Power semiconductor device and method for manufacturing such a power semiconductor device
    1.
    发明授权
    Power semiconductor device and method for manufacturing such a power semiconductor device 有权
    功率半导体器件及其制造方法

    公开(公告)号:US08829563B2

    公开(公告)日:2014-09-09

    申请号:US13974178

    申请日:2013-08-23

    Abstract: An insulated gate bipolar device is disclosed which can include layers of different conductivity types between an emitter electrode on an emitter side and a collector electrode on a collector side in the following order: a source region of a first conductivity type, a base layer of a second conductivity type, which contacts the emitter electrode in a contact area, an enhancement layer of the first conductivity type, a floating compensation layer of the second conductivity type having a compensation layer thickness tp, a drift layer of the first conductivity type having lower doping concentration than the enhancement layer and a collector layer of the second conductivity type.

    Abstract translation: 公开了一种绝缘栅极双极器件,其可以包括以下顺序在发射极侧的发射极和集电极侧的集电极之间具有不同导电类型的层:第一导电类型的源极区域,第一导电类型的基极层 在接触区域中与发射极接触的第二导电类型,第一导电类型的增强层,具有补偿层厚度tp的第二导电类型的浮置补偿层,具有较低掺杂的第一导电类型的漂移层 浓度比增强层和第二导电类型的集电极层。

    Method and apparatus for determining an actual junction temperature of an IGBT device

    公开(公告)号:US09683898B2

    公开(公告)日:2017-06-20

    申请号:US15078588

    申请日:2016-03-23

    CPC classification number: G01K7/01

    Abstract: The present invention relates to a method for determining an actual junction temperature (Tj) and/or an actual collector current (IC) of an IGBT device, wherein the IGBT device has a main emitter (EM) and an auxiliary emitter (EA), comprising the steps of; measuring the characteristics of an emitter voltage drop (VEE′) as a difference between a main emitter voltage (VE) at the main emitter (EM) and an auxiliary emitter voltage (VE′) at the auxiliary emitter (EA) during a switching operation of the IGBT device; and determining the junction temperature and/or the collector current (IC) based on the characteristics of the emitter voltage drop (VEE′).

    POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A POWER SEMICONDUCTOR DEVICE
    4.
    发明申请
    POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A POWER SEMICONDUCTOR DEVICE 有权
    功率半导体器件及制造这种功率半导体器件的方法

    公开(公告)号:US20130334566A1

    公开(公告)日:2013-12-19

    申请号:US13974178

    申请日:2013-08-23

    Abstract: An insulated gate bipolar device is disclosed which can include layers of different conductivity types between an emitter electrode on an emitter side and a collector electrode on a collector side in the following order: a source region of a first conductivity type, a base layer of a second conductivity type, which contacts the emitter electrode in a contact area, an enhancement layer of the first conductivity type, a floating compensation layer of the second conductivity type having a compensation layer thickness tp, a drift layer of the first conductivity type having lower doping concentration than the enhancement layer and a collector layer of the second conductivity type.

    Abstract translation: 公开了一种绝缘栅极双极器件,其可以包括以下顺序在发射极侧的发射极和集电极侧的集电极之间具有不同导电类型的层:第一导电类型的源极区域,第一导电类型的基极层 在接触区域中与发射极接触的第二导电类型,第一导电类型的增强层,具有补偿层厚度tp的第二导电类型的浮置补偿层,具有较低掺杂的第一导电类型的漂移层 浓度比增强层和第二导电类型的集电极层。

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