公开(公告)号：US20220169568A1

公开(公告)日：2022-06-02

申请号：US17671672

申请日：2022-02-15

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： DanLi Wang

IPC: C04B26/06 ,  C04B14/22 ,  C04B14/30 ,  C04B16/06 ,  C04B24/28 ,  C04B26/02 ,  C04B26/22 ,  C04B26/28

Abstract: A wall compound for use in all applications and particularly well-suited for joining adjacent wallboards. The compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit at least one of yield stress and pseudoplastic-type behavior. In some embodiments, the compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the wall compound includes one or more associative thickeners.

公开(公告)号：US20200290927A1

公开(公告)日：2020-09-17

申请号：US16641210

申请日：2018-08-22

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： DanLi Wang

IPC: C04B26/06 ,  C04B26/02 ,  C04B24/28 ,  C04B26/22 ,  C04B26/28 ,  C04B16/06 ,  C04B14/22 ,  C04B14/30

Abstract: A wall compound for use in all applications and particularly well-suited for joining adjacent wallboards. The compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit at least one of yield stress and pseudoplastic-type behavior. In some embodiments, the compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the wall compound includes one or more associative thickeners.

公开(公告)号：US10323161B2

公开(公告)日：2019-06-18

申请号：US15511023

申请日：2015-09-11

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Justin A. Riddle ,  Adam J. Meuler ,  DanLi Wang ,  Zachary J. Malmberg ,  Syud M. Ahmed ,  Paul B. Armstrong ,  Milind B. Sabade

IPC: B05D7/14 ,  C09D183/08 ,  C08G77/28 ,  C08G77/30 ,  C08L83/06 ,  C08L83/08 ,  C08G77/26

Abstract: The present disclosure is directed to compositions and methods for coating, particularly protecting and optionally cleaning, metallic surfaces, and articles containing such surfaces.

公开(公告)号：US20180179109A1

公开(公告)日：2018-06-28

申请号：US15312317

申请日：2015-06-10

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： John E. Gozum ,  DanLi Wang ,  Dwight B. Schoenherr

IPC: C04B26/06 ,  C09D133/08 ,  B29C73/02 ,  E04G23/02

CPC classification number: C04B26/06 ,  B29C73/02 ,  B29K2033/04 ,  B29K2509/08 ,  C04B26/026 ,  C04B26/04 ,  C04B26/28 ,  C04B2103/0065 ,  C04B2103/44 ,  C04B2111/29 ,  C04B2111/72 ,  C08K7/02 ,  C08K7/28 ,  C09D133/08 ,  E04F21/06 ,  E04G23/02 ,  E04G23/0203 ,  Y02W30/97 ,  C04B14/24 ,  C04B20/0048 ,  C04B2103/54 ,  C04B2103/67 ,  C04B14/305 ,  C04B20/0052 ,  C04B24/32 ,  C04B16/0625 ,  C04B18/24 ,  C04B24/2623 ,  C04B24/2641 ,  C04B24/2652 ,  C04B24/383 ,  C04B24/38

Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

公开(公告)号：US20170275495A1

公开(公告)日：2017-09-28

申请号：US15511023

申请日：2015-09-11

Applicant: 3M Innovative Properties Company

Inventor： Justin A. Riddle ,  Adam J. Meuler ,  DanLi Wang ,  Zachary J. Malmberg ,  Syud M. Ahmed ,  Paul B. Armstrong ,  Milind B. Sabade

IPC: C09D183/08 ,  C08G77/28 ,  C08G77/30 ,  C08L83/06 ,  C08L83/08

CPC classification number: C09D183/08 ,  C08G77/26 ,  C08G77/28 ,  C08G77/30 ,  C08L83/06 ,  C08L83/08 ,  C08L2666/44 ,  C08L83/02

Abstract: The present disclosure is directed to compositions and methods for coating, particularly protecting and optionally cleaning, metallic surfaces, and articles containing such surfaces.

公开(公告)号：US10894742B2

公开(公告)日：2021-01-19

申请号：US16375435

申请日：2019-04-04

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： John E. Gozum ,  DanLi Wang ,  Dwight B. Schoenherr

IPC: C08K7/02 ,  C04B26/06 ,  B29C73/02 ,  C04B26/02 ,  C04B26/04 ,  C04B26/28 ,  C09D133/08 ,  C09D5/34 ,  C09D7/43 ,  C09D7/40 ,  E04G23/02 ,  C04B103/00 ,  C04B111/20 ,  C04B111/72 ,  C08K3/013 ,  B29K33/04 ,  B29K509/08 ,  C04B103/44 ,  C08K7/28 ,  E04F21/06

Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

公开(公告)号：US20190225543A1

公开(公告)日：2019-07-25

申请号：US16375435

申请日：2019-04-04

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： John E. Gozum ,  DanLi Wang ,  Dwight B. Schoenherr

IPC: C04B26/06 ,  E04G23/02 ,  B29C73/02 ,  C04B26/02 ,  C04B26/04 ,  C04B26/28 ,  C09D133/08 ,  C08K7/02

Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

公开(公告)号：US10273185B2

公开(公告)日：2019-04-30

申请号：US15312317

申请日：2015-06-10

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： John E. Gozum ,  DanLi Wang ,  Dwight B. Schoenherr

IPC: C04B26/06 ,  B29C73/02 ,  C04B26/02 ,  C04B26/04 ,  C04B26/28 ,  C09D133/08 ,  C08K7/02 ,  E04G23/02 ,  C04B103/00 ,  C04B111/20 ,  C04B111/72 ,  B29K33/04 ,  B29K509/08 ,  C04B103/44 ,  C08K7/28 ,  E04F21/06

Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

公开(公告)号：US20140130827A1

公开(公告)日：2014-05-15

申请号：US14051866

申请日：2013-10-11

Applicant: 3M Innovative Properties Company

Inventor： Perry S. Dotterman ,  John J. Dyer ,  Arthur V. Lang ,  Robert J. Maki ,  Milind B. Sabade ,  DanLi Wang

IPC: A47L13/44 ,  A47L13/16

CPC classification number: A47L13/44 ,  A47L13/16 ,  A47L13/34

Abstract: A resilient cleaning pad with a support body a portion of which is mechanically secured in a slit-like cavity of the cleaning pad.

Abstract translation: 具有支撑体的弹性清洁垫，其一部分机械地固定在清洁垫的狭缝状空腔中。

公开(公告)号：US11713278B2

公开(公告)日：2023-08-01

申请号：US17143018

申请日：2021-01-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： John E. Gozum ,  DanLi Wang ,  Dwight B. Schoenherr

IPC: C09D7/43 ,  C04B26/06 ,  B29C73/02 ,  C04B26/02 ,  C04B26/04 ,  C04B26/28 ,  C09D133/08 ,  C08K7/02 ,  C09D5/34 ,  C09D7/40 ,  E04G23/02 ,  C04B103/00 ,  C04B111/20 ,  C04B111/72 ,  C08K3/013 ,  B29K33/04 ,  B29K509/08 ,  C04B103/44 ,  C08K7/28 ,  E04F21/06

CPC classification number: C04B26/06 ,  B29C73/02 ,  C04B26/026 ,  C04B26/04 ,  C04B26/28 ,  C08K7/02 ,  C09D5/34 ,  C09D7/43 ,  C09D7/70 ,  C09D133/08 ,  E04G23/0203 ,  B29K2033/04 ,  B29K2509/08 ,  C04B2103/0065 ,  C04B2103/44 ,  C04B2111/29 ,  C04B2111/72 ,  C08K3/013 ,  C08K7/28 ,  E04F21/06 ,  E04G23/02 ,  Y02W30/91 ,  C04B26/04 ,  C04B14/24 ,  C04B20/0048 ,  C04B2103/44 ,  C04B2103/54 ,  C04B2103/67 ,  C04B26/06 ,  C04B14/24 ,  C04B14/305 ,  C04B20/0052 ,  C04B24/32 ,  C04B2103/67 ,  C04B26/28 ,  C04B14/24 ,  C04B14/305 ,  C04B16/0625 ,  C04B18/24 ,  C04B24/2623 ,  C04B2103/67 ,  C04B26/026 ,  C04B14/24 ,  C04B14/305 ,  C04B16/0625 ,  C04B18/24 ,  C04B24/2641 ,  C04B2103/67 ,  C04B26/28 ,  C04B14/24 ,  C04B14/305 ,  C04B16/0625 ,  C04B18/24 ,  C04B24/2652 ,  C04B2103/67 ,  C04B26/28 ,  C04B14/24 ,  C04B14/305 ,  C04B16/0625 ,  C04B18/24 ,  C04B24/383 ,  C04B2103/67 ,  C04B26/28 ,  C04B14/24 ,  C04B14/305 ,  C04B16/0625 ,  C04B18/24 ,  C04B24/38 ,  C04B2103/67 ,  C08K3/013 ,  C08L33/08 ,  C08K3/013 ,  C08L31/04 ,  C08K3/013 ,  C08L23/08 ,  C08K3/013 ,  C08L23/0853

Abstract: A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.