistance and mechanical properties.

Abstract translation: 本发明提供一种感光性树脂组合物，其包含：包含特定重复单元的聚酰胺酸; 杂环胺化合物; 一种（甲基）丙烯酸酯类化合物，包括一个或多个碳原子之间的双键; 光引发剂; 和有机溶剂，以及由其制备的干膜。 感光性树脂组合物可以在低温下固化，提供工艺安全性和工作便利性，并且具有优异的耐弯曲性，耐焊接性，以及填充图案的性能，以及优异的耐热性和机械性能。

公开(公告)号：US20100113640A1

公开(公告)日：2010-05-06

申请号：US12451505

申请日：2008-08-20

Applicant: Kwang-Joo Lee ,  Heon-Sik Song ,  You-Jin Kyung ,  Joo-Eun Ko ,  Jung-Il Yoon ,  Jung-Jin Shim

Inventor： Kwang-Joo Lee ,  Heon-Sik Song ,  You-Jin Kyung ,  Joo-Eun Ko ,  Jung-Il Yoon ,  Jung-Jin Shim

IPC: C08L33/10

CPC classification number: G03F7/037 ,  G03F7/027 ,  H05K3/287 ,  H05K3/4676

Abstract: The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate-based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus-based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.

Abstract translation: 本发明涉及能够由碱水溶液显影的聚酰亚胺感光性树脂组合物及其制造的干膜，更具体地说，涉及包含a）聚酰胺酸，b ）两种或更多种（甲基）丙烯酸酯类化合物，其包括碳之间的一个或多个双键，c）光聚合引发剂，d）磷系阻燃剂，和e）有机溶剂，以及制备的干膜 同样的

公开(公告)号：US07709153B2

公开(公告)日：2010-05-04

申请号：US12247014

申请日：2008-10-07

Applicant: Seung-Jin Lee ,  Hyang-Mok Lee ,  Soon-Ho Ahn ,  Jin-Yeon Cho ,  Hyun-Hang Yong ,  Hyung-Keun Lee ,  Sang-Young Lee ,  Heon-Sik Song ,  Soon-Yong Park ,  You-Jin Kyung ,  Byeong-In Ahn

Inventor： Seung-Jin Lee ,  Hyang-Mok Lee ,  Soon-Ho Ahn ,  Jin-Yeon Cho ,  Hyun-Hang Yong ,  Hyung-Keun Lee ,  Sang-Young Lee ,  Heon-Sik Song ,  Soon-Yong Park ,  You-Jin Kyung ,  Byeong-In Ahn

IPC: H01M10/40 ,  H01M2/16

CPC classification number: B01D67/009 ,  B01D67/0027 ,  B01D67/0083 ,  B01D69/12 ,  B01D69/148 ,  B01D71/26 ,  B01D71/76 ,  B01D2323/34 ,  B01D2325/20 ,  B01D2325/26 ,  H01M2/145 ,  H01M2/1653 ,  H01M2/1686 ,  H01M6/181 ,  H01M10/0525 ,  H01M10/0565

Abstract: The present invention provides a multi-component composite film comprising a) polymer support layer; and b) porous gellable polymer layer which is formed on one side or both sides of the support layer of a), wherein the support film of a) and the gellable polymer layer of b) are unified without the interface, a method for preparing the same, and a polymer electrolyte system applied the same.

Abstract translation: 本发明提供一种多组分复合膜，其包含：a）聚合物载体层; 和b）形成在a）的支撑层的一侧或两侧的多孔可凝胶聚合物层，其中a）的支撑膜和b）的可凝胶聚合物层在没有界面的情况下是统一的，制备方法 相同，并且使用它们的聚合物电解质体系。

公开(公告)号：US07470488B2

公开(公告)日：2008-12-30

申请号：US10110047

申请日：2001-08-11

Applicant: Seung-Jin Lee ,  Hyang-Mok Lee ,  Soon-Ho Ahn ,  Jin-Yeon Cho ,  Hyun-Hang Yong ,  Hyung-Keun Lee ,  Sang-Young Lee ,  Heon-Sik Song ,  Soon-Yong Park ,  You-Jin Kyung ,  Byeong-In Ahn

Inventor： Seung-Jin Lee ,  Hyang-Mok Lee ,  Soon-Ho Ahn ,  Jin-Yeon Cho ,  Hyun-Hang Yong ,  Hyung-Keun Lee ,  Sang-Young Lee ,  Heon-Sik Song ,  Soon-Yong Park ,  You-Jin Kyung ,  Byeong-In Ahn

IPC: H01M10/40 ,  H01M2/16

CPC classification number: B01D67/009 ,  B01D67/0027 ,  B01D67/0083 ,  B01D69/12 ,  B01D69/148 ,  B01D71/26 ,  B01D71/76 ,  B01D2323/34 ,  B01D2325/20 ,  B01D2325/26 ,  H01M2/145 ,  H01M2/1653 ,  H01M2/1686 ,  H01M6/181 ,  H01M10/0525 ,  H01M10/0565

Abstract: The present invention provides a multi-component composite film comprising a) polymer support layer; and b) porous gellable polymer layer which is formed on one side or both sides of the support layer of a), wherein the support film of a) and the gellable polymer layer of b) are unified without the interface, a method for preparing the same, and a polymer electrolyte system applied the same.

Abstract translation: 本发明提供一种多组分复合膜，其包含：a）聚合物载体层; 和b）形成在a）的支撑层的一侧或两侧的多孔可凝胶聚合物层，其中a）的支撑膜和b）的可凝胶聚合物层在没有界面的情况下是统一的，制备方法 相同，并且使用它们的聚合物电解质体系。

公开(公告)号：US20070042202A1

公开(公告)日：2007-02-22

申请号：US10550582

申请日：2004-03-25

Applicant: Soon-yong Park ,  You-jin Kyung ,  Heon-sik Song ,  Byeong-in Ahn ,  Joo-eun Ko ,  Yong-jun Park ,  Se-myung Jang

Inventor： Soon-yong Park ,  You-jin Kyung ,  Heon-sik Song ,  Byeong-in Ahn ,  Joo-eun Ko ,  Yong-jun Park ,  Se-myung Jang

IPC: B32B15/08

CPC classification number: B32B15/08 ,  B32B27/08 ,  B32B27/281 ,  B32B2307/308 ,  B32B2307/734 ,  B32B2457/08 ,  H05K1/0346 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/068 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5×10-6 to 2.5×10-5/iÉ and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.

Abstract translation: 本发明涉及一种用于印刷电路板的双面金属层压板及其制造方法。 一侧包含金属层的双面金属层压体，用于提高与金属的粘合性的聚酰亚胺树脂层，热膨胀系数为5×10 -6〜2.5×10 -5的低膨胀性聚酰亚胺树脂层 另一侧的金属层具有优异的柔软性和耐热性，可以防止卷曲并且可靠地层压，特别是不使用粘合剂。 因此，适用于小型电器的印刷电路板。

公开(公告)号：US06830849B2

公开(公告)日：2004-12-14

申请号：US09936007

申请日：2001-09-07

Applicant: Sang-Young Lee ,  Byeong-In Ahn ,  Sung-Gap Im ,  Soon-Yong Park ,  Heon-Sik Song ,  You-Jin Kyung

Inventor： Sang-Young Lee ,  Byeong-In Ahn ,  Sung-Gap Im ,  Soon-Yong Park ,  Heon-Sik Song ,  You-Jin Kyung

IPC: H01M216

CPC classification number: H01M2/1653 ,  B01D39/16 ,  B01D67/0027 ,  B01D71/26 ,  B01D2325/20 ,  B01D2325/32 ,  B29C55/005 ,  B29C55/065 ,  B29K2023/12 ,  B29K2105/04 ,  H01M2/145 ,  H01M10/052 ,  Y10T428/249958

Abstract: The present invention relates to a high crystalline polypropylene microporous membrane and a preparation method of the same, and it provides a preparation method of a polypropylene microporous membrane comprising the steps of preparing a precursor film using high crystalline polypropylene having a crystallinity of 50% or more and a very high isotacticity, annealing, stretching at a low temperature, stretching at a high temperature, and heat setting, and a polypropylene microporous membrane having superior permeability and mechanical properties prepared by the preparation method.

Abstract translation: 本发明涉及一种高结晶聚丙烯微孔膜及其制备方法，其提供了一种聚丙烯微孔膜的制备方法，其包括以下步骤：使用结晶度为50％以上的高结晶性聚丙烯制备前体膜 和非常高的全同立构规整度，退火，低温拉伸，高温拉伸和热定型，以及通过制备方法制备的具有优异的渗透性和机械性能的聚丙烯微孔膜。